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Fabless / IDM News

• Aquantia and AptoVision Unveil First Software-Defined Video over Ethernet (SDVoE) Solution for Pro-AV Market utilizing Aquantia's FPGA Programmable PHY (Tuesday Feb. 07, 2017)
  Aquantia has partnered with AptoVision to announce the industry’s first fully integrated single-chip solution for implementing Software-Defined Video over Ethernet on 10GBASE-T infrastructure.
  
  
• Aquantia Announces the Industrys First FPGA-Programmable Multi-Gigabit Ethernet PHY Device (Monday Jan. 30, 2017)
  Aquantia today announced the AQcite product line of FPGA-programmable Multi-Gigabit Ethernet Physical Layer (PHY) devices, integrating Aquantia’s AQrate BASE-T PHY with a Xilinx® Kintex®-7 FPGA.
  
  
• Telink Semiconductor's RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR's wireless software stack (Monday Jan. 30, 2017)
  Telink Semiconductor, developer of highly integrated low power chips for Internet of Things (IoT) applications, has announced that its ZigBee RF SoC has passed the ZigBee compliant platform tests based on the latest ZigBee stack specification using DSR Corporation’s ZBOSS 3.0 ZigBee 3.0 wireless stack, and thus can start to provide a ZigBee 3.0 SDK (software development kit) to its customers.
  
  
• Spin Transfer Technologies Samples Fully Functional ST-MRAM Devices (Wednesday Jan. 25, 2017)
  Spin Transfer Technologies, Inc. (STT), a leading developer of breakthrough Orthogonal Spin Transfer Magneto-Resistive Random Access Memory technology (OST-MRAM™), today announced it has delivered samples of fully functional ST-MRAM devices to multiple customers in North America and Asia.
  
  
• BaySand enhanced MetalCopy Program to Support 14nm FPGA Transition to ASIC (Friday Jan. 13, 2017)
  BaySand is enabling 14nm and 16nm FPGA designers to efficiently convert FPGA designs to ASIC solutions. Following the new MetalCopy capabilities, companies can choose to migrate to high production volumes in short time and low risk.
  
  
• Sequans Extends Collaboration with TSMC to Develop World's first LTE-M chip for IoT (Tuesday Jan. 10, 2017)
  LTE chipmaker Sequans Communications S.A. (NYSE: SQNS) has leveraged its long-term partnership with TSMC, and TSMC’s ultra-low-power technology, to create Monarch, the world’s first commercially available and most highly optimized LTE-M chip for the Internet of Things (IoT).
  
  
• Telink Semiconductor's RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR's wireless software stack (Thursday Jan. 05, 2017)
  Telink Semiconductor, developer of highly integrated low power chips for Internet of Things (IoT) applications, has announced that its ZigBee RF SoC has passed the ZigBee compliant platform tests based on the latest ZigBee stack specification using DSR Corporation’s ZBOSS 3.0 ZigBee 3.0 wireless stack, and thus can start to provide a ZigBee 3.0 SDK (software development kit) to its customers.
  
  
• Socionext Develops New Large Scale, High Efficiency Distributed Processing Server, Fully Utilizing Multi-Core Processors (Wednesday Jan. 04, 2017)
  Socionext has developed a new high speed, low power consumption and scalable server, based on the company's multi-core processor "SC2A11" and the new high speed CPU-to-CPU communication technology.
  
  
• Genesys Logic Announces USB3.1 Gen 2 Hub Controller with Multiple Upstream Port Support and USB-C Integrated (Tuesday Jan. 03, 2017)
  Genesys Logic, Inc., a leading IC design company in mixed-signal, high-speed I/O technologies, today announced its high-performance USB 3.1 Gen 2 USB-C™ integrated SuperSpeed Plus hub controller, GL3590.
  
  
• Qualcomm Begins Commercial Sampling of World's First 10nm Server Processor and Reshapes the Future of Datacenter Computing (Thursday Dec. 08, 2016)
  Qualcomm today announced commercial sampling and conducted a live demonstration of the world’s first 10nm server processor. As the first in the Qualcomm Centriq™ product family, the Qualcomm Centriq 2400 series has up to 48-cores and is built on the most advanced 10nm FinFET process technology.
  
  
• Qualcomm and Samsung Collaborate on 10nm Process Technology For the Latest Snapdragon 835 Mobile Processor (Thursday Nov. 17, 2016)
  Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc. (QTI), and Samsung Electronics Co., Ltd., have extended their decade-long strategic foundry collaboration to manufacture Qualcomm Technologies’ latest Snapdragon premium processor, Qualcomm® Snapdragon™ 835, with Samsung’s 10-nanometer (nm) FinFET process technology.
  
  
• Socionext Announces New Low-Power, Scalable ARM-based Multi-Core Processor SoC (Monday Nov. 14, 2016)
  Socionext Inc., an emerging leader in SoC-based solutions for today’s computing needs, today introduced a new ARM®-based multi-core processor “SC2A11A”.
  
  
• Socionext Develops 4K/60p HEVC Compatible Multi-Format Codec IC (Monday Nov. 14, 2016)
  Socionext Inc., an emerging leader in advanced SoC technology for video and imaging systems, today announced the release of MB86M30, a Multi-format Codec IC capable of encoding, decoding, and transcoding of HEVC/H.265, AVC/H.264 and MPEG2 video and audio, all with a single chip.
  
  
• Analog Devices Collaborates with ARM to Improve Security and Energy Efficiency for IoT Connected Devices (Thursday Oct. 27, 2016)
  Analog Devices, Inc. (ADI) today announced it is collaborating with ARM to provide ultralow power microcontrollers (MCUs) that enable more secure and energy efficient Internet of Things (IoT) based devices.
  
  
• IDT Announces Wireless 5G Technology Solutions for Xilinx Devices (Tuesday Oct. 25, 2016)
  IDT RapidIO RXS switches, coupled with Xilinx UltraScale FPGAs, deliver the essential combination of ultra-low 100ns latency interconnect and programmable computing with application-specific accelerators needed for 4G advanced and 5G programs.
  
  
• Aquantia Announces Breakthrough 100G Technology for Hyperscale Data Centers and Cloud Computing Environments (Monday Oct. 24, 2016)
  Aquantia today unveiled QuantumStreamTM technology, a new class of high-performance connectivity architecture that has the potential to revolutionize next-generation hyperscale data centers.
  
  
• Samsung Starts Industry's First Mass Production of System-on-Chip with 10-Nanometer FinFET Technology (Monday Oct. 17, 2016)
  Samsung today announced that it has commenced mass production of System-on-Chip (SoC) products with 10-nanometer (nm) FinFET technology for which would make it first in the industry.
  
  
• Samsung Mass Produces Industry's First Application Processor for Wearable Devices Built on 14-Nanometer FinFET Technology (Tuesday Oct. 11, 2016)
  Samsung Electronics today announced that it has begun mass production of the Exynos 7 Dual 7270. It is the first mobile application processor (AP) in the industry designed specifically for wearable devices with 14-nanometer (nm) FinFET process technology
  
  
• Innosilicon A4 Dominator, World 1st 14nm Litecoin Miner in Mass Production (Monday Oct. 10, 2016)
  Innosilicon is proudly announcing the specification & availability of the exciting next generation 14nm ASIC code-named A4 Dominator. This is a full custom optimized LTC mining ASIC with a tremendous focus on efficiency and cost, providing an incredible up to 4Mhs per chip performance with as low as 1.5W/MHs efficiency in a DCDC less daisy chain configuration.
  
  
• Spin Transfer Technologies Develops 20nm Magnetic Tunnel Junction MRAM Technology at On-site R&D Fab (Wednesday Sep. 28, 2016)
  Spin Transfer Technologies, Inc. (STT), a leading developer of breakthrough Orthogonal Spin Transfer Magneto-Resistive Random Access Memory technology (OST-MRAM™), today announced it has fabricated perpendicular MRAM magnetic tunnel junctions (MTJs) as small as 20nm — among the smallest MTJs reported — at its state-of-the-art development fab at the company’s Silicon Valley headquarters.
  
  
• NXP Introduces Industry's Lowest Power ARM Cortex-A7 Based Processor to Fuel Growth of the Internet of Things (Wednesday Sep. 28, 2016)
  At NXP FTF China today, NXP Semiconductors N.V. (NASDAQ:NXPI), officially announced the i.MX 6ULL applications processor which delivers up to 30 percent more power efficiency than its nearest competitors.
  
  
• Socionext Introduces High Image Quality, H.264 Full-HD Multi-Channel Codec (Tuesday Sep. 06, 2016)
  Socionext Inc., an emerging leader in advanced SoC technology for video and imaging systems, today announced the release of SC2M15, a new codec IC designed for video transmission equipment.
  
  
• Everspin Readies Industry's First 256Mb Perpendicular Spin Torque MRAM for Production and is Now Sampling Customers (Wednesday Aug. 03, 2016)
  Everspin Technologies strengthens its leadership position in MRAM by shipping the world’s first product using perpendicular magnetic tunnel junction (pMTJ) based ST-MRAM to customers. This 256Mb DDR3 product is the highest density commercially available perpendicular ST-MRAM in the market.
  
  
• BaySand to Initiate a Unique Low Cost Multi Project Wafer (MPW) Program That Redefines the Silicon Shuttle Concept (Monday Jul. 25, 2016)
  BaySand, the leader in application configurable ASICs, announces the availability of the ASIC UltraShuttle-65, first of its class silicon MPW program that will support multiple designs customizable by 4 metal layers.
  
  
• KnuEdge Accelerates Neural Computing With Introduction of KNUPATH LambdaFabric Processor Technology (Monday Jun. 06, 2016)
  KnuEdge™ Inc., a neural technology innovation company that launched today, introduced its KNUPATH™ LambdaFabric™ processor technology enabling ground-breaking scalability, latency and workload performance in next-generation data centers.
  
  
• Cavium Announces ThunderX2, the second generation of workload optimized ARM server SoCs (Tuesday May. 31, 2016)
  Cavium, a leading provider of semiconductor products that enables intelligent processing for enterprise, cloud, data center, wired and wireless networking today announced ThunderX2™, the second generation of workload optimized ARM server SoCs.
  
  
• Imec and Holst Centre Present Multi-Standard Low-Power Wide-Area Radio Chip (Wednesday May. 25, 2016)
  The sub-GHz radio chip’s technology can serve a multitude of protocols including IEEE 802.15.4g/k, W-MBUS, KNX-RF, as well as the popular LoRa and SIGFOX networks, and future cellular IoT for applications such as smart metering, smart home, smart city and critical infrastructure monitoring.
  
  
• Innosilicon Announces that the world 1st 14nm A4 Dominator ASIC is ready for mass shipment in 2 months (Tuesday May. 24, 2016)
  Innosilicon, the global leader in Bitcoin and Litecoin ASIC solutions, proudly announces that the world 1st 14nm A4 Dominator ASIC has passed sample test and is ready for mass shipment in 2 months.
  
  
• Lattice Announces First Programmable ASSP (pASSP) Interface Bridge for Mobile Image Sensors and Displays (Monday May. 16, 2016)
  Lattice today announced the industry’s first Lattice CrossLink™ programmable bridging device that supports leading protocols for mobile image sensors and displays.
  
  
• VORAGO Technologies Announces Availability of Industry's First ARM Cortex MCUs Built for Extreme Conditions (Wednesday May. 11, 2016)
  VORAGO Technologies today announced the availability of the industry’s first ARM® Cortex® based Microcontrollers (MCUs) designed specifically for radiation and extreme temperature operation without up-screening.