HBM IP Core

The Rambus HBM3E/3 Controller Cores are designed for use in applications requiring high memory throughput, low latency and full programmability. The cores accept commands using a simple ...

1 Testimonial
June Paik, CEO, Furiosa

The Rambus HBM4 Controller Core is designed for use in applications requiring high memory bandwidth and low latency including AI/ML, HPC, advanced data center workloads and graphics. The ...

The Rambus HBM2/2E Controller Core is designed for use in applications requiring high memory throughput, low latency and full programmability. The core accepts commands using a simple local ...

3 Testimonials
Serge Leef, Microsystems Technology Office Program Manager, DARPA

The HermesCORE High-Bandwidth Memory Generation 3 (HBM3) controller is ideal for applications involving graphics, high-performance computing, high-end networking, and communications that require ...

​The MidasCORE High-Bandwidth Memory Generation 3 (HBM3) PHY is ideal for applications involving graphics, high-performance computing, high-end networking, and communications that require ...

Synopsys HBM3 Controller IP is optimized for power, latency, bandwidth, and area, supporting the JEDEC HBM3 standard. The controller interoperates with the Synopsys HBM3 PHY IP via an extended ...

OPENEDGES, the memory system IP provider, including DDR memory controller, DDR PHY, on-chip interconnect, and NPU IP together as an integrated solution or independent IP. They are tightly combined ...

Bandwidth and area optimized low power memory interface solution tuned for AI, HPC, data centers and networking conforming to HBM3 JEDEC standards

Highest performance IP for graphics, AI/ML Artificial intelligence (AI), high-performance computing (HPC), image processing, and autonomous driving applications generate and consume ...

OPENEDGES, the memory system IP provider, including DDR memory controller, DDR PHY, on-chip interconnect, and NPU IP together as an integrated solution or independent IP. They are tightly combined ...

SkyeChip’s High Bandwidth Memory (HBM) IP consists of a PHY and memory controller optimized for TSMC N7, N12 and Samsung 4nm process to support the HBM3 memory standard operating at up to ...

OPENEDGES, the memory system IP provider, including DDR memory controller, DDR PHY, on-chip interconnect, and NPU IP together as an integrated solution or independent IP. They are tightly combined ...

OPENEDGES, the memory system IP provider, including DDR memory controller, DDR PHY, on-chip interconnect, and NPU IP together as an integrated solution or independent IP. They are tightly combined ...

The LPDDR5X/5/4X/4 combo PHY IP features a state-of-art mixed-signal architecture that addresses the challenges of DRAM integration in high-performance and low-power environments. This architecture ...

The LPDDR5X/5/4X/4 combo PHY IP features a state-of-art mixed-signal architecture that addresses the challenges of DRAM integration in high-performance and low-power environments. This architecture ...

IGAHBMV03A, TSMC CLN16FFC HBM PHY with CoWoS technology

This datasheet describes GUC’s HBM (High Bandwidth Memory) PHY IP, which can be integrated with HBM memory controller to provide HBM functionality. The HBM PHY IP shall be an independent IP ...

This datasheet describes GUC HBM (High Bandwidth Memory) PHY IP, which could be integrated with HBM memory controller to provide HBM functionality. The HBM PHY is compliant to the JEDEC HBM2E ...

This datasheet describes GUC HBM (High Bandwidth Memory) PHY IP, which could be integrated with HBM memory controller to provide HBM functionality. The HBM PHY is compliant to the JEDEC HBM2E ...

OPENEDGES, the memory system IP provider, including DDR memory controller, DDR PHY, on-chip interconnect, and NPU IP together as an integrated solution or independent IP. They are tightly combined ...

OPENEDGES, the memory system IP provider, including DDR memory controller, DDR PHY, on-chip interconnect, and NPU IP together as an integrated solution or independent IP. They are tightly combined ...

The LPDDR5X/5/4X/4 combo PHY IP features a state-of-art mixed-signal architecture that addresses the challenges of DRAM integration in high-performance and low-power environments. This architecture ...

OPENEDGES, the memory system IP provider, including DDR memory controller, DDR PHY, on-chip interconnect, and NPU IP together as an integrated solution or independent IP. They are tightly combined ...

OPENEDGES, the memory system IP provider, including DDR memory controller, DDR PHY, on-chip interconnect, and NPU IP together as an integrated solution or independent IP. They are tightly combined ...

OPENEDGES, the memory system IP provider, including DDR memory controller, DDR PHY, on-chip interconnect, and NPU IP together as an integrated solution or independent IP. They are tightly combined ...

OPENEDGES, the memory system IP provider, including DDR memory controller, DDR PHY, on-chip interconnect, and NPU IP together as an integrated solution or independent IP. They are tightly combined ...

The third-generation HBM (HBM3/2E) technology, outlined by the JESD235C standard, inherits physical 128-bit DDR interface with 2n/4n prefetch architecture, internal organization, 1024-bit input/output, ...

Innosilicon HBM2E PHY IP is a silicon proven product with max speed up to 3600Mbps per DQ data, HBM2E memory has 1024bit DQ, total bandwidth can be 3.6Tbps. Innosilicon HBM2E PHY IP can support ...

Innosilicon HBM2E/2 Combo PHY provides turnkey physical interface solutions for ICs requiring access to JEDEC compatible HBM devices. It is optimized for low power and high speed (up to 3.6Gbps ...

This document describes a general layout scheme and Innosilicon HBM3/3E PHY connecting to the controller using a DFI digital interface. All interface timing is in 1X SDR clock domain. This interface ...

Ceva-Waves Bluetooth 5.2 dual mode IP is a complete and flexible solution for integration into SoCs/ASSPs. It contains both "classic" BR/EDR Bluetooth and Bluetooth Low Energy and is compatible ...

HBM2 Memory Controller

HBM2E Memory Controller

HBM3 Memory Controller

HBM2 is full-featured, easy-to-use, synthesizable design, compatible with HBM2 JESD235B specification and DFI-version 4.0 and 5.0 Compliant. Through its HBM2 compatibility, it provides a simple ...

HBM2E is full-featured, easy-to-use, synthesizable design, compatible with HBM2E JESD235B and JESD235C with revision 4.10 specification and DFI-version 4.0 or 5.0 specification Compliant. Through ...

HBM3 interface provides full support for the HBM3 interface, compatible with draft JEDEC specification version 0.93 and DFI-version 4.0 or 5.0 specification Compliant. Through its HBM3 compatibility, ...

Produced by DRAM manufacturers such as Samsung and Micron, High Bandwidth Memory or HBM, provides users with high bandwidth, low power consumption and large memory size. HBM is most commonly ...

Massive memory bandwidth, the simplicity of an AXI Interface, no need for external pins HBM IP, made available for Virtex UltraScale+ HBM devices, gives access to the highest available ...

MSquare's HBM3 IP (the 3rd generation of High-Bandwidth Memory) is specifically tailored for applications that require high memory throughput and low latency, complying with the JESD238 memory ...