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20 Most Popular News
Updated: Sun, 26 Jan 2025 01:00:02 +0100
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Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety Andes Technology today announced that its D45-SE processor has successfully achieved ISO 26262 ASIL-D with the certification of SGS TÜV. This certification marks a significant achievement for Andes Technology, confirming that the D45-SE processor meets the highest automotive safety standards required for safety-critical applications in the automotive industry. |
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Cadence to Acquire Secure-IC, a Leader in Embedded Security IP Leading embedded security offerings will complement Cadence’s expanding IP portfolio, unlocking a growing multi-hundred-million incremental TAM opportunity |
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Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon The first public specificiation for the Arm Chiplet System Architecture is now available, with over 60 companies contributing to its development. |
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ARM boost in $100bn Stargate data centre project ARM and its owner Softbank are a key partners in a datacentre infrastructure programme called Stargate. |
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Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit Partnering with industry giants such as Arm and Keysight, Alphawave Semi will highlight its leadership in UCIe, HBM, and next-generation compute and I/O chip |
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Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation Series B funding led by Maverick Silicon fuels market expansion and ability to meet rapidly growing demand for hyper-efficient data movement in agile complex silicon systems |
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VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP VeriSilicon (688521.SH) today announced the joint launch of the second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP, Yunbao 2, in collaboration with Innobase, a wireless communication technology and chip provider. |
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Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports The semiconductor industry is expected to start 18 new fab construction projects in 2025*, according to SEMI’s latest quarterly World Fab Forecast report. The new projects include three 200mm and fifteen 300mm facilities, the majority of which are expected to begin operations from 2026 to 2027. |
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YorChip announces patent-pending Universal PHY for Open Chiplets YorChip, Inc. announces development of a Universal PHY enabling customers to develop Open Chiplets and ASIC solutions using a single die-to-die PHY. |
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Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports Electronic System Design (ESD) industry revenue increased 8.8% to $5,114.5 million in the third quarter of 2024 from the $4,702.4 million registered in the third quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. |
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Arm vs. RISC-V in 2025: Which Architecture Will Lead the Way? Could the fifth generation of reduced instruction set computing (RISC) dethrone the long-established advanced RISC machine (Arm) and x86 architectures? While the discussion about Arm versus RISC-V is hotly debated, the benefits of this open standard cannot be overlooked. How soon could it achieve market dominance? |
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MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs Latest Virtuoso Studio release and Spectre Simulator deliver a 30% productivity gain for MediaTek’s 2nm design flow compared to prior Virtuoso releases |
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Cadence Unveils Arm-Based System Chiplet Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence's commitment to driving industry-leading solutions through its chiplet architecture and framework. |
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Alphawave Semi Q4 2024 Trading and Business Update Alphawave IP Group is pleased to publish its trading and business update for the three months ended 31 December 2024. |
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Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X Using Samsung Foundry's SF4X 4nm advanced process, the latest BlueLynx PHY supports both standard 2D and advanced 2.5D packages and enables system designers to seamlessly change packaging technologies in current and future implementations. Customer deliveries started in 2024 with silicon characterization in both advanced and standard packaging applications expected in early Q2 2025. |
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ST-GloFo fab plan shelved The ST-Globalfoundries plan to build a joint FD-SOI 12 inch fab at Crolles is, reportedly, on hold. |
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MIPI Alliance Announces Board Leadership Appointments Hezi Saar of Synopsys appointed board chair; new vice chair and treasurer named for global organization developing interface specifications for mobile, IoT, automotive and related industries |
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Credo to Exhibit at Chiplet Summit 2025 This year’s summit provides an ideal opportunity for Credo to highlight its portfolio of chiplet and intellectual property (IP) solutions, including the recent addition of the 112G PAM4 SerDes IP family, complementing Credo’s available IP in TSMC’s N5 process technology. |
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Qualitas Semiconductor Signs IP Licensing Agreement with Edge AI Leader Ambarella Under this agreement, Ambarella will utilize Qualitas C/D-PHY IP, implemented on the 5nm process, to apply it to its next-generation AI engine, CVflow®-based SoCs (System-on-Chips). |
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PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan PQShield has joined the Cyber Research Consortium (CRC) in Japan to participate in its program with the Japanese government’s New Energy and Industrial Technology Development Organization (NEDO) to enhance Japan’s defense against quantum-enabled cyber attacks. |