Foundries News

• UMC announces new 22nm wafer fab in Singapore (Thursday Feb. 24, 2022)
  United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC” or “The Company”), a leading global semiconductor foundry, today announced that its Board of Directors has approved a plan to build a new advanced manufacturing facility next to its existing 300mm fab (Fab12i) in Singapore.
  
  
• Intel to Acquire Tower Semiconductor for $5.4 Billion (Tuesday Feb. 15, 2022)
  Intel Corporation (Nasdaq: INTC) and Tower Semiconductor (Nasdaq: TSEM), a leading foundry for analog semiconductor solutions, today announced a definitive agreement under which Intel will acquire Tower for $53 per share in cash, representing a total enterprise value of approximately $5.4 billion.
  
  
• Intel Foundry Services Launches Ecosystem Alliance to Accelerate Customer Innovation (Tuesday Feb. 08, 2022)
  ntel Foundry Services (IFS) today launched Accelerator, a comprehensive ecosystem alliance designed to help foundry customers smoothly bring their silicon products from idea to implementation.
  
  
• Intel Launches $1 Billion Fund to Build a Foundry Innovation Ecosystem (Tuesday Feb. 08, 2022)
  A collaboration between Intel Capital and Intel Foundry Services (IFS), the fund will prioritize investments in capabilities that accelerate foundry customers’ time to market – spanning intellectual property (IP), software tools, innovative chip architectures and advanced packaging technologies.
  
  
• Taiwan's Intellectual Property and Commercial Court Announced Its Ruling on UMC and Other Defendants with Respect to Micron Case (Thursday Jan. 27, 2022)
  Taiwan's Intellectual Property and Commercial Court today announced its ruling on UMC and other defendants with respect to the case of the violation of the Trade Secrets Act. UMC appreciates the fairness of the ruling and its basis in facts
  
  
• GlobalFoundries Announces Extension of AMD Wafer Supply Agreement to Guarantee Supply (Monday Dec. 27, 2021)
  GlobalFoundries Inc. (Nasdaq: GFS) (GF), a global leader in feature-rich semiconductor manufacturing, today announced that it hasagreed to amend its Wafer Supply Agreement (WSA) with AMD to increase the volume of chips GF will supply as well as extend the terms of the agreement to secure supply through 2025.
  
  
• TSMC Presents 2021 Excellent Performance Award to Outstanding Suppliers (Thursday Dec. 16, 2021)
  TSMC today presented its 2021 Excellent Performance Awards to show appreciation for global suppliers who helped the Company successfully expand its fabs, broaden its global footprint, and collaborated to do their part for manufacturing excellence and semiconductor industry development in the face of the continuous challenges presented by the COVID-19 pandemic.
  
  
• TSMC Introduces N4X Process (Thursday Dec. 16, 2021)
  TSMC (TWSE: 2330, NYSE: TSM) today introduced its N4X process technology, tailored for the demanding workloads of high performance computing (HPC) products. N4X is the first of TSMC’s HPC-focused technology offerings, representing ultimate performance and maximum clock frequencies in the 5-nanometer family.
  
  
• BMW Group Signs Agreement with Inova Semiconductor and GlobalFoundries to Secure Supply (Thursday Dec. 09, 2021)
  The BMW Group is exploring new ways of working with suppliers and, in the case of strategically important components, becoming more closely involved in the supplier network. To secure semiconductor supplies for the long term, the company has signed a direct supply assurance agreement with high-tech microchip developer INOVA Semiconductors and semiconductor manufacturer GlobalFoundries® (GF®).
  
  
• MediaTek and TSMC Unveil the World's First 7nm 8K Resolution Digital TV System-on-Chip (Monday Nov. 22, 2021)
  MediaTek and TSMC today unveiled the world’s first 7-nanometer 8K digital TV flagship system-on-chip (SoC), the MediaTek Pentonic 2000. Built with TSMC’s N7 advanced process technology, the MediaTek Pentonic 2000 offers unparalleled performance and power efficiency with features including powerful artificial intelligence (AI) engines, Motion Estimation and Motion Compensation (MEMC), Versatile Video Coding (VVC) decoding and picture-in-picture (PiP) technology.
  
  
• GlobalFoundries, Ford to Address Auto Chip Supply and Meet Growing Demand (Thursday Nov. 18, 2021)
  GlobalFoundries and Ford Motor Company today announced a strategic collaboration to advance semiconductor manufacturing and technology development within the United States, aiming to boost chip supplies for Ford and the U.S. automotive industry.
  
  
• Samsung and Its Foundry Partners Reveal Solutions for a Strong Design Infrastructure at 3rd SAFE Forum 2021 (Thursday Nov. 18, 2021)
  With the theme of 'Performance Platform 2.0: Innovation, Intelligence, Integration', Samsung provides a comprehensive look at design enablement solutions
  
  
• Samsung Announces Availability of Its Leading-Edge 2.5D Integration 'H-Cube' Solution for High Performance Applications (Thursday Nov. 11, 2021)
  'H-Cube' applies advanced silicon interposer technology and hybrid-substrate structure, allowing efficient integration of 6 HBMs, as well as lower cost benefit
  
  
• TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder (Tuesday Nov. 09, 2021)
  TSMC and Sony Semiconductor Solutions (“SSS”) today jointly announced that TSMC will establish a subsidiary, Japan Advanced Semiconductor Manufacturing, Inc. (“JASM”), in Kumamoto, Japan to provide foundry service with initial technology of 22/28-nanometer processes to address strong global market demand for specialty technologies, with SSS participating as a minority shareholder.
  
  
• TSMC Recognizes Partners of the Year at 2021 OIP Ecosystem Forum (Wednesday Oct. 27, 2021)
  The OIP Partner of the Year awards honor TSMC OIP ecosystem partners’ pursuit of excellence in next-generation design enablement over the past year. Their collaborative efforts effectively promote innovation in the semiconductor industry.
  
  
• TSMC Expands Advanced Technology Leadership with N4P Process (Tuesday Oct. 26, 2021)
  TSMC (TWSE: 2330, NYSE: TSM) today introduced its N4P process, a performance-focused enhancement of the 5-nanometer technology platform. N4P joins the industry’s most advanced and extensive portfolio of leading-edge technology processes.
  
  
• Samsung Foundry Innovations Power the Future of Big Data, AI/ML and Smart, Connected Devices (Thursday Oct. 07, 2021)
  Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled plans for continuous process technology migration to 3- and 2-nanometer (nm) based on the company’s Gate-All-Around (GAA) transistor structure at its 5th annual Samsung Foundry Forum (SFF) 2021.
  
  
• Marvell Extends Data Infrastructure Leadership with TSMC 3nm Platform (Wednesday Oct. 06, 2021)
  Marvell today announced it is extending its data infrastructure silicon leadership with a new advanced silicon platform based on TSMC's 3nm process technology, offering the best power, performance, and area in the industry.
  
  
• Intel Breaks Ground on Two New Leading-Edge Chip Factories in Arizona (Friday Sep. 24, 2021)
  Intel today broke ground on two new leading-edge chip factories at the company’s Ocotillo campus in Chandler, Arizona.
  
  
• GlobalFoundries Unveils Innovative Solutions that Deliver a New Era of More in Semiconductor Manufacturing (Thursday Sep. 16, 2021)
  GlobalFoundries today announced a portfolio of new features that extend its solutions roadmap and accelerate the next wave of innovation in chip design for smart mobile devices, datacenter, IoT and automotive.
  
  
• GlobalFoundries and Qualcomm Sign Agreement to Deliver Advanced 5G RF Front-End Products (Thursday Sep. 16, 2021)
  GlobalFoundries and Qualcomm announced today that they are extending their successful RF collaboration on 5G multi-Gigabit speed RF front-end products for delivering the high cellular speeds, superior coverage, and outstanding power efficiency in the sleek form factors users expect from the newest generation of 5G-enabled products.
  
  
• Elissa Murphy Joins GlobalFoundries Board (Thursday Sep. 16, 2021)
  GlobalFoundries (GF) today announced Elissa Murphy is joining the company’s board of directors with immediate effect as an independent director.
  
  
• Xenergic joins GlobalFoundries FDX Network (Friday Aug. 27, 2021)
  Xenergic announced today that they have joined the GlobalFoundries (GF) FDX Network and Design Enablement Network. Xenergic’s memory compiler for on-chip memories, MemoryTailor®, is available for GF customers in GF 22FDX® technology.
  
  
• Intel Wins US Government Project to Develop Leading-Edge Foundry Ecosystem (Wednesday Aug. 25, 2021)
  
  
  
• BAE Systems collaborates with GlobalFoundries to produce radiation-hardened single board computers for space (Monday Aug. 23, 2021)
  BAE Systems’ radiation-hardened RAD510™ System on Chip (SoC) for space-based computing is entering fabrication. Designed by BAE Systems and manufactured by GlobalFoundries® (GF®), the RAD510 SoC will be the core of a single board computer (SBC) with twice the performance capability of the industry standard RAD750® microprocessor.
  
  
• TSMC Shareholders Elect Board of Directors; Board of Directors Unanimously Re-elects Dr. Mark Liu as Chairman and Dr. C.C. Wei as CEO and Vice Chairman (Monday Jul. 26, 2021)
  TSMC Shareholders Elect Board of Directors; Board of Directors Unanimously Re-elects Dr. Mark Liu as Chairman and Dr. C.C. Wei as CEO and Vice Chairman
  
  
• GlobalFoundries Plans to Build New Fab in Upstate New York in Private-Public Partnership to Support U.S. Semiconductor Manufacturing (Tuesday Jul. 20, 2021)
  GlobalFoundries (GF), the global leader in feature-rich semiconductor manufacturing, today announced its expansion plans for its most advanced manufacturing facility in upstate New York over the coming years.
  
  
• GLOBALFOUNDRIES Breaks Ground on New Fab in Singapore (Tuesday Jun. 22, 2021)
  GLOBALFOUNDRIES® (GF®), the global leader in feature-rich semiconductor manufacturing, today announced it is expanding its global manufacturing footprint with the construction of a new fab on its Singapore campus. 
  
  
• Bosch opens wafer fab of the future in Dresden (Thursday Jun. 10, 2021)
  Fully connected, data-driven, self-optimizing: in Dresden, Bosch is opening one of the world’s most modern wafer fabs. Highly automated, fully connected machines and integrated processes, combined with methods of artificial intelligence (AI) will make the Dresden plant a smart factory and a trailblazer in Industry 4.0.
  
  
• Samsung Successfully Completes 8nm RF Solution Development to Strengthen 5G Communications Chip Solutions (Thursday Jun. 10, 2021)
  New 8nm RF chip architecture provides up to 35 percent increase in power efficiency and 35 percent decrease in logic area compared to 14nm RF