D&R Headline News (September 2024)

Headlines for Monday Sep. 30, 2024

Top Story

Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology

Alphawave Semi has unveiled the availability of the industry’s first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe™) Die-to-Die (D2D) IP subsystem, built on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS®) advanced packaging technology.

• Qualcomm and Sequans Complete Sale of 4G IoT Technology
• Paul Williamson on Edge AI, Llama 3.2 on Arm
• Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports

Headlines for Thursday Sep. 26, 2024

Top Story

SIAE Microelettronica Selects Ensilica as Key Partner to Design ASICs for Next-Generation Telecom Equipment

SIAE MICROELETTRONICA has selected EnSilica to assist the design of Application-Specific Integrated Circuits (ASICs) for its next-generation telecommunication infrastructure products.

• Alphawave Semi Wins Fifth Consecutive TSMC OIP Ecosystem Forum Partner of the Year Award
• M31 Launches ONFi5.1 I/O IP on TSMC 5nm Process
• Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
• TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions
• Siemens extends collaboration with TSMC to advance integrated circuit and systems design
• EXTOLL collaborates with BAE Systems as a Key Partner for High-Speed SerDes IP
• eMemory Won TSMC OIP Partner of the Year Award for the Outstanding Development of its NVM IP on Advanced Nodes
• Silicon Creations Awarded TSMC's 2024 Open Innovation Platform Partner of the Year for Mixed Signal IP
• MIPI Alliance Releases A-PHY v2.0, Doubling Maximum Data Rate of Automotive SerDes Interface To Enable Emerging Vehicle Architectures
• EnSilica joins TSMC Design Center Alliance

Headlines for Wednesday Sep. 25, 2024

Top Story

Certus Semiconductor releases I/O library in TowerJazz's 65nm process

Certus is excited to announce that its 1.2V/3.3V wire-bond I/O library in TowerJazz’s 65nm process is silicon-verified, and exceeding expectations.

• Preferred Networks Inc. adopts Siemens' PowerPro software for next-generation AI chip design
• Alphawave Semi and Arm to Present on Chiplets for Architecting Next-Generation Terabit AI Networks at the TSMC OIP Ecosystem Forum North America
• Introducing a Versatile 1G Ethernet PHY IP Core with BroadR-Reach™ Technology for Automotive and Industrial Applications
• Silvaco Expands its Victory TCAD and Digital Twin Modeling Platform to Planar CMOS, FinFET and Advanced CMOS Technologies

Headlines for Tuesday Sep. 24, 2024

Top Story

Ceva and Edge Impulse Join Forces to Enable Faster, Easier Development of Edge AI Applications

Partnership enables AI developers to train, optimize and deploy embedded ML models on the Ceva-NeuPro-Nano NPU IP, pre-silicon, via Edge Impulse Platform

• GenAI v1-Q launched with 4 bits Quantization support to accelerate larger LLMs at the Edge
• GUC Announces Adoption of HBM3E IP by CSP Data Center
• Alphawave Semi and InnoLight Extend PCIe over Optics Collaboration with Demonstration of 128Gbps Gen 7.0 over Low Latency Linear Pluggable Optics at ECOC 2024
• SigmaSense Teams Up with Dolphin Design to Deliver Power Efficiency in their Advanced SDC300 Touch Controller

Headlines for Monday Sep. 23, 2024

Top Story

Comcores and Extoll successfully completed the interoperability test of Comcores JESD204C IP core and Extoll SerDes PHY

Comcores and EXTOLL have successfully performed the interoperability test of Comcores JESD204C IP with Extoll PHY.

• JEDEC® Adds to Suite of Standards Supporting Compute Express Link® (CXL®) Memory Technology with Publication of Two New Documents
• Analog Bits to Demonstrate Power Management and Embedded Clocking and High Accuracy Sensor IP at the TSMC 2024 Open Innovation Platform Ecosystem Forum
• VyperCore plans 5nm RISC-V server chip and card
• Alphawave Semi - Interim results for the six months ended 30 June 2024
• RAAAM Memory Technologies and NXP Semiconductors Announce Collaboration to Implement High Density On-Chip Memory
• Omni Design Technologies extends partnership with EnSilica and expands Swift™ Data Converter IP portfolio
• XtremeSilica Successfully Ships First SDRAM Controller for Tapeout GF40nm

Headlines for Thursday Sep. 19, 2024

Top Story

Cryptomathic and PQShield form strategic alliance to offer PQC solutions for code signing and data protection in compliance with latest NIST and CNSA recommendations

Two foremost software security experts and pioneers in cryptographic agility and post-quantum cryptography join forces to offer comprehensive, quantum-resistant software solution after new PQC standards are released by NIST

• Synopsys Enters Definitive Agreement with Keysight Technologies For Sale of Optical Solutions Group

Headlines for Wednesday Sep. 18, 2024

Top Story

RaaS, a collaborative initiative, adopted Menta's eFPGA technology for RaaS Edge Computing platform

Menta has delivered its best technology to the Research Association for Advanced Systems (RaaS).

• Alphawave Semi to Showcase Latest Advances in AI Connectivity IP at ECOC 2024
• Cadence Tensilica HiFi 5 DSPs Used in NXP's Next-Gen Audio DSP Family
• SiFive Highlights Key Inflection Points Driving RISC-V Adoption for AI and Introduces Intelligence XM Series for AI Workload Acceleration

Headlines for Tuesday Sep. 17, 2024

Top Story

Intel and AWS Expand Strategic Collaboration, Helping Advance U.S.-Based Chip Manufacturing

Intel to Produce Custom AI Fabric Chip on Intel 18A and Custom Xeon 6 Chip on Intel 3 for AWS; Multi-Year, Multi-Billion-Dollar Collaboration Accelerates Development of Chip Manufacturing in Ohio

• Joachim Kunkel Joins Arteris Board of Directors

Headlines for Monday Sep. 16, 2024

Top Story

Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar

Under the partnership agreement, Omni Design is providing custom, advanced Swift™ data converters, analog front-end (AFE), and supporting IP solutions.

• Arm Accelerates AI From Cloud to Edge With New PyTorch and ExecuTorch Integrations to Deliver Immediate Performance Improvements for Developers
• Expedera Appoints Siyad Ma as New CEO to Drive Expansion, Innovation
• intoPIX Pre-Releases New JPEG XS IP-Cores & SDK with Master and Proxy Encoding at IBC 2024
• Thalia launches AI-powered Layout Automation software with AMALIA 24.3
• The CAN XL Controller IP Core with a complete safety package is now available for immediate licensing to high-end automotive and consumer applications

Headlines for Friday Sep. 13, 2024

Top Story

Enosemi and GlobalFoundries announce the availability of silicon-validated electronic-photonic design IP available in the GF Fotonix platform

Enosemi, a silicon photonics chiplet and IP provider, announced today the availability of a portfolio of high-speed electronic and photonic design IP in the GF Fotonix(TM) IP catalog.

• Logic Design Solutions launches a new version of its NVMe HOST IP Targeting embedded recorder systems
• Arm Announces Appointment of Young Sohn to its Board of Directors

Headlines for Thursday Sep. 12, 2024

Top Story

Imagination Announces Highest Performance Automotive GPU IP with FuSa Advancement

Imagination today unveils Imagination DXS GPU, its latest automotive GPU IP for in-vehicle intelligence and interaction.

• Axiomise launches Essential Introduction to Practical Formal Verification Training
• intoPIX Launches Access Program for Titanium Viewer and Titanium Show Apps at IBC 2024 Amsterdam
• Chevin Technology, Alpha-Data & Correct Designs collaborate to deliver fast and secure data offload for NASA-JPL's Airborne Visible/Infrared Imaging Spectrometer-3 (AVIRIS-3)

Headlines for Wednesday Sep. 11, 2024

Top Story

Rivos Selects Andes NX45 for Control Functions in Upcoming High-Performance RISC-V SoC

NX45 Becomes the Only RISC-V Core to Pass Rivos’ Rigorous Verification Process After Extensive Evaluation of Leading RISC-V Cores

• Logic Fruit Launches the Advanced Kritin iXD 6U VPX Single Board Computer (SBC)
• Sondrel appoints new Head of Projects

Headlines for Tuesday Sep. 10, 2024

Top Story

Xiphera Develops Quantum-Resilient Hardware Security Solutions for Space

Xiphera announces a project for developing quantum-resilient Authenticated Boot and Hardware Root of Trust solutions for space-grade semiconductor architectures.

• Arteris Interconnect IP Selected by VeriSilicon for High-Performance SoC Design
• TSMC August 2024 Revenue Report
• Synopsys Powers World's Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
• Rambus Announces Industry-First HBM4 Controller IP to Accelerate Next-Generation AI Workloads
• intoPIX and BCnexxt Join Forces to Revolutionize Live Playout with JPEG XS Technology
• Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source Chiplets
• BrainChip Identifies Advantages to Radar and Lidar Systems Leveraging Event-Based AI
• Sondrel announces Advanced Modelling Process for AI chip designs
• EXTOLL collaborates with PsiQuantum as a Key Partner for High-Speed SerDes IP
• ZeroPoint Technologies Releases New Hardware-Accelerated Memory Optimization Solutions and Receives Industry Recognition for Innovation

Headlines for Monday Sep. 09, 2024

Top Story

Qualitas Semiconductor Enters into Landmark the World's 1st 2nm MIPI DCPHY Licensing Agreement with Leading U.S. Fabless Company

Qualitas Semiconductor announced a groundbreaking licensing agreement with a major fabless company based in the United States. This agreement highlights Qualitas' cutting-edge 2nm GAAFET MIPI DCPHY IP solutions, designed to enhance SoC(System on Chip) design architecture.

• Tenstorrent and Movellus Form Strategic Engagement for Next-Generation Chiplet-Based AI and HPC Solutions
• Semidynamics on major recruitment drive for RISC-V software engineers
• SMIC cuts capex and R&D
• Alphawave Semi "Redefines Connectivity" in AI Hardware and Edge AI Summit 2024 Presentation on Chiplet Interconnects
• T2M IP Unveils Advanced H.264 and H.265 HEVC Codec IP Cores for High-Efficiency Video Solutions

Headlines for Thursday Sep. 05, 2024

Top Story

CAST Ships I2C/SPI Controller IP Core for Easier Serial Communication

The new I2CSPI-CTRL I2C and SPI Controller/Target Controller implements the features of the de facto I2C standard and also conforms to the Philips SPI standard, all in a compact and versatile hardware controller ready for FPGAs or ASICs.

• Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year, SEMI Reports
• GUC Monthly Sales Report - August 2024
• UMC Reports Sales for August 2024
• CoreHW and Presto Engineering Announce Ground-breaking Collaboration to Advance Global Penetration of Ultra-low-power RF IoT Devices

Headlines for Wednesday Sep. 04, 2024

Top Story

SiliconAuto adopts Siemens' PAVE360 to accelerate pre-silicon ADAS SoC development

Siemens Digital Industries Software announced today that SiliconAuto has adopted PAVE360™ software to help reduce development time for its range of state-of-the-art semiconductors

• Global Semiconductor Sales Increase 18.7% Year-to-Year in July

Headlines for Tuesday Sep. 03, 2024

Top Story

Blue Cheetah Collaborates with LG to Demonstrate Successful Silicon Bring-Up of Chiplet-Based Design

Headlines for Monday Sep. 02, 2024

Top Story

Intel considers foundry split, fab cancellations

Intel is considering its strategic options around its manufacturing unit known as Intel Foundry, according to a Bloomberg report that cited unnamed sources.

• Urgent Orders Boost Wafer Foundry Utilization in Q2; Global Top 10 Foundry Revenue Grows 9.6% while VIS Climbs Two Spots, Says TrendForce
• DeepX Hints At Next-Gen AI Chips
• SiFive and Arkmicro Accelerate RISC-V Adoption in Automotive Electronics with SiFive's Automotive IP for the High-end SoC Market
• Advanced USB 3.0 IP in 22nm boasting a very low power ULP and ULL Technology Licensed to Over 10 Global Customers