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Fabless / IDM News

• Renesas Electronics Receives USB-IF Certification for its USB 3.0-SATA3 Bridge System-on-Chip (Tuesday Dec. 06, 2011)
  Renesas Electronics today announced that its SuperSpeed USB (USB 3.0) SATA3 bridge system-on-chip (SoC), part number, µPD720230, has passed the certification testing by the USB Implementers Forum (USB-IF).
  
  
• PLX Technology Expands 10GBase-T PHY Family; Lowers Power, Cost; Adds Powerful Features (Monday Dec. 05, 2011)
  PLX Technology today announced the expansion of its TeraPHY(R) 10GBase-T PHY family with three new single-, dual- and quad-port integrated transceivers. Designed on a 40-nanometer lithography node, these devices represent the fourth generation of PLX(R) 10GBase-T PHYs and its second generation in 40nm.
  
  
• SiliconBlue Chips Selected for New Citizen Eco-Drive Watch (Monday Dec. 05, 2011)
  SiliconBlue® Technologies today announced that Citizen Watch, the largest watchmaker and a leader in advanced watch technology, has selected SiliconBlue’s iCE65L08 device to be used in their new Eco-Drive Satellite Wave watch, the world’s first light-powered GPS-synchronized watch.
  
  
• Aptina Announces Native 1080p System on Chip Solution for High Definition Video Imaging Applications (Wednesday Nov. 30, 2011)
  Aptina today announced the AS0260 SOC (system on chip) imaging solution. The 2-megapixel native 1080p SOC delivers exceptional performance, and meets strict form factor requirements (z-height less than 3.5mm) for ultra-thin, full HD video applications within the video-centric consumer electronics market.
  
  
• New Technology for Device-Level Ethernet Guarantees Reliable, Real-Time Performance Under All Network Traffic Conditions (Monday Nov. 28, 2011)
  Innovasic Semiconductor announces PriorityChannel™, a new technology for device-level Ethernet that is designed to ensure real-time Industrial Ethernet messages are always processed on-time, every time regardless of the amount or type of other network traffic.
  
  
• Renesas Electronics Corporation Expands Lineup of Ethernet PHY Chips with Two Single-Channel Industrial Ethernet PHY Chips (Thursday Nov. 24, 2011)
  Renesas Electronics today announced the availability of two single-channel Ethernet physical layer (PHY, part number µPD60610GA-GAM-AX and µPD60611GA-GAM-AX) devices for industrial communication systems.
  
  
• SMSC Launches Industry's First, Hi-Speed Inter-Chip USB 2.0 to 10/100 Ethernet Controller for Low Power Applications (Monday Nov. 21, 2011)
  SMSC today introduced its LAN9730, the industry's first fully integrated Hi-Speed Inter-Chip (HSIC) USB 2.0 to-10/100 Ethernet device.
  
  
• SMSC Announces Industry's First High Speed Inter-Chip USB 2.0 Hub for Portable Consumer Electronics Applications (Wednesday Nov. 16, 2011)
  SMSC today announced its latest advance in High Speed Inter-Chip (HSIC) USB 2.0 connectivity, the USB3503. This Hi-Speed USB Portable Hub Controller designed around the low power and low cost HSIC interface uses SMSC’s patented Inter-Chip Connectivity™ (ICC) technology to offer a compelling USB connectivity solution for portable battery powered applications.
  
  
• Quantenna Launches World's First 802.11ac Gigabit-Wireless Solution for Retail Wi-Fi Routers and Consumer Electronics (Tuesday Nov. 15, 2011)
  New 802.11ac Solution Builds on 4x4 MIMO Foundation to Enable 2 Gbps Wireless Routers; Reference Designs Available Now for Early Customer Engagements
  
  
• NXP Develops Automotive Ethernet Transceivers for In-Vehicle Networks (Monday Nov. 14, 2011)
  NXP Semiconductors today announced its engagement in automotive Ethernet as the first automotive semiconductor supplier to license Broadcom's BroadR-Reach(R) Ethernet technology for in-vehicle networking.
  
  
• Calxeda Launches the EnergyCore Processor; Delivers 10 Times the Performance for the Same Power (Wednesday Nov. 02, 2011)
  Calxeda today unveiled its ARM-based “EnergyCore” Server-on-a-Chip, which consumes as little as 1.5 watts, the industry’s first server processor to achieve this milestone.
  
  
• Triad Semiconductor Introduces Three New Configurable High Voltage Mixed Signal ASICs (Tuesday Oct. 25, 2011)
  Triad Semiconductor today announced the availability of a family of three new high-voltage via configurable arrays (VCAs). The new arrays, VCA-9, VCA-10, and VCA-11 enable the integration of high voltage analog, precision low voltage devices, digital functions and memory blocks into inexpensive single chip solutions.
  
  
• Sequans Unveils Next-Generation FDD and TDD LTE Chips and Global LTE Platforms (Thursday Oct. 20, 2011)
  Sequans today introduced three new FDD and TDD LTE baseband chips, a companion RF chip, and two new LTE platforms, supporting all global FDD and TDD LTE networks.
  
  
• Nuvoton Introduces First Audio SoC with ARM Technology (Monday Oct. 10, 2011)
  Nuvoton today introduced the ChipCorder® ISD9160 system-on-a-chip (SoC) device, the industry’s first ChipCorder to feature a 32-bit ARM® Cortex™-M0 microcontroller core.
  
  
• Quantenna Announces Strategic Partnership with Samsung Electronics to Develop Next-Generation Wireless Products (Tuesday Oct. 04, 2011)
  Quantenna Communications announced today an agreement to partner with Samsung Electronics Co., Ltd. to develop products based on Quantenna's 4x4 MIMO Wi-Fi technology.
  
  
• Adapteva Announces 28nm 64-Core Epiphany-IV Microprocessor Chip (Tuesday Oct. 04, 2011)
  Adapteva today announced the release of the fourth generation of its Epiphany multicore architecture IP -- a 28nm design with 64 independent high-performance RISC cores on a single chip.
  
  
• Ensphere's Shipments of Thunderbolt (Optical) Chips Exceeded 500k in 2011 (Monday Oct. 03, 2011)
  Ensphere Solutions today announced that the shipments of ESI-XVR10100 have exceeded 500k devices in 2011. This product is a dual 10G transceiver device targeting the optical modules intended for the optical version of Thunderbolt (previously codenamed as “Light Peak”).
  
  
• Cavium Unveils OCTEON Fusion: Industry's Most Powerful "Base Station-on-a-Chip" Family (Monday Oct. 03, 2011)
  Cavium today unveiled the OCTEON Fusion™ Family, the industry’s most powerful, small cell “Base Station-on-a-chip” family specifically designed for LTE & 3G small cell base stations, including picocell and micro base stations.
  
  
• Silicon Image Introduces New Family of MHL Transmitters with Integrated High-Speed Switch and Support for MIPI DSI Interface (Friday Sep. 30, 2011)
  Silicon Image today announced the availability of three new MHL™ (Mobile High-Definition Link) transmitters, the SiI8332 and SiI8336 supporting the MIPI DSI interface, and the SiI8334 supporting HDMI® (High-Definition Multimedia Interface).
  
  
• Samsung Develops Industry's First LPDDR3 DRAM, Using 30nm-class Process Technology (Friday Sep. 30, 2011)
  Samsung Electronics announced today that it has developed the industry’s first monolithic four gigabit (Gb) LPDDR3 (low power double-data-rate 3) memory using 30 nanometer (nm) class* technology for mobile applications such as smartphones and tablet PCs
  
  
• Renesas Electronics Announces High-Performance, High-Function Systems-on-Chip (SoC) for High-End Automotive Display Systems (Thursday Sep. 29, 2011)
  Renesas Electronics today announced the availability of the new automotive systems-on-chip (SoC), the SH7769, for high-end automotive display systems (graphics cluster, multifunction graphics display) supporting advanced human machine interfaces (HMI).
  
  
• Broadcom Announces Industry's First 40nm Single Chip HomePlug AV and IEEE 1901 Powerline Device (Tuesday Sep. 27, 2011)
  Broadcom today announced the industry's first 40nm single chip monolithic Powerline Communications (PLC) SoC that is HomePlug® AV 1.1 certified and IEEE 1901 compliant.
  
  
• World's First Via Configurable RF Receiver Introduced by Triad Semi and Kaben Wireless (Tuesday Sep. 27, 2011)
  Triad and Kaben announced the development of a programmable and via-configurable RF array (RF-VCA) for use in a wide variety of wireless applications.
  
  
• Ambarella A7L Enables the Next Generation of Digital Still Cameras With 1080p60 Fluid Motion Video (Monday Sep. 26, 2011)
  Ambarella has announced availability of the A7L system-on-chip (SoC), enabling the development of a new generation of HD video enabled Digital Still Cameras (DSCs). The A7L supports full 1080p HD H.264 video at 60 frames per second for fluid motion even during fast moving sports scenes and can capture up to thirty 16-megapixel still images per second.
  
  
• Elpida Develops Industry's First 25nm Process 4-Gigabit DDR3 SDRAM (Monday Sep. 26, 2011)
  Elpida today announced it had completed development of the industry's first 25-nm 4-gigabit DDR3 SDRAM. By using ultra-fine process technology the 4-gigabit DDR3 SDRAM becomes a more energy efficient chip and achieves higher productivity.
  
  
• NXP Unveils Industry's First Cortex-M0 Microcontrollers with Integrated Segment LCD Drivers (Monday Sep. 26, 2011)
  NXP today introduced the LPC11D00 and LPC12D00 series of microcontrollers – the first ARM® Cortex™-M0 microcontrollers with integrated segment LCD drivers, enabling high contrast and brightness in a single chip.
  
  
• TI delivers leading analog integration, best-in-class low power and floating-point performance in new Stellaris ARM Cortex-M4F microcontrollers (Monday Sep. 26, 2011)
  Texas Instruments today announced the new low power, floating-point Stellaris® Cortex™-M4F microcontroller generation. All of the new LM4Fx Stellaris microcontrollers provide floating point for performance headroom and best-in-class power consumption to address portability and power budgets.
  
  
• Inphi Delivers Industry's First 100 Gigabit Ethernet CMOS PHY Solutions for Next Generation 100G Line Cards (Tuesday Sep. 20, 2011)
  Inphi today announced the availability of the industry’s first, lowest power100 Gigabit Ethernet (GbE) CMOS PHY solutions that support the IEEE 802.3ba standard and target next generation high density 100G line cards.
  
  
• Silicon Line Announces Availability of the World's First MIPI M-PHY Optical Media Converter IC for Mobile Phones (Tuesday Sep. 20, 2011)
  Silicon Line today announced that it has brought to market the SL82027 and SL82017 optical media converter (OMC) ICs targeted at mobile and smart phones using the latest MIPI® Alliance based M-PHY standard.
  
  
• Gennum and Altera Demonstrate 4x25Gb/s ICs for Next-Generation 100Gb/s Networks (Tuesday Sep. 20, 2011)
  Gennum and Altera today announced they will demonstrate interoperability of Gennum's 25-28Gb/s PHY with Altera's 28Gb/s enabled Stratix V GT FPGA