Die-to-Die, 112G Ultra-Extra Short Reach PHY in TSMC (12nm, N7, N6, N5)
SMIC 65nm LL LPDDR interface for mobile-DDR application
Features
- LPDDR interface for mobile-DDR application;
- Cell Size (Width * height) 35um * 174um with DUP stagger bonding pads;
- Work voltage: 1.8V power;
- Support MDDR, datarate up to 400Mbps;
- Programmable driven-strength, pull-up/down resistor and Schmitt-trigger control;
- SMIC 0.065?m Logic 1P10M Salicide 1.2V/2.5V low leakage Process;
- Suitable for 7, 8, 9 and 10 layers application (double top metal);
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