English
You are here:
40G Ultralink D2D PHY for TSMC N5P
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity
The Cadence® UltraLink™ Die-to-Die (D2D) PHY enables SoC providers to deliver more customized solutions that offer higher performance and yields while also shortening development cycles and reducing costs through greater IP reuse.
The Cadence® UltraLink™ Die-to-Die (D2D) PHY enables SoC providers to deliver more customized solutions that offer higher performance and yields while also shortening development cycles and reducing costs through greater IP reuse.
View 40G Ultralink D2D PHY for TSMC N5P full description to...
- see the entire 40G Ultralink D2D PHY for TSMC N5P datasheet
- get in contact with 40G Ultralink D2D PHY for TSMC N5P Supplier