MIPI C-PHY v2.0 D-PHY v2.1 RX 2 trios/2 Lanes in TSMC (N5, N3E, N3P)
M31 Unveils Full Range of Automotive IP Solutions at ICCAD Illuminating the Future of Automotive Chip Development
December 17, 2024 -- M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), made a significant appearance at the 2024 China Integrated Circuit Design Industry Exhibition (ICCAD-Expo). At this 30th anniversary conference of ICCAD, M31 unveiled a full range of automotive IP solutions to address the growing demand for automotive chips driven by new energy vehicles, further advancing the development of high-end automotive chips.
M31 has launched a full range of automotive IP solutions includes safety-optimized Foundation IP platforms such as standard cell libraries, SRAM, specialty I/O, and automotive-grade high-speed interfaces across various process nodes, all specifically designed to meet unique application needs. Additionally, M31 is committed to helping customers optimize their product development cycles by accelerating processes such as requirements specification, design, implementation, integration, validation, and SoC-level functional safety configuration. This approach effectively reduces design risks, speeds up certification, and complies with ISO quality standards, meeting the diverse demands and stringent safety requirements of new energy vehicle applications in ADAS, cockpit SoCs, and other automotive electronic chip solutions. Furthermore, M31 supports system-level validation and pre- silicon testing of IPs to ensure the delivered IPs are highly reliable and integrable, providing customers with a complete and robust solution.
M31 CEO, Scott Chang, stated during the event “With the rapid growth of the new energy vehicle market, the demand for high-performance, low-power automotive chips are increasing significantly. Through our comprehensive automotive IP solutions, we aim to empower our customers to advance differentiated technology platforms, creating more possibilities for future chip applications in the market.”
|
M31 Technology Corp. Hot IP
USB 3.2 Gen2/Gen1 PHY IP in TSMC(5nm, 6nm, 7nm,12nm/16nm, 22nm, 28nm, 40nm, 55nm ...
PCIe 4.0 PHY in TSMC(6nm,7nm,12nm,16nm)
MIPI M-PHY v4.1/v3.1 IP in TSMC(5nm, 6nm, 7nm, 12nm,16nm, 22nm, 28nm, 40nm, and ...
MIPI D-PHY RX/TX v1.1 / v1.2 IP in TSMC (12/16nm, 28nm, 40nm, and 55nm process)
SerDes PHY IP(12nm, 14nm, 22nm, 28nm)
Related News
- M31 Receives ISO 26262 Development Process Certification and Enters Advanced Automotive Electronics Market
- M31 Technology Deploys the Full Range of IP for TSMC 22nm ULP/ULL Process
- M31 Deploys a Full Range of IP for TSMC 16nm FFC Process
- Texas Instruments Unveils Integrated HDTV Processor and Development Platform with Full HD Video Processing
- VeriSilicon Licenses Full Range of ARM Processors for Consumer & Automotive SoC Design Services
Breaking News
- Silicon Proven AV1 Decoder IP with support for 12-bit pixel size and 4:4:4 Chroma Sub-Sampling Released by Allegro DVT
- Cadence Enables Next-Gen AI and HPC Systems with Industry's Fastest HBM4 12.8Gbps IP Memory System Solution
- S2C and Andes Technology Announce FPGA-Based Prototyping Partnership to Accelerate Advanced RISC-V SoC Development
- PQShield launches UltraPQ-Suite for deeply specialized implementations of post-quantum cryptography
- Andes Technology and Imagination Technologies Showcase Android 15 on High-Performance RISC-V Based Platform
Most Popular
- Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions
- Cadence to Acquire Arm Artisan Foundation IP Business
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New Breakthroughs in China's RISC-V Chip Industry
- Ceva Neural Processing Unit IP for Edge AI Selected by Nextchip for Next-Generation ADAS Solutions
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |