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Bridging the DFT and Product Engineering Gap to Achieve Early Silicon Validation
By Pankaj Singh, Texas Instruments India (P) Ltd
Abstract : In today’s fast growing Systems-on-Chip (SoC), incomplete or ineffective DFT (Design For Test) support/deliverable due to poor specification or tool limitation/flow gap can quickly become the critical path in meeting market windows and delivering products within cost restrictions. In spite of improvement in design flow/ methodologies we continue to see issues during silicon validation due to incomplete test deliverables, gaps in flow or difference in simulation and tester environment. Even after completing the QC checks often the Quality of test pattern handoff depends on the experience of DFT engineer and requires manual correction/effort before handoff to PE (Product Engineering) team. In past Joel Graber has presented his work well on VLCT (Very Low Cost Tester) limitation, mismatch between simulation and tester [1]. However there is no automated utility to identify and fix these issues on test patterns prior to handoff to PE team causing schedule delay. This paper introduces a unified DFT - PE Methodology, aimed at providing a complete, methodical and fully automated path addressing gaps between DFT and PE team ensuring quick turnaround time in silicon validation. The methodology used in this paper significantly improved the cycle time for silicon validation using low cost tester. The know-how of issues described in this paper has been successful in achieve 93% digital test pattern passing in silicon within a day and 98% digital test pattern pass within a week time frame thereby significantly reducing the silicon validation time. This paper start with introduction section which describes critical WIMAX (Worldwide Interoperability for Microwave Access) silicon validation issues experienced over last two years and highlights the need for unified methodology to overcome these issues. Summary of silicon validation issues described in this section are based on lessons learned between design team, product engineering team and analog IP team. The next section provides details on solution offered in this paper. This section describes details on how proposed methodology overcomes limitations mentioned in the introduction section. It lists features, benefits of this utility and depicts the implementation details to the user. The last section concludes this paper with overall benefits of the proposed methodology and lists limitation/scope for future work. I. INTRODUCTION This section starts with summary of all lessons learned/issues categorized on WIMAX project
Table1. WIMAX Silicon Validation Issues [2]. Often a cultural gap exists between DFT and product engineering teams due to incomplete understanding of silicon validation (JAZZ flow, IDDQ (Integrated Circuit Quiescent Current) requirements) by DFT engineers and vice versa for PE team causing multiple test pattern handoff and test time/money. What passes in simulation may not necessarily pass in silicon on tester. There have been a series of contributing factors for this oversight:
The DFT Methodology proposed in this paper is defined into three separate sections:
This section depicts the implementation details, highlighting features and benefits. A. Automated TDL Rules Utility
Figure1. Snapshot of TDL Rules. These rules can be run on individual TDL file/dir B. QC Checklist/Lessons Learned
Figure2. Snapshot of QC Checklist C. Central Document Repository
Figure3. Snapshot of Document Repository. I I I. Conclusions In this paper presents DFT-PE methodology is presented which minimizes handoff issues between DFT-PE teams and provides workable solution/utility to support early silicon validation:
While the work presented in this paper is focused on WIMAX projects only; most of the rules/score based checklist are generic and can be reused/expanded for include other SoC design projects. Acknowledgement This paper would not have been possible without active contributions from Analog IP, Product Engineering and RED DFT team in resolving all open issues in WiMAX SoC : RED; Silicon validation. Special thanks to Rosal Juan in driving effort from TI Management to brainstorm root cause analysis across different groups and also to Vyagrheswarudu Nainala in showing me good/bad TDL scenario/examples which was useful to me in developing Rule based utility. References [1] Joel G . “Closing the TDL QC Loop on VLCT: Design Simulation of VLCT events” in TI Symposium on Test – 2004 [2] Rosal, J “WIBRO/WIMAX Issues” in TI Wireless Management Review, Dallas May 2007. [3] Stylianos D, Iraklis D and Thanasis O, “A Unified DFT Verification Methodology.” in IPSoC 2005 [4] Siva Y, “Addressing Post Silicon Validation Challenge: Leverage Validation & Test Synergy” in IEEE International Test Conference Oct 25, 2006 BIOGRAPHYPankaj Singh completed his bachelors in electronics from REC Bhopal in 1993; Master’s in electrical engineering from USF, Florida in 1997 and an MBA from SMU, Dallas in 2001. In the past he has worked in various design lead roles such as IP development Manager, functional verification Manager. Currently he is engaged with TI India WTBU organization as WIMAX SoC design Manager B. Appendix Figure4. Post DFT Verification Flow
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