D&R Headline News (March 2025)

Headlines for Monday Mar. 31, 2025

Top Story

Intel brings 3nm production to Europe in 2025

Intel is shifting high volume production of 3nm chips to Europe at its Fab34 in Ireland later this year.

• RISC-V in Space Workshop 2025 in Gothenburg
• VeriSilicon introduces AcuityPercept: an AI-powered automatic ISP tuning system
• Avant Technology Partners with COSEDA Technologies to Enhance System-Level Software Solutions
• Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
• SEALSQ and IC'ALPS Join Forces to Advance Post-Quantum Secure ASICs for Automotive Functional Safety
• X-FAB, SMART Photonics and Epiphany Design demonstrate InP-on-Silicon design flow for next-generation optical transceivers at OFC

Headlines for Friday Mar. 28, 2025

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intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production

Leveraging intoPIX’s SMPTE ST 2110-22 JPEG XS technology, the IPX-100 now supports visually lossless video compression with imperceptible latency, making remote production over IP more efficient than ever. With selectable compression levels, users can optimize bandwidth usage while preserving image quality, allowing for seamless 4K/UHD transport over 1GbE or 10GbE networks.

Headlines for Thursday Mar. 27, 2025

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Qualcomm initiates global anti-trust complaint about Arm

Qualcomm has initiated anti-competitive complaints against Arm in the US, Korea and Europe, reports Bloomberg.

• Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
• EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
• SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
• Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
• Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design

Headlines for Wednesday Mar. 26, 2025

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intoPIX JPEG XS Cores Power Delta Video's IP Video Transmission Solutions

intoPIX has integrated its JPEG XS technology into Delta Digital Video’s 5480 Series Encoder and Decoder, enabling ultra-low latency and bandwidth-efficient IP video transmission.

• Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
• EnSilica Opens Second Brazilian Design Centre Following Multimillion Pound Design and Manufacturing Contract Win
• Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
• PolarFire® SoC FPGAs Achieve AEC-Q100 Qualification

Headlines for Tuesday Mar. 25, 2025

• Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions

Headlines for Monday Mar. 24, 2025

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EnSilica Agrees a Multimillion Pound Design and Manufacturing Services Contract

EnSilica is pleased to announce that it has been awarded a multimillion-pound design and manufacturing services contract by a well-funded pioneering optical computing systems company. The Contract includes substantial design services engagement and additional manufacturing services.

• Strategies for Addressing More Complex Custom Chip Design
• M31 Technology - AI-Powered Automotive Dual Engines and 2nm Technology Boost Revenue to Record Highs
• Brite Semiconductor Releases DDR3/4, LPDDR3/4 Combo IP
• SoCs Get a Helping Hand from AI Platform FlexGen
• Accellera Announces IEEE Standard 1801™-2024 is Available Through IEEE GET Program

Headlines for Thursday Mar. 20, 2025

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SoftBank Group to Acquire Ampere Computing

SoftBank Group Corp. today announced that it will acquire Ampere® Computing, a leading independent silicon design company, in an all-cash transaction valued at $6.5 billion.

• Zero ASIC launches world's first open standard eFPGA product
• Global Top 10 IC Design Houses See 49% YoY Growth in 2024, NVIDIA Commands Half the Market, Says TrendForce
• Omni Design Technologies Delivers Multi-Gigahertz SWIFT™ Data Converter Solutions for Satellite Communications
• Synopsys Accelerates Chip Design with NVIDIA Grace Blackwell and AI to Speed Electronic Design Automation
• Cycuity Collaborates with SiFive and BAE Systems to Demonstrate Advanced Microelectronics Design Supply Chain Security
• Menta Unveils 'Launch Pad' Low-Cost Embedded FPGA (eFPGA) Technology Access Program For Defense And Aerospace Customers

Headlines for Wednesday Mar. 19, 2025

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Sofics and Dolphin Semiconductor Announce Strategic Partnership

Sofics, a leading provider of specialty I/O and on-chip electrostatic discharge (ESD) solutions, and Dolphin Semiconductor, a leading provider of semiconductor IP solutions specializing in mixed signal IP design, today announced a strategic partnership aimed at enhancing integrated circuit (IC) designs for customers in key sectors such as IoT, wireless, and automotive.

• Comcores is now a member of the OPEN Alliance
• KiviCore and CAST Release Post-Quantum Cryptographic Key Encapsulation IP Core

Headlines for Tuesday Mar. 18, 2025

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Arteris Selected by Nextchip to Accelerate Chip Designs for Automotive Vision Technology

Arteris’ FlexNoC network-on-chip (NoC) interconnect IP with the Functional Safety option provides Nextchip with optimal flexibility and superior performance to advance automotive technology including vision-based sensing edge to central architecture for ADAS.

Headlines for Monday Mar. 17, 2025

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SerDes Hard Macro IP in GlobalFoundries 22FDX - Available For Licensing and Implementation from Global IP Core

Global IP Core Sales – The largest IP Core portfolio on the Semiconductor market in the Aerospace & Defense, Satellite Communications and Telecommunications industry is providing the SerDes Hard Macro- IP in GlobalFoundries 22FDX to suit your product needs.

• Cadence Joins Intel Foundry Accelerator Design Services Alliance
• China Bets on Homegrown Chip Tech With RISC-V Push
• The Case for Hardware-Assisted Verification in Complex SoCs
• TSMC and MediaTek Demonstrate First Integrated PMU and PA for Wireless Connectivity Products on N6RF+ Process Technology
• Andes Technology Achieves Record Annual Revenue Amid Strong AI Demand
• Automotive Ethernet PHY IP Core in 28nm with BroadR-Reach and 100BaseT1 Compatibility for Automotive Applications

Headlines for Friday Mar. 14, 2025

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InPsytech Joins Intel Foundry Accelerator IP Alliance to Boost HPC, AI, And Automotive Applications

The collaboration will bring InPsytech’s advanced IP offerings to the Intel Foundry ecosystem, enabling mutual customers to design their semiconductor products using Intel Foundry’s cutting-edge process technologies.

Headlines for Thursday Mar. 13, 2025

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Intel's New CEO Called "Strong Choice" to Respin Company

Intel’s new CEO, Lip-Bu Tan, is a good choice to turn the struggling U.S. chipmaker around, according to analysts who spoke to EE Times.

• GUC Announces Successful Launch of Industry's First 32G UCIe Silicon on TSMC 3nm and CoWoS Technology

Headlines for Wednesday Mar. 12, 2025

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CAST and Shikino High-Tech Partner to Expand Silicon IP Offerings and Market Reach

Under the partnership, CAST will promote and make available Shikino High-Tech’s IP cores worldwide, beginning with imaging and compression technologies such as JPEG-XL and potentially expanding into additional areas in the future. At the same time, Shikino High-Tech will act as CAST’s representative in Japan, helping to bring CAST’s silicon-proven IP cores to a broader range of Japanese customers.

• Omni Design Technologies Opens Austin Design Center
• Allegro DVT Acquires Vicuesoft to Build a Worldwide Leader in Video Codecs Compliance and Analysis Solutions
• Axelera AI and Kudelski IoT Partner for Next-Generation Edge Intelligent Ecosystem
• BOS Semiconductors Signed Development Contract for ADAS Chiplet SoC with an European OEM

Headlines for Tuesday Mar. 11, 2025

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Allegro DVT Launches its First AI-Based Neural Video Processing IP

Allegro DVT, a leader in video processing semiconductor solutions, is excited to announce the launch of its latest innovation, its first AI-based Neural Video Processing NVP300 IP. This groundbreaking product marks Allegro DVT’s commitment to embrace the AI revolution and push video quality to the next level, leveraging the advanced features and benefits of AI based video processing technologies.

• Kudelski IoT and u-blox collaborate to bring advanced security to autonomous driving, drones and agricultural applications
• BrainChip Demonstrates Event-based Vision at Embedded World 2025
• Arm Kleidi Arrives in Automotive Markets to Accelerate Performance for AI-based Applications
• Vector Informatik and Synopsys Announce Strategic Collaboration to Advance Software-Defined Vehicle Development
• Weebit Nano fully qualifies ReRAM module to AEC-Q100 for automotive applications
• Rambus Enhances Data Center and AI Protection with Next-Gen CryptoManager Security IP Solutions
• Crypto Quantique demonstrating device security platform that accelerates CRA-compliant development
• Qualcomm to Bolster AI and IoT Capabilities with Edge Impulse Acquisition

Headlines for Monday Mar. 10, 2025

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Imagination GPU Powers Renesas R-Car Gen 5 SoC

The IMG BXS graphics processor licensed by Renesas has the parallel processing capabilities to manage the immersive graphics and mixed criticality workloads of emerging automotive systems. It is considerably more efficient at translating its theoretical performance (TFLOPS) into real-world performance (FPS) when compared to competition solutions.

• How AI Will Define the Next Silicon Supercycle
• Logic Fruit Technologies Releases High-Speed Interface IPs Stack for Advanced Computing
• Synopsys Introduces Virtualizer Native Execution on Arm Hardware to Accelerate Software-defined Product Development
• Tenstorrent and UnsungFields Announce Strategic Technology Alliance
• Renesas and Altium Announce Introduction of Renesas 365, Powered by Altium: Groundbreaking Industry Solution for Software-Defined Products
• Veriest Strengthens its Software Domain Activities at embedded world 2025
• High-Precision 12bit ADC and 16bit ADC IP Cores Licensed to Leading Automotive Customer, Meeting Stringent Automotive Standards
• TSMC Intends to Expand Its Investment in the United States to US$165 Billion to Power the Future of AI

Headlines for Friday Mar. 07, 2025

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Baya Systems Revolutionizes AI Scale-Up and Scale-Out with NeuraScale™ Fabric

Baya Systems, a leader in high-performance semiconductor system technologies, today announced its new NeuraScale™ switch fabric technology designed to overcome critical scaling and data movement challenges in AI infrastructure that are driving advanced SoCs and emerging 3D chiplet-based designs.

• Axelera AI Secures up to €61.6 Million Grant to Develop Scalable AI Chiplet for High-Performance Computing

Headlines for Thursday Mar. 06, 2025

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EnSilica Secures €2.13 Million European Space Agency Development Contract

EnSilica, a leading chip maker of mixed signal ASICs (“Application Specific Integrated Circuits”), is pleased to announce that it has been awarded a €2.13 million development contract under the European Space Agency’s (“ESA”) Navigation Innovation and Support Programme (“NAVISP”) Element 2 (the “Project”).

• Europe takes a major step towards digital autonomy in supercomputing and AI with the launch of DARE project
• Infineon brings RISC-V to the automotive industry and is first to announce an automotive RISC-V microcontroller family
• indie Semiconductor and GlobalFoundries Announce Strategic Collaboration to Accelerate Automotive Radar Adoption
• Silvaco Expands Product Offering with Acquisition of Cadence's Process Proximity Compensation Product Line
• QuantWare raises €20 million Series A to power the world's largest quantum computers
• EMASS and Weebit Nano collaborate on ultra-low-power edge AI demonstration using ReRAM

Headlines for Wednesday Mar. 05, 2025

Top Story

Omni Design Technologies Extends Swift™ Data Converter Solutions for FR1 and FR2 5G Subsystems

Omni Design Technologies, a leading provider of high-performance, low-power Swift™ data acquisition and signal-processing solutions and Metanoia, a leading provider of 5G Radio Access Networking (RAN) solutions, partner to offer high performance ultra-low power technology for FR1 and FR2 5G systems.

• AONDevices Partners with Faraday to Enhance Production Capabilities
• MosChip® Launches MosChip DigitalSky GenAIoT™ to Accelerate the Development of Next-Gen Connected, Intelligent Products
• Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
• Pragmatic Semiconductor launches next-generation platform for mixed-signal flexible ASIC design with early-access programme
• Quintauris launches the first RISC-V profile for today's real-time automotive applications

Headlines for Tuesday Mar. 04, 2025

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Ceva Collaborates with Arm and SynaXG to Redefine Energy Efficient 5G NR Processing for Sustainable LEO Satellites and 5G-Advanced Wireless Infrastructure

Leveraging Arm Neoverse CPUs, Ceva’s Hardware Accelerated 5G NR Baseband Platform and SynaXG’s 5G NR RAN Expertise, customized baseband processing solution delivers 10X better efficiency than traditional solutions and 20X more efficient than FPGA-based alternatives

• Arm vs. Qualcomm: The Legal Tussle Continues
• Marvell Demonstrates Industry's Leading 2nm Silicon for Accelerated Infrastructure
• Semidynamics' Aliado SDK Accelerates AI Development for RISC-V with Seamless ONNX Integration
• MIPS Drives Real-Time Intelligence into Physical AI Platforms

Headlines for Monday Mar. 03, 2025

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Ceva and Sharp Collaborate on "Beyond 5G" IoT Terminals

Ceva today announced that Sharp Semiconductor Innovation Corporation (SSIC), a subsidiary of Sharp Corporation, has developed "ASUKA", a System-on-Chip (SoC) for Beyond 5G (6G) IoT terminals, based on scalable 5G modem platform IP, the Ceva-PentaG2.

• Marvell Demonstrates Industry's Leading 2nm Silicon for Accelerated Infrastructure
• intoPIX Expands its offering for Medical, Human & Machine Vision Applications with TicoRAW & JPEG-XS on Lattice Low-Power FPGAs
• CAST Releases First Commercial SNOW-V Stream Cipher IP Core
• eMemory and PUFsecurity Launch World's First PUF-Based Post-Quantum Cryptography Solution to Secure the Future of Computing
• Agile Analog extends leadership in customizable analog security IP with new clock attack monitor
• Weebit Nano - 1H FY25 financial results
• SEALSQ Enters Into Exclusive Negotiations to Acquire 100% of IC'ALPS
• GlobalFoundries and MIT Collaborate to Advance Research and Innovation on Essential Chips for AI