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Fabless / IDM News

• GreenWaves Unveils Groundbreaking Ultra-Low Power GAP9 IoT Application Processor for the Next Wave of Intelligence at the Very Edge (Thursday Dec. 19, 2019)
  GAP9 combines architectural enhancements and an industry-leading Global Foundries 22nm FDX semiconductor process to deliver a peak cluster memory bandwidth of 41.6 GB/sec and up to 50 GOPS combined compute power at an overall power consumption of 50mW.
  
  
• MediaTek Announces Dimensity, World's Most Advanced 5G Chipset Family, & Dimensity 1000 5G SoC (Tuesday Nov. 26, 2019)
  MediaTek today unveiled Dimensity, MediaTek’s family of powerful 5G system-on-chips (SoCs) offering an unrivaled combination of connectivity, multimedia, AI and imaging innovations for premium and flagship smartphones.
  
  
• MediaTek and Intel Partner to Bring 5G Connectivity to the Next Generation of PCs (Monday Nov. 25, 2019)
  MediaTek today announced it is partnering with Intel to bring MediaTek’s new 5G modem to PCs. Through this partnership, Intel has been working with MediaTek on the 5G solution for deployment in key consumer and commercial laptop segments.
  
  
• Gyrfalcon's New Chip Raises Bar (12.6 TOPS/W) on High Performance Edge AI with Lower Power Use (Friday Nov. 15, 2019)
  Gyrfalcon Technology Inc.’s introduces its AI Accelerator Chip, the Lightspeeur® 5801, which raises the bar for high performance Edge AI with low energy use.
  
  
• Nordic Semiconductor unveils world's first dual Arm Cortex-M33 processor wireless SoC for the most demanding low power IoT applications (Thursday Nov. 14, 2019)
  The nRF5340 combines a high performance application processor with a fully programmable, ultra low power network processor, plus advanced root-of-trust and trusted execution security features, into a low power multiprotocol SoC ready for professional lighting, industrial automation, advanced wearables, and other complex IoT applications
  
  
• FlexIC Foundry enables custom flexible integrated circuit design (Thursday Nov. 14, 2019)
  PragmatIC has developed a unique, patented semiconductor device platform that provides the opportunity to invent entirely new applications for electronics: as well as being ultra-low cost, it is also ultra-thin and flexible, and can be easily combined with other thin film electronic components to create novel solutions.
  
  
• Gyrfalcon Technology and Sensory Deliver Enhanced AI Biometric Access on Edge Devices (Thursday Nov. 14, 2019)
  AI accelerator chip and technology provider Gyrfalcon Technology Inc. today announced a partnership with AI solution provider Sensory to deliver low latency, high reliability embedded, machine learning capabilities on edge devices.
  
  
• Renesas Electronics Unveils RA Family of 32-Bit Arm Cortex-M Microcontrollers with Superior Performance and Advanced Security for Intelligent IoT Applications (Wednesday Oct. 09, 2019)
  Renesas Electronics today unveiled the Renesas Advanced (RA) Family of 32-bit Arm® Cortex®-M microcontrollers (MCUs). RA MCUs deliver the ultimate combination of optimized performance, security, connectivity, peripheral IP, and easy-to-use Flexible Software Package (FSP) to address the next generation of embedded solutions.
  
  
• NXP Launches the GHz Microcontroller Era (Thursday Oct. 03, 2019)
  NXP Semiconductors N.V. today announced the i.MX RT1170 family of crossover MCUs that combines unprecedented performance, reliability, and high levels of integration to propel industrial, IoT and automotive applications.
  
  
• Adesto Reaches Shipment Milestone of One Billion Non-Volatile Memory Devices (Thursday Sep. 26, 2019)
  Adesto Technologies Corporation (NASDAQ: IOTS), a leading provider of innovative application-specific semiconductors and systems for the IoT, announced it has now shipped more than one billion units of its non-volatile memory (NVM) products.
  
  
• Kandou Announces Development of USB4 Retimer (Monday Sep. 09, 2019)
  Kandou, a global leader in ultra-low power SerDes technology, has announced development is underway for the industry’s first USB-C® multi-protocol retimer solution with USB4™ support.
  
  
• GigaDevice unveils the GD32V series with RISC-V core, in a brand new 32bit general purpose microcontroller (Tuesday Aug. 27, 2019)
  GigaDevice Semiconductor launches the world’s first open source RISC-V based GD32V series 32-bit general-purpose MCU products. GigaDevice provides a complete tool chain support from MCU chips to software libraries and development boards; therefore, creating a strong RISC-V development ecosystem.
  
  
• Adesto's FT 6050 Smart Transceiver Now Natively Supports both LonWorks and BACnet Protocols (Monday Aug. 12, 2019)
  Adesto Technologies announced that its FT 6050 Smart Transceiver system-on-chip (SoC) now natively supports LON®, LON/IP, BACnet/IP and BACnet MS/TP protocol stacks
  
  
• Kalray announces the Tape-Out of Coolidge on TSMC 16NM process technology (Thursday Aug. 01, 2019)
  Kalray today announced the tape-out of MPPA3 aka Coolidge™, its third generation of unique and patented MPPA® («Massively Parallel Processor Array») processor family, on TSMC 16nm FinFET process technology.
  
  
• Samsung Begins Mass Production of Industry's First 12Gb LPDDR5 Mobile DRAM for Premium Smartphones (Tuesday Jul. 23, 2019)
  Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first 12-gigabit (Gb) LPDDR5 mobile DRAM, which has been optimized for enabling 5G and AI features in future smartphones.
  
  
• Aspinity Enables 10x Less Power for Always-on Sensing (Wednesday Jun. 26, 2019)
  Aspinity today announced its Reconfigurable Analog Modular Processor (RAMP) platform, an ultra-low power, analog processing platform that overcomes the power and data handling challenges in battery-operated, always-on sensing devices for consumer, smart home, Internet of Things (IoT), industrial and other markets.
  
  
• Xilinx Hits Milestone with First Customer Shipments of Versal ACAP (Tuesday Jun. 18, 2019)
  Versal is the industry's first adaptive compute acceleration platform (ACAP), a revolutionary new category of heterogeneous compute devices with capabilities that far exceed those of conventional CPUs, GPUs, and FPGAs.
  
  
• Everspin Enters Pilot Production Phase for the World's First 28 nm 1 Gb STT-MRAM Component (Wednesday Jun. 12, 2019)
  Everspin Technologies today announced it has completed development activity and entered the pilot production phase of its 28 nm 1-Gigabit (Gb) Spin Torque Transfer Magnetoresistive Random Access Memory (STT-MRAM) product.
  
  
• MediaTek Unveils Groundbreaking New 5G SoC for First Wave of 5G Flagship Devices (Wednesday May. 29, 2019)
  The integrated 5G chipset, with the MediaTek Helio M70 5G modem built in, packs world-leading technology into its compact design. It includes Arm’s newest Cortex-A77 CPU, Mali-G77 GPU and MediaTek’s most advanced AI processing unit (APU) to meet the power and performance demands of 5G to deliver super fast connectivity and extreme user experiences.
  
  
• AI Chipmaker Hailo Releases Industry-Leading Deep Learning Processor (Wednesday May. 15, 2019)
  Hailo released today the Hailo-8, the world’s top performing deep learning processor. Hailo is now sampling its breakthrough chip with select partners across multiple industries, with a focus on automotive.
  
  
• ZTE Selects Intel's eASIC Devices for 5G Wireless Deployment (Wednesday May. 01, 2019)
  Intel today announced that ZTE*, a multinational telecommunications equipment and systems company, selected Intel® eASIC™ devices for its 5G wireless products*. ZTE selected Intel eASIC devices to meet the critical cost and power requirements demanded by large-scale 5G deployments.
  
  
• DynapCNN - the World's First 1M Neuron, Event-Driven Neuromorphic AI Processor for Vision Processing (Friday Apr. 12, 2019)
  Today aiCTX AG is announcing its new fully-asynchronous event-driven neuromorphic AI processor for ultra-low power, always-on, real-time applications. DynapCNN opens brand-new possibilities for dynamic vision processing, bringing event-based vision applications to power-constrained devices for the first time
  
  
• Atmosic Technologies Extends Controlled Energy Harvesting Technology to Harness Photovoltaic Power for IoT Device Connectivity (Wednesday Mar. 27, 2019)
  Atmosic™ Technologies, innovator of ultra-low-power wireless for the Internet of Things (IoT), today announced its photovoltaic-powered connectivity solution that dramatically extends the battery life of IoT devices.
  
  
• Samsung Develops Industry's First 3rd-generation 10nm-Class DRAM for Premium Memory Applications (Thursday Mar. 21, 2019)
  Samsung today announced that it has developed a 3rd-generation 10-nanometer-class (1z-nm) eight-gigabit (Gb) Double Data Rate 4 (DDR4) DRAM for the first time in the industry.
  
  
• Samsung Electronics Starts Commercial Shipment of eMRAM Product Based on 28nm FD-SOI Process (Thursday Mar. 07, 2019)
  Samsung Electronics the world leader in semiconductor technology, today announced that it has commenced mass production of its first commercial embedded magnetic random access memory (eMRAM) product based on the company’s 28-nanometer(nm) fully-depleted silicon-on-insulator (FD-SOI) process technology, called 28FDS.
  
  
• AIStorm Introduces Real-Time AI-in-Sensor Solutions for Driver Assistance, Mobile Handsets, Cameras, and IoT (Tuesday Feb. 26, 2019)
  Due to its unique charge-domain processing architecture, AIStorm can outperform digital GPU-based solutions, delivering edge-ready solutions at 5x to 10x lower cost; available today are market-ready solutions optimized for mobile handsets, IoT, and ADAS
  
  
• Syntiant Brings Speech Interfaces to the Edge With New Ultra-Low-Power Neural Decision Processors (Monday Feb. 25, 2019)
  Syntiant today introduced its Syntiant™ NDP100™ and Syntiant NDP101™ microwatt-power Neural Decision Processors™ (NDPs) for always-on voice and sensor applications at the 2019 Mobile World Congress in Barcelona, Spain.
  
  
• Qualcomm Unveils World's Most Advanced Commercial Multimode 5G Modem to Accelerate Global 5G Rollout (Tuesday Feb. 19, 2019)
  Qualcomm today announced the Snapdragon X55 5G modem, its second-generation 5G New Radio (NR) modem. Snapdragon X55 is a 7-nanometer single-chip integrated 5G to 2G multimode modem that supports 5G NR mmWave and sub-6 GHz spectrum bands with up to 7 gigabits per second (Gbps) download speeds and 3 Gbps upload speeds over 5G, and Category 22 LTE with up to 2.5 Gbps LTE download speeds.
  
  
• Renesas Electronics Develops 28nm MCU with Virtualization-Assisted Functions for Next-Generation Automotive Architectures (Tuesday Feb. 19, 2019)
  Renesas Electronics today announced the development and successful operation verification of an automotive test chip as a technological stepping stone toward the realization of next-generation automotive-control flash Microcontrollers (MCUs) employing a 28 nanometer (nm) low-power process.
  
  
• First Battery-Free Bluetooth Sticker Sensor Tag Demonstrated at NRF (Thursday Jan. 17, 2019)
  Amazon Web Services, Avery Dennison and Samsung join Wiliot’s original investor group for a $30 Million Series B Funding Round, anticipating a future where paper thin battery-free Bluetooth sensors connect people with packaging and products.