Arm Announces Confidential Submission of Draft Registration Statement for Proposed Initial Public Offering
Cambridge, UK, April 29, 2023 – Arm today announced that it has confidentially submitted a draft registration statement on Form F-1 to the U.S. Securities and Exchange Commission (the “SEC”) relating to the proposed initial public offering of American depositary shares representing its ordinary shares. The size and price range for the proposed offering have yet to be determined. The initial public offering is subject to market and other conditions and the completion of the SEC’s review process.
This press release is being made pursuant to, and in accordance with, Rule 135 under the Securities Act of 1933, as amended (the "Securities Act"), and shall not constitute an offer to sell, or the solicitation of an offer to buy, any securities. Any offers, solicitations or offers to buy, or any sales of securities will be made in accordance with the registration requirements of the Securities Act and other applicable securities laws.
About Arm
Arm technology is defining the future of computing. Our energy-efficient processor designs and software platforms have enabled advanced computing in more than 250 billion chips and our technologies securely power products from the sensor to the smartphone and the supercomputer. Together with 1,000+ technology partners, we are enabling artificial intelligence to work everywhere, and in cybersecurity, we are delivering the foundation for trust in the digital world – from chip to cloud. The future is being built on Arm.
|
Arm Ltd Hot IP
Related News
- Arm Announces Public Filing of Registration Statement for Proposed Initial Public Offering
- GlobalFoundries Files Registration Statement for Proposed Initial Public Offering
- eASIC Files Registration Statement for Proposed Initial Public Offering
- Ambarella Files Registration Statement for Proposed Initial Public Offering
- Apache Design Solutions, Inc. Files Registration Statement for Proposed Initial Public Offering
Breaking News
- NEXT Semiconductor Technologies Collaborates with BAE Systems to Develop Next Generation Space-Qualified Chips
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Premier ASIC and SoC Design Partner Rebrands as Aion Silicon
- Baya Systems, Imagination Technologies and Andes Technology to Present on Heterogeneous Compute Architectures at Andes RISC-V CON Silicon Valley
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
Most Popular
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
- BrainChip Extends RISC-V Reach with Andes Technology Integration
- Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |