TSMC CLN3FFE GLink 2.3LL Die-to-Die PHY

IGPD2DZO1A is a high-speed Die-to-Die interface PHY that transmits data through TSMC advanced packaging solutions, Integrated Fan-Out (InFO) with the RDL interconnect, and Chip-on-Wafer-on-Substrate (CoWoS@) with the silicon interposer.

• see the entire TSMC CLN3FFE GLink 2.3LL Die-to-Die PHY datasheet
• get in contact with TSMC CLN3FFE GLink 2.3LL Die-to-Die PHY Supplier