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NoC Silicon IP for RISC-V based chips supporting the TileLink protocol
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PCIe 3.0 PHY in Samsung (SF5A
The multi-channel Synopsys PHY IP for PCI Express® 3.1 includes Synopsys’ high-speed, high-performance transceiver to meet today’s applications’ demands for higher bandwidth. The PHY provides a cost-effective solution that is designed to meet the needs of today’s high-speed chip-to-chip, board-to-board, and backplane interfaces while being extremely low in power and area.
Using leading-edge design, analysis, simulation, and measurement techniques, Synopsys delivers exceptional signal integrity and jitter performance that exceeds the PCI Express standard’s electrical specifications. The high-margin, robust PHY architecture tolerates process, voltage and temperature (PVT) manufacturing variations and is implemented with standard CMOS digital process technologies.
The multi-tap transmitter and receiver equalizers, along with the advanced built-in diagnostics and ATE test vectors, enable customers to control, monitor and test for signal integrity without the need for expensive test equipment. This provides on-chip visibility into actual link and channel performance to quickly improve signal integrity. This capability reduces both product development cycles and the need for costly field support.
Using leading-edge design, analysis, simulation, and measurement techniques, Synopsys delivers exceptional signal integrity and jitter performance that exceeds the PCI Express standard’s electrical specifications. The high-margin, robust PHY architecture tolerates process, voltage and temperature (PVT) manufacturing variations and is implemented with standard CMOS digital process technologies.
The multi-tap transmitter and receiver equalizers, along with the advanced built-in diagnostics and ATE test vectors, enable customers to control, monitor and test for signal integrity without the need for expensive test equipment. This provides on-chip visibility into actual link and channel performance to quickly improve signal integrity. This capability reduces both product development cycles and the need for costly field support.
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