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Today on Design And Reuse
Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications
- August 20, 2026
Socionext Broadens SoC Roadmap with Intel 18A-P Process Technology
- August 20, 2026
Success of three megaprojects hinges on execution
- August 20, 2026
India’s C2S Program Pushes Semiconductor Design Training Toward Silicon
- August 20, 2026
SMIC lifts prices due to AI demand
- August 20, 2026
Samsung Electronics raises advanced foundry prices up to 15%, 4nm line at full capacity: Reuters
- August 20, 2026
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- September 10
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- September 15
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- April 23
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, 2026
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- December 2
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Design IP
Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications
- August 20, 2026
Advanced Analog IP Cores Licensed by Multiple Global Customers for 12nm/22nm SoCs
- August 18, 2026
Arteris: Interview With President And CEO K. Charles Janac About Semiconductor System IP And Network-On-Chip Technology
- August 17, 2026
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Foundry
Socionext Broadens SoC Roadmap with Intel 18A-P Process Technology
- August 20, 2026
The changing role of the foundry
- August 20, 2026
TSMC Doubles Advanced Packaging Capacity Over Three Years, Samsung Goes All-In on 2nm Mass Production
- August 17, 2026
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Business
Success of three megaprojects hinges on execution
- August 20, 2026
India’s C2S Program Pushes Semiconductor Design Training Toward Silicon
- August 20, 2026
SMIC lifts prices due to AI demand
- August 20, 2026
All News >>
Audio / Video
High-Performance Standalone MJPEG IP ‘WAVE-J’ by Chips&Media Widely Adopted Across Diverse Applications
- August 20, 2026
Ceva and Actions Show Off Strengths of Bluetooth HDT in New Audio Chips
- August 20, 2026
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Automotive
BOS Semiconductors Tapes Out Automotive AI Accelerator 'Eagle-N'... Begins Evaluation with German and Chinese Automakers
- August 20, 2026
Next-gen components power safer, smarter vehicles
- August 13, 2026
Automotive Cybersecurity: AI Attack Surfaces Grow
- August 6, 2026
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Artificial Intelligence
SkyeChip's AI expansion to yield meaningful earnings from 2029
- August 20, 2026
BrainChip and Neuromorphyx Announce an AKD1500 Embedded Developer Board, Bringing Neuromorphic AI to the Embedded Engineering Community
- August 20, 2026
European AI factories everywhere, still Nvidia
- August 17, 2026
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RISC-V
StarFive Launches Server-Class RISC-V IP to Accelerate Its Strategic Expansion into AI Computing Infrastructure
- August 20, 2026
Andes Technology’s D23-SE RISC-V Processor Achieves ISO 26262 ASIL‑B and ASIL‑D Certification for Functional Safety Applications
- August 20, 2026
Spain Unveils BER10: Europe’s First RISC-V Chip for Supercomputing
- August 17, 2026
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Design Platform and Service
Silvaco Announces Partnership with Dassault Systèmes to Advance First-Time-Right Semiconductor Manufacturing
- August 20, 2026
Samsung accelerates SoC design in South Korea with Claude, narrowing Qualcomm gap
- August 17, 2026
Racyics and Cloudberry VC give European Fabless Startups a complete Path from Design to Silicon
- August 17, 2026
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Chiplet / Multi-Die
Credo to Contribute OmniConnect Scale-In Interconnect Solution to the Open Compute Project to Address AI Inference Memory Wall
- August 17, 2026
Silicon-Proven D2D Interconnect IP Cores for High-Speed, Scalable Chiplet Connectivity
- August 10, 2026
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- August 3, 2026
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Security
PUFsecurity, subsidiary of eMemory, Advances Hardware-anchored Trust for AI Infrastructure at OCP APAC 2026
- August 13, 2026
Xiphera Achieves ISO/IEC 27001:2022 Certification
- August 10, 2026
BTQ Technologies and ICTK Complete Design of Next-Generation QCIM Security Chip Integrating PUF Technology
- August 6, 2026
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Networking
EnSilica joins European consortium developing 5G satellite user terminals for IRIS network
- August 6, 2026
Wi-Fi 7 & Wi-Fi 6 RF Transceiver IP Portfolio Expanded by T2M for Next-Generation Wireless SoCs
- August 3, 2026
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Internet of Things
Accelerating AI-Powered Wearable Device Development with a Reusable Blueprint
- August 6, 2026
Ceva and Actions Technology Collaborate to Bring Bluetooth HDT Audio Chips to Market
- August 6, 2026
Engineering Matter-ready Home Automation Solutions with Reusable Blueprints
- August 3, 2026
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Processor
Andes Technology and Mirabilis Design Announce Collaboration on System-Level Models for Andes RISC-V Processor IP
- July 28, 2026
D&R Events
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- September 10
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, 2026
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- September 15
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, 2026
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- April 23
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, 2026
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- December 2
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, 2025
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