Jun. 30, 2022 - Breker Verification Systems, the leading provider of advanced test content synthesis solutions, including RISC-V Cache Coherency and other SoC integration Verification Intellectual Property (VIP) in the “TrekApps” family, today joined RISC-V International (RVI) as a strategic member.

Jun. 17, 2021 - Advantest Corporation is pilot testing a next-generation solution for performing both high-speed scan testing and software-driven functional device testing on the V93000 platform by leveraging the existing high-speed serial I/O interfaces on advanced integrated circuits (ICs).

Oct. 26, 2020 - Synopsys today announced that in collaboration with Samsung Foundry, more than 30 new interoperable process design kits (iPDKs) have been jointly developed, validated and support the Synopsys Custom Design Platform.

Jul. 05, 2016 - PLDA Training leverages PLDA’s industry expertise in IP Connectivity design to share best-in-class techniques on their customers’ own schedules to cost-effectively optimize their projects

May. 02, 2008 - Cadence Design Systems, Inc. today announced the immediate availability of multiple, silicon-ready RTL to GDSII implementation flows based on the Cadence® Encounter® digital IC design platform, for the ARM® Cortex™-A9 processor.

Dec. 05, 2007 - Cadence Design Systems, Inc. and ARM today announced the availability of two new implementation reference methodologies jointly developed by the companies, one for the ARM11™ MPCore™ multicore processor and the other for low-power implementation of the ARM1176JZF-S™ processor, which incorporates ...

May. 21, 2007 - With CHAINarchitect, chip architects can easily explore new interconnect topologies and perform ''what if'' analyses to optimize on-chip communications (bandwidth and latency) between IP cores along with overall system characteristics such as power, die area, system-level performance and others.

Apr. 02, 2007 - CoWare announced a new release of the CoWare Virtual Platform Product Family that addresses the challenges associated with go-to-market strategies and software development for multicore, platform-based designs.

Jul. 24, 2006 - ARM Enhances Reference Methodologies With Library Views And Pre-Compiled Rams

Oct. 24, 2005 - HDL, Design Team, and Enterprise Families offer 'Plan-to-Closure' Verification Solutions Tailored for Unique Project Needs

Jul. 29, 2005 - Of the 141 respondents to the online survey, which was conducted in late May and early June, more than 98 percent answered that they either agree or strongly agree that ESL methodologies can strongly improve productivity

Jan. 03, 2005 - CoWare Forges Relationships with Premier Universities in India to Accelerate Research and Development in ESL Tools and Methodologies

May. 28, 2002 - ARM, Synopsys And TSMC Address Industry Need For Proven SoC Methodologies

Dec. 15, 1999 - Cadence Delivers Robust Portfolio of System-on-a-Chip Methodologies

May. 08, 2000 - Co-Design Automation Launches Innovative Product Line to Reshape System Design Methodologies

Jun. 09, 2000 - De Man calls for new breed of engineer, tools and methodologies

Jun. 11, 2001 - Altera Accelerates SOPC Development With New Quartus II Design Methodologies

Nov. 22, 2024 - Sondrel, a leading provider of ultra-complex custom chips, has announced that it has started front end, RTL design and verification work on a high-performance computing (HPC) chip project for a major new customer.

Nov. 11, 2024 - Siemens Digital Industries Software announced today the Innexis product suite, a complement to its industry leading Veloce™ hardware-assisted verification and validation system.

Aug. 13, 2024 - OPENEDGES Technology, Inc. (OPENEDGES), the leading provider of memory subsystem intellectual property (IP), today announced the launch of the Universal Chiplet Interconnect Express (UCIe) Controller IP, named OUC.

Jul. 01, 2024 - Today marks a new milestone in the growth of Intel Foundry’s design ecosystem as key partners Ansys, Cadence, Siemens, and Synopsys have announced the availability of reference flows for Intel’s embedded multi-die interconnect bridge (EMIB) advanced packaging technology.

Jun. 25, 2024 - Siemens Digital Industries Software announced today Innovator3D IC™, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D & 3D technologies and substrates in the world. ...

Jun. 13, 2024 - Siemens Digital Industries Software today announced that, in collaboration with Samsung Foundry, they have developed compelling new capabilities for the manufacture of multi-die packaged designs at advanced nodes and achieved a host of new product certifications for many of Siemens’ industry-leading ...

Jun. 06, 2024 - Designed to be used with Siemens’ Catapult™ software for high-level synthesis and verification, Catapult formal tools uniquely bring known and trusted formal verification methods from the RTL world to high-level design.

Jun. 04, 2024 - One of the big challenges with data centres is amount of power that they consume. This is being further exacerbated by the increasing use of AI in the form of Large Language Models.

May. 02, 2024 - Along with Microchip’s Mi-V ecosystem, new device family helps system designers to lower power, size and weight and speed time to market

May. 01, 2024 - Rapid Silicon, a provider of AI and intelligent edge-focused FPGAs based on open-source technology, today announced its release of the Rapid eFPGA Configurator, a revolutionary tool empowering System-on-Chip (SoC) designers to customize their own embedded Field-Programmable Gate Arrays (eFPGA) with ...

Apr. 24, 2024 - Today at the TSMC 2024 North America Technology Symposium, Siemens Digital Industries Software announced that ongoing collaboration with longtime partner TSMC has successfully achieved multiple new product certifications and project milestones for TSMC’s newest and most advanced processes.

Apr. 04, 2024 - sureCore, the low power embedded memory specialist, has announced the availability of its PowerMiser, ultra-low, dynamic power memory compiler in 16nm. This will enable developers to more easily hit their challenging power budgets and successfully exploit the capabilities of these mature FinFET processes. ...

Mar. 27, 2024 - SmartSoC Solutions, a leading Indian semiconductor design services company founded in 2016, is excited to announce its membership in the Design Center Alliance (DCA) of TSMC’s Open Innovation Platform® (OIP).

Mar. 13, 2024 - Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced the first deliverables of its ongoing partnership with Arm to speed up automotive electronics innovation based on the latest generation of Arm® Automotive Enhanced (AE) technologies. ...

Mar. 11, 2024 - OPENEDGES Technology proudly unveils a strategic partnership with SEMIFIVE to establish a user-friendly SoC ecosystem, integrating silicon-proven IPs and optimized design methodologies to achieve lower cost, reduced risk, and faster turnaround time.

Mar. 07, 2024 - SureCore has revisited its PowerMiser IP and further optimised it to drive down dynamic power further as well as exploiting the power efficiencies of FinFET technology. This has delivered a memory technology that minimises thermal impact whilst delivering the demanding performance profile needed by ...

Feb. 21, 2024 - Synopsys, Inc. (Nasdaq: SNPS) today announced its AI-driven digital and analog design flows are certified by Intel Foundry for the Intel 18A process.

Feb. 12, 2024 - Today, the Biden-Harris Administration announced it expects to invest over $5 billion in semiconductor-related research, development, and workforce needs, including in the National Semiconductor Technology Center (NSTC), to advance President Biden’s goals of driving R&D in the United States.

Jan. 05, 2024 - Socionext, an innovative custom SoCs provider with a distinctive "Solution SoC" business model, will showcase its leading-edge technologies and products at CES 2024, Jan. 9-12.

Jan. 04, 2024 - By leveraging Arm Neoverse™ Compute Subsystems (CSS), Faraday is poised to deliver cutting-edge cloud, high-performance computing (HPC), and AI chips with unparalleled performance and innovation.

Dec. 21, 2023 - Synopsys appears to be on a mission to build out its total RISC-V ecosystem offerings, having quietly acquired Imperas Software last week.

Dec. 05, 2023 - Agile Analog is collaborating with sureCore to implement a cryogenic control ASIC on the GlobalFoundries 22FDX process, as part of the Innovate UK funded project: “Development Of Cryogenic CMOS To Enable The Next Generation Of Scalable Quantum Computers.”

Dec. 04, 2023 - EMA Design Automation®, Inc., the world's premier EDA VAR, is spinning off their IP, content, and services group as a new company named Accelerated Designs, LLC with a focus on CAD agnostic solutions. Accelerated Designs will expand on the extensive design and methodology expertise EMA has gained ...