Multi-Chip Module

Also called: MCM

Multi-Chip Module is an hybrid manufacturing technique which places several IC chips into a single package. MCMs are a way of "creating" an inte grated circuit using otherwise incompatible IC fabrication technologies (such as CMOS and GaAs). MCMs are also a way of extending the reach of existing ASIC technologies which may lack the ability to implement an entire system design on one chip.

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