NoC Silicon IP for RISC-V based chips supporting the TileLink protocol
General Purpose Multi-Voltage IO IP, BOAC (Bonding Over Active Circuit), UMC 0.13um HS/FSG process
View General Purpose Multi-Voltage IO IP, BOAC (Bonding Over Active Circuit), UMC 0.13um HS/FSG process full description to...
- see the entire General Purpose Multi-Voltage IO IP, BOAC (Bonding Over Active Circuit), UMC 0.13um HS/FSG process datasheet
- get in contact with General Purpose Multi-Voltage IO IP, BOAC (Bonding Over Active Circuit), UMC 0.13um HS/FSG process Supplier