Foundries News
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ON Semiconductor and GLOBALFOUNDRIES Partner to Transfer Ownership of East Fishkill, NY 300mm Facility (Monday Apr. 22, 2019)
ON Semiconductor Corporation (Nasdaq: ON) (“ON Semiconductor”) and GLOBALFOUNDRIES today announced that they have entered into a definitive agreement for ON Semiconductor to acquire a 300mm fab located in East Fishkill, New York.
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TSMC Unveils 6-nanometer Process (Tuesday Apr. 16, 2019)
TSMC (TWSE: 2330, NYSE: TSM) today announced its 6-nanometer (N6) process, which provides a significant enhancement of its industry-leading N7 technology and offers customers a highly competitive performance-to-cost advantage as well as fast time-to-market with direct migration from N7-based designs.
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Samsung Successfully Completes 5nm EUV Development to Allow Greater Area Scaling and Ultra-low Power Benefits (Tuesday Apr. 16, 2019)
Samsung Electronics today announced that its 5-nanometer (nm) FinFET process technology is complete in its development and now is ready for customers’ samples. By adding another cutting-edge node to its extreme ultraviolet (EUV)-based process offerings, Samsung is proving once again its leadership in the advanced foundry market.
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TSMC and OIP Ecosystem Partners Deliver Industry's First Complete Design Infrastructure for 5nm Process Technology (Wednesday Apr. 03, 2019)
TSMC today announced delivery of the complete version of its 5 nanometer (nm) design infrastructure within the Open Innovation Platform® (OIP). This full release enables 5nm systems-on-chip (SoC) designs in next-generation advanced mobile and high-performance computing (HPC) applications, targeting high-growth 5G and artificial intelligence markets.
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MACOM and GLOBALFOUNDRIES Collaborate to Scale Silicon Photonics to Hyperscale Cloud Data Center and 5G Network Buildouts (Wednesday Mar. 06, 2019)
MACOM Technology Solutions Inc. (“MACOM”), and GLOBALFOUNDRIES (“GF”) today announced a strategic collaboration to ramp MACOM’s innovative Laser Photonic Integrated Circuit (L-PIC™) platform using GF’s current-generation silicon photonics offering, 90WG, to meet Data Center and 5G Telecom industry demands
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GLOBALFOUNDRIES Crosses Billion-Dollar Design Win Threshold with 8SW RF SOI Technology (Wednesday Feb. 20, 2019)
GLOBALFOUNDRIES today announced that the company’s mobile-optimized 8SW RF SOI technology platform has delivered more than a billion dollars of client design win revenue since its launch in September 2017.
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VIS To Acquire GLOBALFOUNDRIES' Fab 3E In Singapore (Thursday Jan. 31, 2019)
Vanguard International Semiconductor Corporation (VIS) and GLOBALFOUNDRIES (GF) today announced that VIS will acquire GF’s Fab 3E in Tampines, Singapore. The transaction includes buildings, facilities, and equipment, as well as IP associated with GF’s MEMS business.
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Soitec Expands Collaboration with Samsung Foundry on FD-SOI Wafer Supply (Tuesday Jan. 22, 2019)
Soitec (Euronext Paris), a world leader in designing and manufacturing innovative semiconductor materials, announced today an expanded collaboration with Samsung Foundry to ensure the volume supply of fully depleted silicon-on-insulator (FD-SOI) wafers.
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SkyWater Launches Direct Multi Project Wafer (MPW) FastShuttle Program, Expanding Capabilities to Meet Growing Customer Momentum (Monday Jan. 07, 2019)
SkyWater Technology Foundry, the industry’s most advanced U.S.-based and solely U.S.-owned Trusted Foundry, today announced its Multi Project Wafer (MPW) FastShuttle program offering customers quick and low-cost prototyping and design enablement with access to high performance processes and regularly scheduled launch dates.
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GLOBALFOUNDRIES Announces Industry's First 300mm SiGe Foundry Technology to Meet Growing Data Center and High-Speed Wireless Demands (Thursday Nov. 29, 2018)
GLOBALFOUNDRIES today announced its advanced silicon germanium (SiGe) offering, 9HP, is now available for prototyping on the company’s 300mm wafer manufacturing platform.
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GLOBALFOUNDRIES, indie Semiconductor Deliver Performance-Enhanced Microcontrollers for Automotive Applications (Thursday Nov. 15, 2018)
GLOBALFOUNDRIES and indie Semiconductor today announced the release of a new generation of customized microcontrollers on GF’s 55nm Low Power Extended (55LPx) automotive-qualified platform, which includes embedded non-volatile memory (SuperFlash®) technology.
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UMC Issues Follow-up Statement Regarding Recent Legal Developments (Friday Nov. 09, 2018)
UMC Issues Follow-up Statement Regarding Recent Legal Developments
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Samsung Complements the Production of its Revolutionary 7nm EUV with Exceptional SAFE Ecosystem Solutions (Thursday Oct. 18, 2018)
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the launch of its new commercial 7LPP, the 7-nanometer (nm) LPP (Low Power Plus) with extreme ultraviolet (EUV) lithography technology for wafer production.
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Samsung Electronics Starts Production of EUV-based 7nm LPP Process (Thursday Oct. 18, 2018)
Samsung Electronics today announced that it has completed all process technology development and has started wafer production of its revolutionary process node, 7LPP, the 7-nanometer (nm) LPP (Low Power Plus) with extreme ultraviolet (EUV) lithography technology.
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GLOBALFOUNDRIES Expands RFwave Partner Program to Speed Time-to-Market for Wireless Connectivity, Radar and 5G (Thursday Oct. 11, 2018)
GLOBALFOUNDRIES today announced the addition of nine new partners to its growing RFwave Partner Program, including AkronIC, Ask Radio, Catena, University of Waterloo Centre for Intelligent Antenna and Radio Systems (CIARS), Giga Solution, Helic, Incize, Mentor Graphics and Xpeedic Technology.
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TSMC Announces OIP Ecosystem Enabled in the Cloud (Wednesday Oct. 03, 2018)
TSMC today announced the initial availability of its Open Innovation Platform® Virtual Design Environment (OIP VDE), which enables semiconductor customers to securely design in the cloud, leveraging TSMC OIP design infrastructures within the flexibility of cloud infrastructures.
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GLOBALFOUNDRIES Delivering 8SW RF SOI Client Chips on 300mm Platform for Next-Generation Mobile Applications (Thursday Sep. 27, 2018)
GLOBALFOUNDRIES announced today at its annual Global Technology Conference (GTC), that the company’s mobile-optimized 8SW 300mm RF SOI technology platform has been qualified and is in production.
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GLOBALFOUNDRIES Extends FinFET Offering with New Features to Enable Tomorrow's Intelligent Systems (Wednesday Sep. 26, 2018)
As part of the company's new focus on intensifying investment in differentiation, GLOBALFOUNDRIES announced today at its annual Global Technology Conference (GTC), plans to introduce a full set of new technology features to its 14/12nm FinFET offering.
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GLOBALFOUNDRIES Reshapes Technology Portfolio to Intensify Focus on Growing Demand for Differentiated Offerings (Tuesday Aug. 28, 2018)
GLOBALFOUNDRIES today announced an important step in its transformation, continuing the trajectory launched with the appointment of Tom Caulfield as CEO earlier this year. In line with the strategic direction Caulfield has articulated, GF is reshaping its technology portfolio to intensify its focus on delivering truly differentiated offerings for clients in high-growth markets.
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TSMC Details Impact of Computer Virus Incident (Monday Aug. 06, 2018)
TSMC today provided an update on the Company’s computer virus outbreak on the evening of August 3, which affected a number of computer systems and fab tools in Taiwan.
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GLOBALFOUNDRIES Surpasses $2 Billion in Design Win Revenue on 22FDX Technology (Tuesday Jul. 10, 2018)
GLOBALFOUNDRIES today announced that the company’s 22nm FD-SOI (22FDX®) technology has delivered more than two billion dollars of client design win revenue.
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GLOBALFOUNDRIES to Deliver Socionext's Next Generation Graphics Controller for Advanced In-Vehicle Display Applications (Monday Jul. 02, 2018)
GLOBALFOUNDRIES today announced that Socionext Inc. will manufacture the third and latest generation of its graphics display controllers, the SC1701, on GF’s 55nm Low Power Extended (55LPx) process technology with embedded non-volatile memory (SuperFlash®).
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Shanghai Huali Microelectronics Corporation (HLMC) Announces Collaboration with Adesto and CNE around RRAM Technology for RFID, Stand Alone NVM and Microcontroller Applications (Wednesday Jun. 13, 2018)
HLMC announces it is collaborating with Adesto Technologies and Crocus Nano Electronics to develop new RFID and microcontroller (MCU) products based on Adesto’s Resistive RAM (RRAM) memory technology trademarked as Conductive Bridging RAM (CBRAM®).
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GLOBALFOUNDRIES Enters Volume Production of Ultra High Voltage Process Technology for Industrial and Power Applications (Tuesday May. 29, 2018)
GLOBALFOUNDRIES today announced that its 180nm Ultra High Voltage (180UHV) technology platform has entered volume production for a range of client applications, including AC-DC controllers for industrial power supplies, wireless charging, solid state and LED lighting, as well as AC adapters for consumer electronics and smartphones.
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Samsung Set to Power the Future of High-Performance Computing and Connected Devices with Silicon Innovation (Wednesday May. 23, 2018)
Samsung Electronics, a world leader in advanced semiconductor technology solutions, today unveiled a series of new silicon innovations at the heart of future high-performance computing and connected devices.
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GLOBALFOUNDRIES Announces Industry's Most Advanced Automotive-Qualified Production FD-SOI Process Technology (Wednesday May. 23, 2018)
GLOBALFOUNDRIES today announced that its 22nm FD-SOI (22FDX®) technology platform has been certified to AEC-Q100 Grade 2 for production.
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Arbe Robotics Selects GLOBALFOUNDRIES for its High-Resolution Imaging Radar to Enable Safety for Autonomous Cars (Friday Apr. 27, 2018)
GLOBALFOUNDRIES today announced that Arbe Robotics has selected GF’s 22FDX® process for its groundbreaking patented imaging radar that will achieve fully automated system capabilities and enable safer driving experiences for autonomous vehicles.
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GLOBALFOUNDRIES Launches RF Ecosystem Program to Accelerate Time-to-Market for Wireless Connectivity, Radar and 5G Applications (Wednesday Mar. 21, 2018)
GLOBALFOUNDRIES today announced a new ecosystem partner program, called RFwave™, designed to simplify RF design and help customers reduce time-to-market for a new era of wireless devices and networks.
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GLOBALFOUNDRIES Extends Silicon Photonics Roadmap to Meet Explosive Demand for Datacenter Connectivity (Wednesday Mar. 14, 2018)
GLOBALFOUNDRIES today revealed new details of its silicon photonics roadmap to enable the next generation of optical interconnects for datacenter and cloud applications. The company has now qualified the industry’s first 90nm manufacturing process using 300mm wafers, while also unveiling its upcoming 45nm technology to deliver even greater bandwidth and energy efficiency.
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Samsung Strengthens its Foundry Customer Support with New SAFE Foundry Ecosystem Program (Thursday Jan. 25, 2018)
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, has announced today its continued commitment to first-pass silicon success for its foundry customers’ chip designs by launching the Samsung Advanced Foundry Ecosystem (SAFETM) program.