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40G Ultralink D2D PHY for Samsung 7LPP
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity
The Cadence® UltraLink™ Die-to-Die (D2D) PHY enables SoC providers to deliver more customized solutions that offer higher performance and yields while also shortening development cycles and reducing costs through greater IP reuse.
The Cadence® UltraLink™ Die-to-Die (D2D) PHY enables SoC providers to deliver more customized solutions that offer higher performance and yields while also shortening development cycles and reducing costs through greater IP reuse.
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