Innosilicon HBM2E/2 Combo PHY provides turnkey physical interface solutions for ICs requiring access to JEDEC compatible HBM devices. It is optimized for low power and high speed (up to 3.6Gbps for HBM2E, up to 2.8Gbps for HBM2) applications with robust timing and small silicon area. It supports all JEDEC HBM2E/2 SDRAM components in the market. The PHY components contain HBM specialized functional I/Os from 20Mbps up to 3.6Gbps, critical timing synchronization module (TSM) and a low power/jitter DLLs with programmable fine-grain control for any SDRAM interface.
Note that all INNOSILICON PHY is pre-assembled with.lib, LEF and GDS so that it is very easy to integrate the PHY with any existing SoC floor plan. INNOSILICON is happy to pre-assemble each PHY for our customer so that integration becomes extremely easy.
The combo PHY solution includes HBM controller and PHY, supporting HBM2E/2. With configurable timing and driving strength parameters to interface to the wide variety of SDRAMs, the PHY is very flexible with advanced command capability to increase SDRAM operation efficiency.