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ARC-V RMX-500 power efficient 32-bit RISC-V processor for embedded applications
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LPDDR2 / LPDDR3 / DDR3 / DDR3L / DDR3U / DDR4 Combo I/O Pad Set
The LPDDR2/3_DDR3/4 library includes the combo driver/receiver cells with embedded power cells, the driver impedance calibration cell, and a full complement of support cells for both single-ended and differential signaling for LPDDR2, LPDDR3, DDR3, DDR3L, DDR3U, and DDR4 applications. Also included is a full complement of power, corner and spacer cells to assemble a complete pad ring by abutment. An included rail splitter allows multiple power domains to be isolated in the same pad ring while maintaining continuous VDD/VSS for robust ESD protection.
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DDR2 / DDR3 Combo IP
- DDR2/DDR3/DDR3L/LPDDR/LPDDR2/LPDDR3 6 in one combo IO with auto calibration - 40nm LL
- Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application; UMC 55nm SP/RVT LowK Logic Process
- Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application;UMC 55nm SP/RVT LowK PROCESS.
- Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application (compliant to DFI); UMC 55nm SP/RVT LowK Logic Process
- DDR3/DDR2/LPDDR2 COMBO Interface
- SMIC 65nm LL DDR3/DDR2/LPDDR2 COMBO interface for DRAM application