D&R Headline News (October 2024)

Headlines for Thursday Oct. 31, 2024

• JEDEC Publishes LPDDR5 CAMM2 Connector Performance Standard
• Alphawave Semi Selected for AI Innovation Research Grant from UK Government's Advanced Research + Invention Agency
• Weebit Nano continuing to make progress with potential customers and qualifying its technology Moving closer to finalisation of licensing agreements Q1 FY25 Quarterly Activities Report
• PiMCHIP Deploys Ceva Sensor Hub DSP in New Edge AI SoC

Headlines for Wednesday Oct. 30, 2024

Top Story

Secure-IC obtains the first worldwide CAVP Certification of Post-Quantum Cryptography algorithms, tested by SERMA Safety & Security

Secure-IC has achieved a historical milestone by becoming the first security IP and software vendor worldwide to receive CAVP (Cryptographic Algorithm Validation Program) Hardware certification for its Post-Quantum Cryptography (PQC) algorithms.

• Siemens strengthens leadership in industrial software and AI with acquisition of Altair Engineering
• Arm's power play will backfire
• MIPI Alliance Releases Camera Security Specifications for Flexible End-to-End Protection of Automotive Image Sensor Data
• Xiphera and Crypto Quantique Announce Partnership for Quantum-Resilient Hardware Trust Engines
• Faraday Unveils HiSpeedKit™-HS Platform for High-speed Interface IP Verification in SoCs
• DENSO and U.S. Startup Quadric Sign Development License Agreement for AI Semiconductor (NPU)

Headlines for Tuesday Oct. 29, 2024

Top Story

Xylon Announces New logicBRICKS Vision AI Framework for AMD Adaptive SoCs

Xylon has introduced the logicBRICKS Vision AI Framework, designed to simplify AI development on AMD Versal™ and Zynq™ UltraScale+™ SoCs.

• Logic Fruit and ElectraIC Announce Strategic Partnership to Serve Turkish Market
• Arteris Selected by TIER IV for Intelligent Vehicles
• Rambus Reports Third Quarter 2024 Financial Results

Headlines for Monday Oct. 28, 2024

Top Story

PUFsecurity Collaborate with Arm on PSA Certified RoT Component Level 3 Certification for its Crypto Coprocessor to Provide Robust Security Subsystem Essential for the AIoT era

PUFsecurity Corporation today announces the latest collaboration with Arm regarding its Crypto Coprocessor IP solution, PUFcc. This solution has attained the SESIP Profile and passed PSA Certified™ Level 3 RoT Component.

• Cadence Reports Third Quarter 2024 Financial Results
• Gartner Forecasts Worldwide Semiconductor Revenue to Grow 14% in 2025
• Qualitas Semiconductor Expands Cutting-Edge IP Portfolio with the Successful Development of the MIPI DSI-2 TX Controller Solution
• BoS Semiconductors joins UCIe Consortium for its ADAS chiplet SoC family
• Alchip Announces Successful 2nm Test Chip Tapeout

Headlines for Friday Oct. 25, 2024

• Silvaco Inc. Achieves ISO 9001 Certification for Comprehensive Suite of TCAD, EDA, and IP Products

Headlines for Thursday Oct. 24, 2024

• Mature Process Capacity to Grow 6% in 2025; Chinese Foundries Lead Expansion
• Arm puts Qualcomm on notice of cancellation of its licence
• Intel-Samsung foundry collaboration
• SCI Semiconductor announces Global-First CHERI enabled devices and Early Access Program

Headlines for Wednesday Oct. 23, 2024

Top Story

Silicon IP Provider, Chips&Media Unveils New Multi Video Codec IP, WAVE6 Gen2+

Chips&Media (C&M) today announced the WAVE6 Gen2+ series, a new multi-standard video codec hardware IP based on the next-generation video codec IP platform WAVE6.

• GlobalFoundries and NXP to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile
• Celestial AI Acquires Rockley Photonics Patent Portfolio, Strengthening Photonic Fabric IP
• M31 Once Again Ranked Among Forbes' "Asia 200 Best Under a Billion" List

Headlines for Tuesday Oct. 22, 2024

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Andes Technology Unveils the D45-SE RISC-V Processor Targeting ASIL-D Certification

Andes Technology proudly announces the launch of its industry-leading functional safety RISC-V processor AndesCore™ D45-SE, targeting ISO 26262 ASIL-D (Automotive Safety Integrity Level D) certification.

• DeepComputing and Andes Technology Partner to Develop the World's First RISC-V AI PC with 7nm QiLai SoC, Featuring Ubuntu Desktop
• Fractile Licenses Andes Technology's RISC-V Vector Processor as It Builds Radical New Chip to Accelerate AI Inference
• Alphawave Semi Q3 2024 Trading and Business Update
• RISC-V Announces Ratification of the RVA23 Profile Standard
• Logic Fruit Technologies Welcomes Mr. Gurudutt (GD) Bansal as Senior Vice President Engineering
• VeriSilicon's DeWarp Processing IP DW200-FS achieved ISO 26262 ASIL B certification
• Logic Design Solutions launches an EXFAT IP Soft Core for NVMe Host
• MosChip Technologies joins Renesas RZ Partner Ecosystem as AI/ML Design Partner

Headlines for Monday Oct. 21, 2024

Top Story

Arteris and SiFive Deliver Pre-verified Solution for the Datacenter Market

The collaboration enables SoC designers to reduce project risk and integrate Arteris Ncore cache coherent interconnect IP and SiFive P870-D processors in large, high-performance applications.

• Andes Announces the AndesCore™ 46-Series Family and the 3rd generation Vector Processor AX46MPV with Matrix Extension
• Codasip enables secure Linux by donating CHERI RISC-V SDK to the CHERI Alliance
• Andes Announces the AndesCore™ AX66 supporting RVA23, Multi-cluster, Hypervisor and Android
• EnSilica plc - Award of £2 million Controller ASIC Design Services Contract

Headlines for Friday Oct. 18, 2024

• TSMC Reports Third Quarter EPS of NT$12.54
• The role of RISC-V in the European Processor Initiative - Interview with Roger Espasa

Headlines for Thursday Oct. 17, 2024

Top Story

EnSilica - Design and Supply contract award for a controller ASIC for automotive and industrial markets

EnSilica, a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), is pleased to announce that it has been awarded a design and supply contract for a mixed signal controller ASIC to be used in automotive and industrial motorised actuators.

• Thalia adds analog and mixed-signal IP reuse to Siemens' Cre8Ventures Digital Twin Marketplace

Headlines for Wednesday Oct. 16, 2024

Top Story

ADTechnology Partners with Arm, Samsung Foundry, and Rebellions on AI CPU Chiplet Platform

ADTechnology has announced a collaboration with Samsung Foundry, Arm, and Rebellions to develop a next-generation AI CPU chiplet platform based on chiplet technology.

• Successful tape out of Chip Interfaces' JESD204D IP by a tier 1 semiconductor company

Headlines for Tuesday Oct. 15, 2024

Top Story

Codasip unveils versatile automotive-grade embedded RISC-V core

Codasip unveils versatile automotive-grade embedded RISC-V core Codasip L730 offers a wide range of capabilities through its high configurability, optional safety mechanisms and advanced security features

• Arm Total Design Ignites Growing Ecosystem of Arm-based Silicon for a Sustainable AI Datacenter
• Arteris Network-on-Chip Tiling Innovation Accelerates Semiconductor Designs for AI Applications
• CEA-Leti Launches OpenTRNG, an Open-Source Project For True Random Number Generators Using Ring-Oscillator-Based Architectures
• Agile Analog announces MoU to support new Southern Taiwan IC Design Industry
• eMemory Join Forces with Siemens on Groundbreaking SRAM Repair Toolset: Pre-integrated Tessent MemoryBIST with NeoFuse OTP
• CAST Partners with KiviCore for Post-Quantum Cryptography
• Weebit Nano expands global sales infrastructure to support increased demand

Headlines for Monday Oct. 14, 2024

Top Story

Exclusive Interview: Antti Rauhala Discusses CoreHW's CHW3021 Radio Front-End IC

In this interview, Antti Rauhala, Vice President of Engineering at CoreHW, sheds light on CHW3021, an innovative radio front-end integrated circuit (IC). He delves into its advanced features, potential applications, and how it enhances wireless performance, energy efficiency, and cost-effectiveness across various demanding environments.

• September foundry sales: a tale of differing fortunes
• SEMIFIVE Extends Partnership with Arm to Advance AI and HPC SoC Platforms
• DisplayPort Rx PHY and Controller IP Cores in multiple Leading Technology Nodes for Next-Generation Video SoCs

Headlines for Friday Oct. 11, 2024

• SEMIFIVE Concluded Mass Production Contract for AI Chip with HyperAccel

Headlines for Thursday Oct. 10, 2024

Top Story

Crypto Quantique teams up with Attopsemi to simplify the implementation of PUF technology in MCUs and SoCs

The companies have integrated Crypto Quantique’s QDID physical unclonable function (PUF) with Attopsemi’s I-fuse® OTP technology so that PUF error correction data can be stored securely in the OTP.

• Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec's Automotive Chiplet Program
• TSMC September 2024 Revenue Report
• Intel, TSMC to detail 2nm processes at IEDM
• SensiML Expands Platform Support to Include the RISC-V Architecture

Headlines for Wednesday Oct. 09, 2024

Top Story

Deeptech Keysom completes a €4M fundraising and deploys the first "no-code" tool dedicated to the design of tailor-made processors

Keysom devoted 4 years of R&D to develop Keysom Studio, its intelligent and easy-to-use tool capable of exploring, testing, modifying and optimizing a very wide variety of complex architectures in order to arrive at a unique solution each time, entirely adapted to the customer’s needs – without the need for advanced technical skills or a team of experts.

• MIPI Alliance Announces OEM, Expanded Ecosystem Support for MIPI A-PHY Automotive SerDes Specification
• LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications

Headlines for Tuesday Oct. 08, 2024

Top Story

Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, and Kiwimoore, a global leader in AI networking full-stack interconnect products and solutions, announced today that their jointly developed 2.5D packaging platform has successfully entered the mass production stage.

• Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
• OPENEDGES Technology Achieves ISO 26262 ASIL-B Certification
• Efabless Unveils New Custom Chip Platform Designed for Edge ML Products

Headlines for Monday Oct. 07, 2024

Top Story

Xylon's Updated logiHSSL IP Core Seamlessly Connects Infineon AURIX Microcontrollers with AMD Adaptive SoCs and FPGAs

The updated logiHSSL IP Core introduces a "reduced IP configuration," supporting one HSSL target device and one streaming data channel. Based on Xylon's experience, this configuration meets the needs of the vast majority of logiHSSL IP users.

• Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports
• NVMe Updates Expand Discoverability, Security
• Boosting Efficiency and Reducing Costs: Silvaco's Approach to Semiconductor Fabrication
• Alphacore teams with Southwest Advanced Prototyping HUB at ASU to advance national security with nearly $30 million in federal funding award
• PQShield achieves first FIPS 140-3 certification
• intoPIX to Showcase Innovative Automotive Imaging Solutions at AutoSens Europe 2024
• UMC Reports Sales for September 2024
• GUC Monthly Sales Report - September 2024
• Global Semiconductor Sales Increase 20.6% Year-to-Year in August
• Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices

Headlines for Thursday Oct. 03, 2024

Top Story

Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs

Crypto Quantique has announced a collaboration with ADLINK Technology Inc., a global leader in edge computing, to simplify the secure boot process for industrial PCs (IPCs) using its QuarkLink security platform.

• Launching MosChip DigitalSky™ for Building Connected Intelligent Enterprises
• Xiphera Partners with IPro for the Israeli Chip Design Market

Headlines for Wednesday Oct. 02, 2024

Top Story

EXTOLL collaborates with Frontgrade Technologies for High-Speed SerDes IP

EXTOLL has been selected by Frontgrade Technologies, a leading provider of mission critical electronics for aerospace and defense, as a key SerDes IP block supplier for its ASIC development portfolio.

• Siemens collaborates with GlobalFoundries to certify Analog FastSPICE for the foundry's high-performance processes
• Achronix Releases Groundbreaking Speedster AC7t800 Mid-Range FPGA, Driving Innovation in AI/ML, 5G/6G and Data Center Applications

Headlines for Tuesday Oct. 01, 2024

Top Story

BrainChip Introduces Lowest-Power AI Acceleration Co-Processor

BrainChip today introduced the Akida™ Pico, the lowest power acceleration co-processor that enables the creation of very compact, ultra-low power, portable and intelligent devices for wearable and sensor integrated AI into consumer, healthcare, IoT, defense and wake-up applications.

• Comcores announces the launch of the Centralized Network Configurator for TSN-based networks
• RaiderChip brings Meta Llama 3.2 LLM HW acceleration to low cost FPGAs
• QuickLogic Delivers eFPGA IP Targeting TSMC N12e Process in Record Time
• MulticoreWare collaborates with Arm to optimize and advance x265 video encoding on AWS Graviton4