Certus Semiconductor releases I/O library in TowerJazz's 65nm process
September 25, 2024 -- Certus is excited to announce that its 1.2V/3.3V wire-bond I/O library in TowerJazz’s 65nm process is silicon-verified, and exceeding expectations.This is a Foundation I/O library featuring 8kV HBM and >500V CDM ESD protection, standard, in all I/O’s and Powers, ensuring robust reliability in challenging environments. The library’s compact footprint (70x100um), crafted explicitly for space-efficient designs, makes it ideal for applications where size is critical.
The library offers a robust GPI-LVDS combo cell, with six drive strength settings and an impressive 1.2Gbps transmit and receive speeds, all contained within a footprint of two standard I/O cells (140 x100um). Additionally, to its role as a versatile LVDS TX or RX front-end, the cell can also act as two separate selectable TTL-compliant General-Purpose Inputs (GPI), which optimizes production testing efficiency.
The Library 3.3V GPIO (General Purpose Input Output) functionality supports standard LVCMOS features and frequencies up to 100MHz for transmission and 270MHz for receiving, with selectable 50kΩ/pull-up/pull-down resistors for enhanced integration flexibility.
The Library 3.3V to 5V ODIO (Open-Drain Input Output) ensures seamless compatibility with I2C protocols in both 3.3V and 5V system buses.
Supporting the digital features is a full set of 1.2V and 3.3V analog I/O’s. Also featured is an RF cell with <290fF self-capacitance (including Bondpad) and high 8kV ESD protection. If your design requires an array of fill, corner, or break cells, this library offers a flexible array of options for padring construction, accommodating diverse design goals.
Feel free to reach out to a Certus representative for more information!
|
Certus Semiconductor Hot IP
Related News
- Certus releases radiation-hardened I/O Library in GlobalFoundries 12nm LP/LP+
- Certus Semiconductor releases ESD library in GlobalFoundries 12nm Finfet process
- Sofics releases Analog I/O's and ESD clamps for TSMC N5 process
- Sofics releases pre-silicon analog I/O's for high-speed SerDes for TSMC N5 process technology
- Himax Imaging chooses TowerJazz Panasonic Semiconductor's State of the Art 65nm process with Outstanding 1.12µm Pixel for its Next Generation Cameras for Smart Phone Applications
Breaking News
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®
- Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge
- Xylon Introduces Xylon ISP Studio
- Crypto Quantique announces QRoot Lite - a lightweight and configurable root-of-trust IP for resource-constrained IoT devices
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
Most Popular
- Andes Technology and Imagination Technologies Showcase Android 15 on High-Performance RISC-V Based Platform
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
- Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions
- M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |