Foundries News

• GLOBALFOUNDRIES, ON Semiconductor Deliver the Industry's Lowest Power Bluetooth Low Energy SoC Family (Tuesday Jun. 20, 2017)
  GLOBALFOUNDRIES and ON Semiconductor (Nasdaq: ON) today announced the availability of a System-on-Chip (SoC) family of devices, on GF’s 55nm Low Power Extended (55LPx), RF-enabled process technology platform.
  
  
• GLOBALFOUNDRIES on Track to Deliver Leading-Performance 7nm FinFET Technology (Tuesday Jun. 13, 2017)
  GLOBALFOUNDRIES today announced the availability of its 7nm Leading-Performance (7LP) FinFET semiconductor technology, delivering a 40 percent generational performance boost to meet the needs of applications such as premium mobile processors, cloud servers and networking infrastructure.
  
  
• GLOBALFOUNDRIES Launches 7nm ASIC Platform for Data Center, Machine Learning, and 5G Networks (Tuesday Jun. 13, 2017)
  GLOBALFOUNDRIES today announced the availability of FX-7 TM, an application-specific integrated circuit (ASIC) offering built on the company’s 7nm FinFET process technology. FX-7 is an integrated design platform that combines leading-edge manufacturing process technology with a differentiated suite of intellectual property and 2.5D/3D packaging to deliver the industry’s most complete solution for data center, machine learning, automotive, wired communications, and 5G wireless applications.
  
  
• Samsung Set to Lead the Future of Foundry with Comprehensive Process Roadmap Down to 4nm (Thursday May. 25, 2017)
  Samsung Electronics, a world leader in advanced semiconductor technology, today announced a comprehensive foundry process technology roadmap to help customers design and manufacture faster, more power efficient chips.
  
  
• GLOBALFOUNDRIES and Chengdu Partner to Expand FD-SOI Ecosystem in China (Tuesday May. 23, 2017)
  GLOBALFOUNDRIES and the Chengdu municipality today announced an investment to spur innovation in China’s semiconductor industry. The partners plan to build a world-class FD-SOI ecosystem including multiple design centers in Chengdu and university programs across China.
  
  
• Samsung Completes Qualification of its 2nd Generation 10nm Process Technology (Thursday Apr. 20, 2017)
  Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, announced today that its second generation 10-nanometer (nm) FinFET process technology, 10LPP (Low Power Plus), has been qualified and is ready for production.
  
  
• Samsung Electronics on Track for 10nm FinFET Process Technology Production Ramp-up (Thursday Mar. 16, 2017)
  Samsung Electronics announced today that its production ramp-up of the 10-nanometer (nm) FinFET process technology is on track with steady high yield to meet customer needs on schedule.
  
  
• SMIC Signs License Agreement For Invensas' DBI(R) Technology (Wednesday Mar. 15, 2017)
  SMIC has executed a technology transfer and license agreement for Invensas' Direct Bond Interconnect (DBI®) technology. Through this agreement, SMIC will be able to offer this bonding technology for use by image sensor manufacturing customers. Invensas is a wholly owned subsidiary of Xperi.
  
  
• InvenSense and GLOBALFOUNDRIES Collaborate on Industry-Leading Ultrasonic Fingerprint Imaging Technology (Tuesday Mar. 14, 2017)
  InvenSense and GLOBALFOUNDRIES today announced their collaboration on an ultrasonic fingerprint imaging technology for InvenSense UltraPrint Ultrasound Fingerprint Touch Sensor Solution.
  
  
• UMC and Synopsys Collaboration Speeds 14-nm Custom Design (Tuesday Mar. 14, 2017)
  Synopsys and UMC today announced that the two companies have worked together to enable Synopsys Custom Compiler and Laker® custom design tools to be used with UMC’s 14-nanometer (nm) FinFET process.
  
  
• UMC Enters Mass Production for 14nm Customer ICs (Thursday Feb. 23, 2017)
  United Microelectronics Corporation (NYSE:UMC;TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that it has entered mass production for customer ICs based on the company’s self-developed 14nm FinFET technology.
  
  
• GLOBALFOUNDRIES Announces Availability of 45nm RF SOI to Advance 5G Mobile Communications (Tuesday Feb. 21, 2017)
  GLOBALFOUNDRIES today announced the availability of its 45nm RF SOI (45RFSOI) technology offering, making GF the first foundry to announce an advanced, 300mm RF silicon solution to support next generation millimeter-wave (mmWave) beam forming applications in future 5G base stations and smartphones.
  
  
• Panasonic and UMC Partner for 40nm ReRAM Process Platform (Friday Feb. 03, 2017)
  Panasonic Semiconductor Solutions Co., Ltd. ("PSCS") and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, have reached an agreement to jointly develop next-generation 40nm Resistive Random Access Memory (ReRAM) technology for mass production at UMC.
  
  
• Cypress Commences Volume Shipments of MCUs Based on eCT Embedded Flash Memory Manufactured at UMC (Monday Dec. 19, 2016)
  Cypress and UMC today announced that Cypress has begun volume shipments of microcontrollers (MCUs) containing its proprietary 40nm Embedded Charge-Trap (eCTTM) Flash manufactured at UMC.
  
  
• GLOBALFOUNDRIES Expands Partner Program to Speed Time-to-Market of FDX Solutions (Friday Dec. 16, 2016)
  GLOBALFOUNDRIES today announced the addition of eight new partners to its growing FDXcelerator Program, including Advanced Semiconductor Engineering, Inc. (ASE Group), Amkor Technology, Infosys, Mentor Graphics, Rambus, Sasken, Sonics, and QuickLogic.
  
  
• GLOBALFOUNDRIES Demonstrates Industry-Leading 56Gbps Long-Reach SerDes on Advanced 14nm FinFET Process Technology (Tuesday Dec. 13, 2016)
  As a part of GLOBALFOUNDRIES’ high-performance ASIC offering, FX-14™, the 56Gbps SerDes is designed for customers seeking to improve power and performance efficiency while handling the most demanding long-reach high-performance applications.
  
  
• SMIC and IMECAS Sign A Cooperation Agreement for MEMS R&D and Foundry Platform (Tuesday Nov. 15, 2016)
  SMIC and The Institute of Microelectronics of the Chinese Academy of Sciences ("IMECAS") announced the signing of a cooperation agreement for a MEMS R&D foundry platform to jointly develop MEMS sensor standard processes and build a complete MEMS supply chain.
  
  
• SMIC Shenzhen Launches Construction of the First 12-Inch IC Production Line in South China (Thursday Nov. 03, 2016)
  SMIC announces the official launch of a 12-inch integrated circuit (IC) production line at SMIC's Shenzhen facility. It will be the very first 12-inch fab in South China.
  
  
• SMIC TianJin Launches Capacity Expansion Project; Expected to Become the World's Largest Integrated 8-Inch IC Production Line (Tuesday Oct. 18, 2016)
  
  
  
• SMIC Shanghai Starts Construction of a New 12-Inch Wafer Fab (Thursday Oct. 13, 2016)
  SMIC today held the groundbreaking ceremony of a new 12-inch wafer fab in Shanghai to meet SMIC Shanghai's increasing production and development needs.
  
  
• X-FAB to Acquire Assets of Altis Semiconductor (Monday Oct. 03, 2016)
  X-FAB Silicon Foundries has today announced that it will acquire the assets of Altis Semiconductor, a specialty stand-alone foundry located in the Greater Paris area, out of insolvency proceedings.
  
  
• MagnaChip Announces Cost Competitive 0.13 micron Slim Flash Process Technology (Monday Oct. 03, 2016)
  MagnaChip, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today the availability of a new 0.13 micron Slim Flash process technology, based on 0.13 micron EEPROM.
  
  
• GLOBALFOUNDRIES to Deliver Industry's Leading-Performance Offering of 7nm FinFET Technology (Friday Sep. 16, 2016)
  GLOBALFOUNDRIES today announced plans to deliver a new leading-edge 7nm FinFET semiconductor technology that will offer the ultimate in performance for the next era of computing applications. This technology provides more processing power for data centers, networking, premium mobile processors, and deep learning applications.
  
  
• GLOBALFOUNDRIES Launches Embedded MRAM on 22FDX Platform (Friday Sep. 16, 2016)
  GLOBALFOUNDRIES today introduced a scalable, embedded magnetoresistive non-volatile memory technology (eMRAM) on its 22FDX platform, providing system designers with access to 1,000x faster write speeds and 1,000x more endurance than today’s non-volatile memory (NVM) offerings.
  
  
• UMC Reports Sales for August 2016 (Friday Sep. 09, 2016)
  United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), today reported unaudited net sales for the month of August 2016.
  
  
• GLOBALFOUNDRIES Unveils Ecosystem Partner Program to Accelerate Innovation for Tomorrow's Connected Systems (Thursday Sep. 08, 2016)
  GLOBALFOUNDRIES today announced a new partner program, called FDXcelerator™, an ecosystem designed to facilitate 22FDX™ system-on-chip (SoC) design and reduce time-to-market for its customers.
  
  
• GLOBALFOUNDRIES Extends FDX Roadmap with 12nm FD-SOI Technology (Thursday Sep. 08, 2016)
  GLOBALFOUNDRIES today unveiled a new 12nm FD-SOI semiconductor technology, extending its leadership position by offering the industry’s first multi-node FD-SOI roadmap. Building on the success of its 22FDXTM offering, the company’s next-generation 12FDXTM platform is designed to enable the intelligent systems of tomorrow across a range of applications, from mobile computing and 5G connectivity to artificial intelligence and autonomous vehicles.
  
  
• UMC Forges Strategic Partnership with APM to Enhance MEMS Service Capabilities (Monday Sep. 05, 2016)
  UMC will leverage its 8” and 12” production capabilities with APM’s 6” fab and extensive MEMS know-how and prototyping experience to provide chip designers with a flexible and scalable end-to-end MEMS manufacturing solution.
  
  
• Renesas Electronics and TSMC Announce 28nm MCU Collaboration for Next-Generation Green and Autonomous Vehicles (Thursday Sep. 01, 2016)
  Renesas Electronics and TSMC today announced that they are collaborating on 28nm (nanometer) embedded flash (eFlash) process technology for manufacturing microcontrollers (MCUs) targeted at next-generation green and autonomous vehicles
  
  
• UMC Qualifies 0.18um BCD Process for Most Stringent AEC-Q100 Grade-0 Automotive ICs (Monday Aug. 01, 2016)
  United Microelectronics Corporation (NYSE:UMC;TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that it has verified on silicon its 0.18um Bipolar CMOS DMOS (BCD) process for the most stringent AEC Q100 grade-0 automotive ICs.