SiliconAlly: GigaPHY Testchip is back from Fabrication and Packaging
May 18, 2023 -- A long time of waiting ended this week for Siliconally. We got our test chip, called GigaPHY, back from fabrication and packaging.
The chip contains 2 Dual PHY instances supporting 100BASE-T1 and 1000BASE-T1 communication and 1 Single PHY instance with 100BASE-T1 communication. Additionally we have some more on-chip memory for data collection and GMII and SGMII integrated.
Bringing up a new chip is even for very experienced developers a heartbeat moment. Will the chip get alive at all? Do we have any major bugs? Are all the components integrated correctly? How good does the simulation fit to the real chip?
GigaPHY Data
Chip Technology
- Globalfoundries 22DFX
Automotive Ethernet PHY Instances
Other Interfaces
- 3x SGMII
- 1x GMII/MII
- 1x SPI
- 1x MDIO
- 1x JTAG
|
Siliconally GmbH. Hot IP
Related News
- Siliconally Releases SinglePHY 100BASE-T1 22FDX, an Automotive Ethernet PHY IP
- Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
- EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC
- Alphawave Semi to Showcase Innovations and Lead Expert Panels on 224G, 128G PCIe 7.0, 32G UCIe, HBM 4, and Advanced Packaging Techniques at DesignCon 2025
- GlobalFoundries Announces New York Advanced Packaging and Photonics Center
Breaking News
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®
- Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge
- Xylon Introduces Xylon ISP Studio
- Crypto Quantique announces QRoot Lite - a lightweight and configurable root-of-trust IP for resource-constrained IoT devices
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
Most Popular
- Andes Technology and Imagination Technologies Showcase Android 15 on High-Performance RISC-V Based Platform
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
- Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions
- M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |