TSMC could partner with Bosch for 28nm fab in Germany
By Peter Clarke, eeNews Europe (April 14, 2023)
Lead foundry TSMC could partner with Robert Bosch and two other automotive suppliers to create a joint-venture 300mm fab in Germany that will target a 28nm process technology, according to reports in Digitimes.
A TSMC fab in Germany targeting a 28nm process is a less advanced development than previously expected – but also a more affordable one (see TSMC’s Dresden fab talks reach advanced stage, says report). While targeting 28nm could go some way to addressing security of automotive chip supply – an issue that got Germany’s attention during the pandemic crisis – it would do nothing for European strategic security and the region’s ability to manufacture at the leading-edge.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Report: TSMC's 3nm Fab Could Cost $20 Billion
- AppliedMicro Selects TSMC as Manufacturing Partner for ARM 64-bit SoCs On Advanced 40nm and 28nm Process Technology
- Hailo Selects Avnet ASIC as Channel Partner for TSMC Silicon Production
- Alphawave Semi Wins Fifth Consecutive TSMC OIP Ecosystem Forum Partner of the Year Award
- Silicon Creations Awarded TSMC's 2024 Open Innovation Platform Partner of the Year for Mixed Signal IP
Breaking News
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®
- Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge
- Xylon Introduces Xylon ISP Studio
- Crypto Quantique announces QRoot Lite - a lightweight and configurable root-of-trust IP for resource-constrained IoT devices
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
Most Popular
- Andes Technology and Imagination Technologies Showcase Android 15 on High-Performance RISC-V Based Platform
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
- Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions
- M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation