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• Faraday Unveils ASIC Success in Factory Automation (Thursday Jan. 10, 2019)
  Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it has won and delivered several factory automation (FA) related ASIC projects, supporting real-time Ethernet, EtherCAT, Profibus, and PLC controllers.
  
  
• Vayyar Selects Cadence Tensilica Vision DSP for Advanced Millimeter Wave 3D Imaging Radar Solution (Tuesday Jan. 08, 2019)
  Cadence Design Systems, Inc. (NASDAQ: CDNS) and Vayyar Imaging, a global leader in 3D imaging technology, today announced that Vayyar Imaging has selected the Cadence® Tensilica® Vision DSP for its advanced millimeter wave 3D imaging solution.
  
  
• Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5.0 Dual-Mode Audio/Voice SoC (Tuesday Jan. 08, 2019)
  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Optek, a fabless semiconductor company delivering multimedia audio products, has selected the Cadence® Tensilica® HiFi 3 DSP for its latest OTK528X Bluetooth 5.0 dual-mode audio/voice system on chip (SoC).
  
  
• VeriSilicon and NXP Collaborate on Machine Learning Across Wide Range of ML-Enabled Devices (Tuesday Jan. 08, 2019)
  VeriSilicon announces the extension of its collaboration with NXP® Semiconductors N.V. (NASDAQ:NXPI) to machine learning. NXP’s upcoming i.MX products will include VeriSilicon’s Vivante intelligent pixel processing IP solution centered around the VIP Neural Network Processor Unit.
  
  
• VeriSilicon's Artificial Intelligence Processor IP Used in Next-Generation Large Screen Smart Home System-on-Chip (SoC) (Tuesday Jan. 08, 2019)
  VeriSilicon’s Vivante VIP8000/VIPNano Family Silicon-Proven AI Processor IP Brings “Smart” to the Home with its Patent-Pending Bandwidth Optimization Technology
  
  
• Nordic Semiconductor Licenses and Deploys CEVA DSP in Low Power Cellular IoT SoC (Thursday Jan. 03, 2019)
  CEVA today announced that Nordic Semiconductor has licensed and deployed CEVA DSP technology in its nRF91® System-on-Chip (SoC) for low power cellular IoT connectivity.
  
  
• Bestechnic Licenses CEVA Bluetooth 5 Dual Mode IP for its Audio Platforms (Thursday Jan. 03, 2019)
  CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, today announced that Bestechnic (BES), a leading designer and supplier of advanced audio platform SoCs, has licensed and deployed CEVA’s RivieraWaves Bluetooth IP in its latest solution targeting high-end headphones and headsets.
  
  
• Optek Licenses and Deploys CEVA Bluetooth IP in its latest Multimedia Platform (Wednesday Jan. 02, 2019)
  CEVA today announced that Optek Digital Technology Ltd. (Optek), a fabless semiconductor company of advanced multimedia SoCs, has licensed and deployed CEVA's RivieraWaves Bluetooth 5 Dual Mode IP in its latest OTK528X multimedia System-on-Chip (SoC).
  
  
• InPlay Technologies Licenses and Deploys CEVA's Bluetooth 5 Low Energy IP for Breakthrough SoC Targeting Wearable, Healthcare and Wireless IoT Markets (Thursday Dec. 27, 2018)
  CEVA today announced that InPlay Technologies Inc. (InPlay), an innovative supplier of low power wireless communication SoCs, has licensed and deployed CEVA's RivieraWaves Bluetooth Low Energy (BLE) IP in its latest SwiftRadio™ SoC, targeting a diverse range of end markets for low power wireless applications, including wearables, healthcare, industrial, VR/AR and the internet of things.
  
  
• Vidtoo Technology Licenses Codasip's Bk3 RISC-V Processor for High-Performance Computing SoC (Monday Dec. 17, 2018)
  Codasip announced today that Vidtoo Technology, a leader in semiconductor products for machine learning and high-performance computing, has selected Codasip’s Bk3 processor for future HPC chips.
  
  
• SST and SK hynix system ic Partner to Expand Availability of Embedded SuperFlash Technology (Thursday Dec. 13, 2018)
  Microchip Technology via its subsidiary Silicon Storage Technology (SST) today announced a strategic partnership with SK hynix system ic to expand the availability of SuperFlash® technology.
  
  
• Siflower Produces Smart Home Access Points With Catena's Wi-Fi 11ac (WiFi-5) Front-End IP (Tuesday Dec. 11, 2018)
  Catena announces today that Shanghai SiFlower Communication Technology Co. Ltd., (SiFlower), a leading designer and supplier of advanced Smart Home platforms, has gone into production with Catena's WiFi IP integrated in its latest System-on-Chip (SoC), targeting smart home access points.
  
  
• Credo selects Moortec's In-Chip Monitoring IP to optimise performance and reliability in their latest generation of SerDes chips (Monday Dec. 10, 2018)
  Moortec, provider of complete In-Chip Monitoring PVT Subsystems announced today that Credo has utilised Moortec’s Temperature Sensor and Voltage Monitor IP to optimise performance and increase reliability in their latest generation of SerDes chips.
  
  
• Mythic Chooses Codasip to Deliver RISC-V Computing in their Revolutionary Neural Network Platform (Monday Dec. 10, 2018)
  Codasip, the leading supplier of RISC-V® embedded processor IP, announced today that Mythic, a leader in artificial intelligence (AI) computing technology, has selected Codasip’s configurable Bk5 processor and Codasip Studio for future neural networking chips.
  
  
• CEVA's Bluetooth 5 Low Energy Software and Link Layer IP Integrate with Atmosic Technologies Solutions for Battery-Free IOT Devices (Thursday Dec. 06, 2018)
  CEVA today announced that Atmosic Technologies (Atmosic™), an innovator of ultra-low-power wireless for the Internet of Things (IoT), has integrated CEVA's RivieraWaves Bluetooth 5 Low Energy (RW-BLE5) IP in its breakthrough M2 and M3 Series IoT systems-on-chip (SoCs).
  
  
• Micron Selects Rambus CryptoManager Platform for Secure Provisioning to Authenta Technology (Monday Dec. 03, 2018)
  Rambus Inc. today announced that Micron Technology, Inc. has selected the Rambus CryptoManager™ Platform for Micron’s Authenta™ secure memory product line to enable a new level of protection for the Internet of Things (IoT) devices.
  
  
• MicroBT employs Moortec's 16nm Embedded Temperature Sensor in their HPC ASIC (Thursday Nov. 29, 2018)
  Moortec, providers of complete In-Chip Monitoring PVT Subsystems today announced that Shenzhen MicroBT Electronics Technology Co., Ltd. have employed Moortec’s 16FFC Temperature Sensor IP in their latest high performance computing (HPC) ASIC.
  
  
• Tempow and CEVA Partner to Deliver Low Power, Low Latency True Wireless Stereo Technology for Bluetooth Earbuds (Wednesday Nov. 28, 2018)
  CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, along with Tempow, today unveiled a collaboration to bring next-generation True Wireless Stereo (TWS) to the Bluetooth earbud mass market.
  
  
• Argon Design licenses Argon Streams AV1 to Realtek Semiconductor (Wednesday Nov. 28, 2018)
  Argon Design Ltd, known for its award-winning family of advanced video verification solutions, has licensed Argon Streams AV1 to Realtek Semiconductor Corp.
  
  
• Sonova License and Deploy CEVA Bluetooth IP in SWORD 3.0 Wireless Chip for Hearing Aids (Tuesday Nov. 27, 2018)
  CEVA today announced that Sonova Holding AG, the world's leading provider of hearing solutions, has licensed and deployed CEVA's RivieraWaves Bluetooth IP in its latest SWORD™ 3.0 wireless chip for hearing aids and other smart hearing devices.
  
  
• OPENEDGES' Memory Subsystem IP - DDR Controller & NoC interconnect licensed for high end 4K multimedia SoC (Wednesday Nov. 21, 2018)
  OPENEDGES, the leading IP provider in the memory subsystem, announced its ORBITTM memory subsystem IP – DDR memory controller & Network on-Chip (NoC) interconnect IP has been licensed again for the leading multimedia SoC company targeting for 4K surveillance & smart networking cameras.
  
  
• PixArt Imaging selects voltage regulators IPs from Dolphin Integration for its ultra-low power MCU Sensor in 40 nm (Monday Nov. 19, 2018)
  Dolphin Integration is proud to announce that PixArt Imaging Inc., a leading provider of CMOS Optical Navigation and Smart Sensing solutions, has selected voltage regulator IPs from Dolphin Integration for its ultra-low power MCU Sensor in 40 nm uLP.
  
  
• Nexell Licenses Intrinsic ID Hardware Root of Trust for AI Application Processor (Wednesday Nov. 14, 2018)
  Nexell, a developer of systems on chip (SoC), semiconductor IP, and application processors, and Intrinsic ID, the world’s leading provider of digital authentication technology for Internet of Things security, today announced Nexell has licensed BroadKey for its push into the medical device and automotive sectors.
  
  
• Moortec's 7nm In-Chip Monitoring Subsystem IP chosen by Esperanto Technologies to optimise performance and reliability in its high-performance AI Chip (Monday Nov. 12, 2018)
  Moortec Semiconductor Ltd, providers of complete In-Chip PVT Monitoring Subsystems announced today that Esperanto Technologies have selected their complete 7nm Embedded In-Chip Monitoring Subsystem IP for Process, Voltage and Temperature Sensing to optimise performance and increase reliability for their AI Supercomputer-on-a-Chip.
  
  
• Spin Memory's MRAM Design-Enhancing Endurance Engine Licensed by Arm (Monday Nov. 12, 2018)
  The licensing agreement extends to Spin Memory’s Endurance Engine™ technology and related IP, and governs the terms on which Arm and Spin Memory will work together to create SRAM-class magnetoresistive random-access memory (MRAM) design solutions based on this proprietary technology.
  
  
• Spin Memory Teams With Applied Materials to Produce a Comprehensive Embedded MRAM Solution (Monday Nov. 12, 2018)
  Memory, Inc. (Spin Memory), the leading MRAM developer, today announced a commercial agreement with Applied Materials, Inc. (Applied) to create a comprehensive embedded MRAM solution. The solution brings together Applied’s industry-leading deposition and etch capabilities with Spin Memory’s MRAM process IP.
  
  
• Corigine and New H3C Enable Mass Deployment of High-Performance Network Routers (Tuesday Nov. 06, 2018)
  Corigine, Inc. and New H3C Group (New H3C) today announced their collaboration in launching the best-in-class network routers for broad deployments in carriers, enterprise, campus, and data center networks.
  
  
• Montage LZ Technologies Selects Rambus CryptoMedia Core to Secure Set-Top Box Chips (Friday Nov. 02, 2018)
  Today, Rambus Inc. (NASDAQ: RMBS) announced that its CryptoMedia core has been selected for integration into Montage LZ Technologies (Montage LZ) set-top box (STB) chips.
  
  
• GE Power Management licenses SoC-e wire-speed Cryptography IP for GOOSE&Sampled Values Security (Wednesday Oct. 31, 2018)
  SoC-e wire-speed crypto-IP allows a deterministic low-latency ciphering and deciphering operation of these frames supporting up-to 16 Gbps of data throughput. This IP, named SAScrypt, is implements between the equipment CPU and the Ethernet switch, even inside the SoCs devices and it performs all the the frame processing independently to the software.
  
  
• Silicon Creations' Fractional-N PLL Technology Leveraged at Israel's Bar-Ilan University SoC Lab (Monday Oct. 29, 2018)
  Silicon Creations today announced that the SoC Lab at Israel’s Bar-Ilan University as part of the HiPer Consortium project has successfully integrated Silicon Creations’ LC and ring PLLs (phase lock loop) intellectual property (IP) in its SoC1 chip implemented in TSMC 28HPC process node.