Multi-channel, multi-speed Ethernet universal media access control (MAC) and physical coding sublayer IP (UMAC)
HDMI 2.0 TX PHY 6Gbps in TSMC (28nm, 16nm, 12nm)
High voltage tolerant I/O
40G OTN Digital Wrapper
intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
Qualcomm initiates global anti-trust complaint about Arm
EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
Understanding MACsec and Its Integration
Discover new Tessent UltraSight-V from Siemens EDA, and accelerate your RISC-V development.
Density Management in Analog Layout Design: Addressing Issues and Ensuring Consistency
ReRAM-Powered Edge AI: A Game-Changer for Energy Efficiency, Cost, and Security
Metanoia Licenses Cadence Tensilica ConnX 230 DSP for New SDR Platform
Cadence Silicon Success of UCIe IP on Samsung Foundry's 5nm Automotive Process
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