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20 Most Popular News
Updated: Thu, 01 May 2025 01:00:02 +0200
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1 | New!!! |
Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that it has joined Intel Foundry Accelerator Ecosystem Alliance Program, as a member of both the IP Alliance and the recently announced Chiplet Alliance. |
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2 | New!!! |
SkyeChip Joins Intel Foundry Accelerator IP Alliance SkyeChip Berhad, a Malaysian integrated circuit (IC) design company specialising in high-performance silicon IP, today announced its participation in the Intel Foundry Accelerator IP Alliance. |
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3 | New!!! |
CFX 0.13μm eFuse OTP IP has been applied in the mass production of over 15,000 CMOS image sensors Zhuhai Chuangfeixin Technology Co., Ltd. (CFX), a one-stop NVM (Non-Volatile Memory) storage IP supplier, announced today that it has achieved a major breakthrough in the mass production of CMOS image sensors based on the 0.13μm platform, with the number of wafers in mass production successfully exceeding 15,000, thanks to its independently developed OTP IP adopting the eFuse structure. |
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4 | New!!! |
Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC Siemens Digital Industries Software today announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference flows, and additional technology enablement leveraging the foundry’s leading-edge technologies for next-generation integrated circuits (IC) and advanced packaging. |
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5 | New!!! |
Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications Cadence (Nasdaq: CDNS) today announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK). |
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6 | 17 |
BrainChip Collaborates with Chelpis-Mirle on Security Solution BrainChip today announced that Chelpis Quantum Corp. has selected its Akida AKD1000 chips to serve as the processor for built-in post-quantum cryptographic security. |
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7 | New!!! |
Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies Synopsys Production-Ready EDA Flows and Broadest IP Portfolio Deliver Leading PPA for Intel Foundry's Advanced Processes and Packaging Technologies |
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8 | 12 |
Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership Siemens Digital Industries Software today announced that it has signed an exclusive OEM agreement for its EDA business to bring Alphawave Semi’s portfolio of high-speed interconnect silicon IP to market through its sales channel. |
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9 | 1 |
QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip This milestone marks the first time eFPGA Hard IP has been delivered for a sub-5nm process node and is expected to set new standards for low power consumption, high performance, and optimal silicon area utilization (PPA). |
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10 | 4 |
TSMC Unveils Next-Generation A14 Process at North America Technology Symposium A14 is designed to drive AI transformation forward by delivering faster computing and greater power efficiency. It is also expected to enhance smartphones by improving their on-board AI capabilities, making them even smarter. Planned to enter production in 2028, the current A14 development is progressing smoothly with yield performance ahead of schedule. |
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11 | New!!! |
Alphawave Semi Audited Results for the Year Ended 31 December 2024 Alphawave IP Group plc (LSE: AWE) ("Alphawave Semi" or the "Company"), a global leader in high-speed connectivity for the world’s technology infrastructure, has published its results for the year ended 31 December 2024. |
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12 | 7 |
New Audio Sample Rate Converter (ASRC) IP Core from CAST Offers Versatility with High Fidelity Synchronous and asynchronous ASRC has a broad channel capacity, high conversion ratios, and fast performance, all with outstanding low distortion. |
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13 | 9 |
VeriSilicon Launches the Industry-Leading Automotive-Grade Intelligent Driving SoC Design Platform The newly launched automotive-grade high-performance intelligent driving SoC design platform adopts a flexible, configurable architecture, supporting efficient collaboration among multiple co-processors, including high-performance multi-core Central Processing Units (CPUs), image signal processors, video codecs, and neural network processors. |
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14 | 2 |
Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration Building on a series of recent collaborations, Siemens has achieved certification for its Calibre® nmPlatform software suite—including nmDRC, nmLVS, Calibre® YieldEnhancer™, and PERC™ tools—alongside its Analog FastSPICE (AFS) and Solido™ solutions, for TSMC’s cutting-edge N2P and A16 processes. |
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Alphawave IP Response to announcement from Qualcomm Alphawave is confident in its strategy to become a leading semiconductor company and the value this will deliver for shareholders. There can be no certainty that any firm offer will be made nor as to the terms on which any offer might be made and accordingly shareholders are advised to take no action. |
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16 | 8 |
NEXT Semiconductor Technologies Collaborates with BAE Systems to Develop Next Generation Space-Qualified Chips NEXT Semiconductor Technologies is collaborating with BAE Systems to accelerate the insertion of its latest ultra-wideband antenna processor units (APUs) into high-performing radiation-hardened electronic subsystems to support future space missions. |
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17 | New!!! |
M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation M31 Technology Corporation (M31), a global provider of silicon intellectual property (IP), today announced that its eUSB2 PHY IP has achieved silicon-proven status on TSMC’s 3nm process and has successfully completed tape-out on TSMC’s 2nm process. |
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18 | 6 |
Baya Systems, Imagination Technologies and Andes Technology to Present on Heterogeneous Compute Architectures at Andes RISC-V CON Silicon Valley In a joint developer track session with Imagination Technologies and Andes Technology, Baya chief software architect Dr. Eric Norige and Imagination director of product management Pallavi Sharma will present on heterogeneous system-on-chip (SoC) strategies designed to optimize performance for AI, machine learning and graphics-intensive workloads. |
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19 | 5 |
BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation BOS and Intel co-promote Automotive AI solution to China and global customers at AutoShanghai 2025 event using BOS Eagle-N and Intel Malibou-lake system. |
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20 | 16 |
S2C and Andes Technology Announce FPGA-Based Prototyping Partnership to Accelerate Advanced RISC-V SoC Development S2C, a global leader in FPGA-based prototyping solutions, and Andes Technology, a premier provider of high-performance, low-power RISC-V processor IP solutions, today announced the results of a strategic collaboration designed to significantly enhance FPGA prototyping capabilities for developers of advanced System-on-Chip (SoC) devices. |