55nmHV MTP Non Volatile Memory for Standard CMOS Logic Process
Are Chiplets Enough to Save Moore's Law?
By Steve Leibson, EETimes (June 2, 2023)
During a press conference at Computex this week in Taiwan, Nvidia CEO Jensen Huang and MediaTek CEO Rick Tsai announced that Nvidia would be supplying GPU chiplets to MediaTek to be incorporated into a yet-to-be-designed system-on-chip (SoC) for in-cabin automotive applications along with Nvidia AI and graphics IP.
Chiplets are not new to Nvidia. This announcement also adds a bit more validation for chiplets as a concept—one that many semiconductor makers are counting on to help keep Moore’s Law alive for the next several years.
The idea behind chiplets is hardly a new concept. The industry has been making multi-chip modules for decades: Mostek, for example, put two MK4116 16-Kbit DRAM chips in a dual-cavity ceramic package to create the MK4332D 32Kbit DRAM back in 1979. Intel also mated a CPU chip and an SRAM chip in the Pentium Pro, introduced in late 1995. These multichip modules (MCMs) allowed Mostek and Intel to transcend the limitations of their semiconductor processes to create packaged devices that were “more than Moore.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
Breaking News
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®
- Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge
- Xylon Introduces Xylon ISP Studio
- Crypto Quantique announces QRoot Lite - a lightweight and configurable root-of-trust IP for resource-constrained IoT devices
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
Most Popular
- Andes Technology and Imagination Technologies Showcase Android 15 on High-Performance RISC-V Based Platform
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
- Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions
- M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation