Register File with low power retention mode and 3 speed options
Omni Design to Present Next Generation LiDAR Solutions at CadenceLIVE Europe
SAN JOSE, California – Oct 9, 2023 – Omni Design Technologies, a leading provider of low-power, high-performance mixed-signal Intellectual Property (IP) solutions, announced that it will present “Next Generation LiDAR Solutions: Unleashing the Power of High-Performance Low Power Data Converters” at CadenceLIVE Europe 2023 on October 10 & 11 in Munich, Germany.
This presentation, delivered jointly with Cadence, will focus on the adoption of LiDAR in the automotive driver assistance (ADAS) market and the role of high-performance, low-power data converters in next-generation LiDAR systems. The presentation is based on the ongoing collaboration between Omni Design and Cadence on a solution combining DSP IP with data converters for deployment in the automotive market.
About Omni Design Technologies
Omni Design Technologies is the leading provider of high-performance, ultra-low power mixed signal IP cores in advanced process technologies that enable highly differentiated systems-on-chip (SoCs) in applications ranging from wired and wireless communications, automotive, imaging, sensors, and IoT. Omni Design, founded in 2015 by semiconductor industry veterans, has an excellent track record of innovation and collaboration with customers to enable their success. The company is headquartered in Milpitas (California), with additional offices in Fort Collins (Colorado), Billerica (Massachusetts), Bangalore (India), Hyderabad (India), and Ireland. For more information, visit www.omnidesigntech.com.
|
Related News
- Omni Design Technologies Unveils Next-Gen LiDAR Solutions with Swift™ Data Converters
- Omni Design Announces Availability of LiDAR Receiver Subsystem
- Omni Design and LeddarTech Collaborate to Accelerate Mass Market Deployment of LiDAR for ADAS and Autonomous Vehicles
- GUC and Omni Design Tape Out 16nm LiDAR SoC
- Omni Design Technologies Offers 3nm, Single Core-voltage Supply Rail Process, Voltage and Temperature (PVT) Monitor
Breaking News
- Silicon Proven AV1 Decoder IP with support for 12-bit pixel size and 4:4:4 Chroma Sub-Sampling Released by Allegro DVT
- Cadence Enables Next-Gen AI and HPC Systems with Industry's Fastest HBM4 12.8Gbps IP Memory System Solution
- S2C and Andes Technology Announce FPGA-Based Prototyping Partnership to Accelerate Advanced RISC-V SoC Development
- PQShield launches UltraPQ-Suite for deeply specialized implementations of post-quantum cryptography
- Andes Technology and Imagination Technologies Showcase Android 15 on High-Performance RISC-V Based Platform
Most Popular
- Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions
- Cadence to Acquire Arm Artisan Foundation IP Business
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New Breakthroughs in China's RISC-V Chip Industry
- Ceva Neural Processing Unit IP for Edge AI Selected by Nextchip for Next-Generation ADAS Solutions
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |