D&R Headline News | Most Popular | SoC News Alerts | |

Deals / Success Stories News

• Graphcore Selected 16nm FinFet ESD Solutions from Sofics for its Transformative Artificial Intelligence Processor (Tuesday Feb. 26, 2019)
  Graphcore, the technology company that has developed a completely new type of processor, the Intelligence Processing Unit (IPU), which lets artificial intelligence (AI) innovators create next generation AI applications, selected TakeCharge® technology from Sofics bvba of Belgium to protect its Colossus GC2 IPU from electrostatic discharge (ESD). Sofics is a leading semiconductor integrated circuit IP provider.
  
  
• Nurlink Launches NB-IoT and GNSS SoC Powered by CEVA-Dragonfly NB2 IP (Wednesday Feb. 20, 2019)
  NK6010 Rel.14 Cat-NB2 all-in-one SoC integrates baseband, RF FE, RF TxRx, PMU, GNSS and application processor, delivering ultra-low power, low cost cellular IoT solution compatible with all NB-IoT frequency bands and major global carriers
  
  
• Autotalks and CEVA Collaborate on World's First Global V2X Solution (Tuesday Feb. 19, 2019)
  In advance of MWC19™, CEVA and Autotalks announced today that the companies collaborated to add C-V2X Rel. 14/15 support to the CEVA-XC DSP based Autotalks chipset, making it the world's first and only available solution capable of supporting both DSRC and C-V2X direct communications.
  
  
• Andes Technology Records 1 Billion SoC Shipments in 2018 Based on Its CPU IP and 3.5 Billion Since Inception (Thursday Feb. 14, 2019)
  As the first public listed CPU IP company in Asia, specializing in low-power, high-performance 32/64-bit processor IP cores and SoC platform, Andes Technology Corporation (TWSE:6533) announced an extraordinary record of 1 billion annual SoC shipments containing its CPU IP in 2018.
  
  
• Silicon Creations' PLL Technology Contributes to the First 7nm Mass Production Mining Chip (Wednesday Feb. 13, 2019)
  Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced that its phase-locked loop (PLL) technology has been deployed in Canaan Creative’s 7nm mining chip.
  
  
• TDK-Micronas renews its trust in Dolphin Integration's RAM and ROM Silicon IPs (Monday Feb. 11, 2019)
  TDK-Micronas, a TDK group company and the most preferred partner for sensing and control, has renewed its trust in Dolphin Integration’s low power and dense RAM and ROM for its 3D Hall magnetic sensor products.
  
  
• New intoPIX FlinQ Image Technology Empowers Next Generation DM NVX Network AV (Thursday Feb. 07, 2019)
  intoPIX, the leading provider of innovative image processing and video compression technologies developed a new codec called FlinQ in partnership with Crestron, the global leader of workplace and advanced smart homes technology.
  
  
• Audinate adds intoPIX best-in-class JPEG2000 Technology to new Dante AV Product Design Suite (Wednesday Feb. 06, 2019)
  intoPIX, leading provider of innovative image processing technologies for professional media applications, announced today that Audinate, leading provider of professional digital audio networking technologies, will use intoPIX’s ProAV optimized ultra-low-latency JPEG 2000 technology within their new Dante AV Design Suite™ for use with the newly announced Dante AV Module™.
  
  
• MuxLab Leverages intoPIX's Ultra Low Latency JPEG 2000 to Manage 4K60 on 1GbE Networks (Tuesday Feb. 05, 2019)
  intoPIX announced today that MuxLab, a forerunner and manufacturer of AV over IP connectivity and distribution solutions, is adopting their JPEG 2000 Ultra Low Latency technology for future AV over IP products.
  
  
• Arteris IP FlexNoC Interconnect Used by NationalChip for Set Top Box (STB) Chips (Tuesday Feb. 05, 2019)
  Arteris IP today announced that NationalChip has successfully produced satellite and terrestrial digital TV set top box (STB) systems-on-chip (SoC) using Arteris FlexNoC interconnect IP as the on-chip communication backbone.
  
  
• FABU Technology Selects Synopsys' DesignWare IP Portfolio to Deliver Intelligence in ADAS and Autonomous Driving SoCs (Monday Feb. 04, 2019)
  Synopsys and FABU Technology Co., Ltd. today announced that FABU has selected a portfolio of silicon-proven Synopsys DesignWare® Interface, Security, ARC® EM Safety Island Processor, and Embedded Memory Test and Repair IP to deliver high-performance artificial intelligence (AI) system-on-chips (SoCs) for advanced automotive applications.
  
  
• Sital's Enhanced Reliability FPGA IP powers NASA's GEDI on board communications (Thursday Jan. 31, 2019)
  100% of GEDI internal and external MIL-STD-1553B links are implemented with the Sital BRM1553ERL FPGA IP Core. The Sital BRM1553ERL is a space grade FPGA IP core qualified by NASA and has specialized built in mechanism to handle harsh radiation environments with direct impact on electronics and memory behavior.
  
  
• GOWIN Semiconductor Licenses Intrinsic ID's BroadKey to Deliver Hardware Root of Trust for IoT Security (Thursday Jan. 24, 2019)
  GOWIN Semiconductor and Intrinsic ID today announced GOWIN has licensed Intrinsic ID’s BroadKey, an SRAM PUF-based key management system with integrated crypto libraries.
  
  
• Inomize is selected to develop and supply HP Indigo next generation ASIC for Digital Press (Wednesday Jan. 23, 2019)
  Inomize, a world leader of ASIC design services was selected by HP Indigo to develop an ASIC solution for their next generation of high-resolution industrial presses.
  
  
• Arteris IP FlexNoC Interconnect Licensed by NETINT Technologies for PCIe 4.0 Enterprise SSD Controllers (Tuesday Jan. 22, 2019)
  Arteris IP, the leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that NETINT Technologies has licensed Arteris IP FlexNoC Interconnect for use in its enterprise SSD storage system controllers with on-chip video processors.
  
  
• MorningCore Technology Licenses Flex Logix's Embedded Field-Programmable Gate Array on TSMC's 12FFC Process (Monday Jan. 21, 2019)
  Flex Logix Technologies, Inc., announced today that MorningCore Technology, a subsidiary of China telecommunications giant Datang, is licensing EFLX4K eFPGA for TSMC’s 12nm FinFET Compact technology (12FFC) process and the EFLX Compiler for programming the eFPGA.
  
  
• Arteris IP FlexNoC Interconnect Licensed by Baidu for Kunlun AI Cloud Chips for Data Center (Tuesday Jan. 15, 2019)
  Arteris IP, the leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Baidu has licensed Arteris IP FlexNoC Interconnect for use in its high-performance Kunlun AI cloud chip for data center.
  
  
• Habana Labs Achieves First-Pass Silicon Success for High-Performance AI Processor SoC Using DesignWare IP (Monday Jan. 14, 2019)
  Synopsys, Inc. (Nasdaq: SNPS) today announced that Habana Labs, Ltd. has achieved first-pass silicon success for its Goya™ inference processor system-on-chip (SoC) using DesignWare® Controller and PHY IP Solutions for PCI Express® 4.0.
  
  
• IDT Licenses Intrinsic ID's QuiddiKey Hardware Root of Trust for IoT Security (Monday Jan. 14, 2019)
  Intrinsic ID, the world’s leading provider of digital authentication technology for Internet of Things security, today announced Integrated Device Technology, Inc. (IDT), has licensed QuiddiKey, based on SRAM PUF technology, for security in its wireless charging products.
  
  
• Faraday Unveils ASIC Success in Factory Automation (Thursday Jan. 10, 2019)
  Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it has won and delivered several factory automation (FA) related ASIC projects, supporting real-time Ethernet, EtherCAT, Profibus, and PLC controllers.
  
  
• Vayyar Selects Cadence Tensilica Vision DSP for Advanced Millimeter Wave 3D Imaging Radar Solution (Tuesday Jan. 08, 2019)
  Cadence Design Systems, Inc. (NASDAQ: CDNS) and Vayyar Imaging, a global leader in 3D imaging technology, today announced that Vayyar Imaging has selected the Cadence® Tensilica® Vision DSP for its advanced millimeter wave 3D imaging solution.
  
  
• Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5.0 Dual-Mode Audio/Voice SoC (Tuesday Jan. 08, 2019)
  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Optek, a fabless semiconductor company delivering multimedia audio products, has selected the Cadence® Tensilica® HiFi 3 DSP for its latest OTK528X Bluetooth 5.0 dual-mode audio/voice system on chip (SoC).
  
  
• VeriSilicon and NXP Collaborate on Machine Learning Across Wide Range of ML-Enabled Devices (Tuesday Jan. 08, 2019)
  VeriSilicon announces the extension of its collaboration with NXP® Semiconductors N.V. (NASDAQ:NXPI) to machine learning. NXP’s upcoming i.MX products will include VeriSilicon’s Vivante intelligent pixel processing IP solution centered around the VIP Neural Network Processor Unit.
  
  
• VeriSilicon's Artificial Intelligence Processor IP Used in Next-Generation Large Screen Smart Home System-on-Chip (SoC) (Tuesday Jan. 08, 2019)
  VeriSilicon’s Vivante VIP8000/VIPNano Family Silicon-Proven AI Processor IP Brings “Smart” to the Home with its Patent-Pending Bandwidth Optimization Technology
  
  
• Nordic Semiconductor Licenses and Deploys CEVA DSP in Low Power Cellular IoT SoC (Thursday Jan. 03, 2019)
  CEVA today announced that Nordic Semiconductor has licensed and deployed CEVA DSP technology in its nRF91® System-on-Chip (SoC) for low power cellular IoT connectivity.
  
  
• Bestechnic Licenses CEVA Bluetooth 5 Dual Mode IP for its Audio Platforms (Thursday Jan. 03, 2019)
  CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, today announced that Bestechnic (BES), a leading designer and supplier of advanced audio platform SoCs, has licensed and deployed CEVA’s RivieraWaves Bluetooth IP in its latest solution targeting high-end headphones and headsets.
  
  
• Optek Licenses and Deploys CEVA Bluetooth IP in its latest Multimedia Platform (Wednesday Jan. 02, 2019)
  CEVA today announced that Optek Digital Technology Ltd. (Optek), a fabless semiconductor company of advanced multimedia SoCs, has licensed and deployed CEVA's RivieraWaves Bluetooth 5 Dual Mode IP in its latest OTK528X multimedia System-on-Chip (SoC).
  
  
• InPlay Technologies Licenses and Deploys CEVA's Bluetooth 5 Low Energy IP for Breakthrough SoC Targeting Wearable, Healthcare and Wireless IoT Markets (Thursday Dec. 27, 2018)
  CEVA today announced that InPlay Technologies Inc. (InPlay), an innovative supplier of low power wireless communication SoCs, has licensed and deployed CEVA's RivieraWaves Bluetooth Low Energy (BLE) IP in its latest SwiftRadio™ SoC, targeting a diverse range of end markets for low power wireless applications, including wearables, healthcare, industrial, VR/AR and the internet of things.
  
  
• Vidtoo Technology Licenses Codasip's Bk3 RISC-V Processor for High-Performance Computing SoC (Monday Dec. 17, 2018)
  Codasip announced today that Vidtoo Technology, a leader in semiconductor products for machine learning and high-performance computing, has selected Codasip’s Bk3 processor for future HPC chips.
  
  
• SST and SK hynix system ic Partner to Expand Availability of Embedded SuperFlash Technology (Thursday Dec. 13, 2018)
  Microchip Technology via its subsidiary Silicon Storage Technology (SST) today announced a strategic partnership with SK hynix system ic to expand the availability of SuperFlash® technology.