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PAD - SMIC 110nm generic
Features
- Standard I/O size is low to 78um*32um
- HBM ESD: ±2000V; MM: ±200V; CDM: ±500V; LU: 150mA
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PAD IP
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- A 28nm Wirebond IO library with dynamically switchable 1.8V/ 3.3V GPIO, 5V I2C open-drain, 1.8V & 3.3V analog, OTP program cell, and HDMI & LVDS protection macros - featured across a variety of metal stack and pad configuration options
- LVDS IO Pad Set
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