MCU PAD - SMIC 55nm Eflash

Features

• 5V/1.8V/3.3V/1.2V power supply can be used, not only compatible with normal 1.8V/3.3V
• powering system, and also 5V or lithium battery powering system
•  Including ultra-low leakage MCU I/O total solution
•  Supports 1.2V core voltage power off, and get ultra-low leakage
•  Provides a wide variety of interrupt I/O for customers to easily communicate with outside
• world at low power states
•  The powerful level shift structure can help customers use fixed internal I/O voltage, but
• unfixed power voltage for the outside interface
•  All I/O support that the voltage of PAD is higher than I/O power
•  Built in power-on-control function to prevent chip latch-up potential risk during chip powering up
• Standard I/O size is low to 70um*128um
• HBM ESD: >2000V; MM: ±200V; CDM: ±500V; LU: 150mA