Company
design-reuse.com
D&R China
Blogs
Industry Articles
D&R Events
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC Days 2021
IP-SoC Days 2020
IP-SoC Days 2019
Videos
Subscribe to D&R SoC News Alert
English
Mandarin
Login
Catalog of SIP Cores
System on Chip design resources
Catalog of SIP Cores
System on Chip design resources
Menu
Home
Search IP Core
News
Blogs
Articles
D&R Events
Videos
Subscribe to D&R SoC News Alert
Login
News
Center
Foundation IP
Analog IP
Interface IP
Interconnect IP
Memory Controller & PHY
Peripheral Controller
Wireless IP
Wireline IP
Processor IP
RISC-V
AI Core
Automotive IP
Security IP
IoT
Media IP
Avionics / Space IP
Verification IP
Verification Platform
Design Platform
Asic & IP Design Center
IP-SoC Days
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC Days 2021
IP-SoC Days 2020
IP-SoC Days 2019
Partner Highlight
New Products
Gigabit Ethernet PHY (1000Base-T)
FortifyIQ Post-Quantum ML-DSA Signature-Verification SW Library configurable: ultra-compact or high performance
5GHz to 13.5GHz Phase Locked Loop (PLL) IP Block GFFDX 22nm FDSOI
OpenGMSL Root IP
Gaussian Error Linear Unit (GELU)
Blogs
UALink over UCIe 3.0: Maximizing Performance for Chiplet-based Designs
Mundru Sriram Bhaskar Teja
Siemens EDA
From Bug Hunting to Engineering Methodology: Lessons from AI-Driven Development
Alexandre Manuel and Julia Baucher
Arteris
How AI can help defend against future quantum attacks
PQShield
Can Remote Equipment Monitoring Move Beyond Alerts to Autonomous Action?
Darshil Shah
MosChip Technologies, USA
Trust Continuity: Securing SoCs and Chiplets from Design to Deployment and Beyond
Secure-IC
Why Hardware Root of Trust Matters
Reija Stenroos
Xiphera Ltd
JPEG XS in MXF: How China's New UHD Broadcasting Standard Puts Visually Lossless Compression at the Core of 8K Delivery
intoPIX
KiviPQC-DSA Tiny vs Fast: Area or performance for hardware ML-DSA
KiviCore
One Processor, One Toolchain
Lee Vick
Quadric
UFS 5.0: Redefining Storage Performance for the AI Era
Arasan Chip Systems Inc.
Chiplets Are Sparking an IC Design Revolution
Alistair Winning, Mouser Electronics
Accelerating Physical AI Through Cadence Silicon Solutions and Arm Total Design
Mick Posner
Cadence Design Systems, Inc.
Articles
Directory-Based Coherency at Scale: From 8 Cores to 256 Agents
Signature IP Corporation
Clock Domain Crossing Sign-Off with Microarchitecture Analysis: 20X Better Precision
Vikas Sachdeva, Sr. Director
Real Intent
Coherent vs Non-Coherent Fabrics: Choosing the Right NoC for Your SoC
Signature IP Corporation
Multiple neuromorphic chips, one grid, no new middleware
Nikunj Kotecha
BrainChip
Harnessing the power of AMBA CHI: The Protocol Powering Modern CPU Clusters
Signature IP Corporation
Why Open-Source Software Is Essential in the Software-Defined Vehicle Era
Hisao Munakata
Renesas
Detect, Diagnose, and Debug using Sensors and Functional Monitoring
Siemens EDA and Movellus
Siemens EDA
Practical AI Silicon on Mainstream Node using LPDDR
OPENEDGES Technology, Inc.
From Specification to Silicon: Using PUFrt to Address Caliptra Root of Trust Integration Challenges
eMemory Technology Inc.
Cache Coherency 101: Why It Matters in Multi-Core SoCs
Signature IP Corporation
Why SoC Interconnects Have Outgrown the Bus
SignatureIP Engineering Team
Signature IP Corporation
High-Speed SerDes Design: Architecture, Equalization, and CDR Circuits
Vivek Babu Avuri
MosChip Technologies, USA
Search IP
16,000 IP Cores
from 450 Vendors
Special IP Request
Provider List
Asic Technology
Select your target foundry and technology
TSMC
Samsung
GlobalFoundries
SMIC
CSMC
DBHiTek
HHGrace
Intel
LFoundry
Silterra
SkyWater
STMicroelectronics
Tower
UMC
VIS
X-FAB
XMC
Search Hardened IP
FPGA and eFPGA Corner
Select your target vendor and device
All
Xilinx AMD
Menta
Altera
Rapid Flex
Rapid Silicon
Microchip
Actel
Efinix
Lattice
Quicklogic
Achronix
Search IP
Today on Design And Reuse
Silicon-Proven Bluetooth® 6.3 RF IP Cores for Next-Generation Advanced Wireless SoCs - T2M
- October 5, 2026
Rapidus Unveils "Rapidus CORE", New Global Ecosystem Framework Supporting the Development and Mass Production of Cutting-Edge Semiconductors
- October 5, 2026
Panther Lake Teardown Shows Intel 18A Near TSMC N3E, Newer TSMC Nodes Still Ahead
- October 5, 2026
Synopsys Earns Five TSMC Open Innovation Platform Partner of the Year Awards for Advancing AI-Driven Semiconductor Innovation
- October 5, 2026
JEDEC® Publishes First Industry-Wide Silicon Photonics Reliability Standard for AI, Datacenter and Telecom Infrastructure
- October 5, 2026
2.5D/3D Integration Challenges: Bare Die Testing
- October 5, 2026
D&R Events
IP-SoC EU 26
- December 8
th
-9
th
, 2026
Registration Open >>
IP-SoC South Korea 26
- September 15
th
, 2026
Now Open !!! >>
IP-SoC China 26
- September 10
th
, 2026
Now Open !!! >>
IP-SoC Silicon Valley 26
- April 23
rd
, 2026
Still Open ! Watch Now >>
All News >>
Networking
Silicon-Proven Bluetooth® 6.3 RF IP Cores for Next-Generation Advanced Wireless SoCs - T2M
- October 5, 2026
Keysight Joins Verizon 6G Innovation Forum to Accelerate Pre-Standard 6G Validation
- September 16, 2026
EnSilica to open Space and Communications Semiconductor Centre of Excellence in Milan
- September 10, 2026
All News >>
Foundry
Rapidus Unveils "Rapidus CORE", New Global Ecosystem Framework Supporting the Development and Mass Production of Cutting-Edge Semiconductors
- October 5, 2026
Panther Lake Teardown Shows Intel 18A Near TSMC N3E, Newer TSMC Nodes Still Ahead
- October 5, 2026
Synopsys Earns Five TSMC Open Innovation Platform Partner of the Year Awards for Advancing AI-Driven Semiconductor Innovation
- October 5, 2026
All News >>
Chiplet / Multi-Die
2.5D/3D Integration Challenges: Bare Die Testing
- October 5, 2026
Racyics UCIe PHY IP for GlobalFoundries 22FDX reaches silicon
- October 1, 2026
SignatureIP Unveils IP Library for Chiplet-based AI, HPC and Data Center Systems at AI Infra Summit 2026
- October 1, 2026
All News >>
Design Platform and Service
Synopsys Expands Agentic AI Across Semiconductor Design With AgentEngineer and Autopilot
- October 5, 2026
OpenAI and Synopsys Announce GPT-Synopsys: Frontier Intelligence to Revolutionize Chip Design
- October 1, 2026
Synopsys and Amazon Announce Strategic, Multi-year IP Agreement for Custom Silicon; Collaboration Also Extends to Cloud and AI-Powered Engineering
- October 1, 2026
All News >>
Artificial Intelligence
Tenstorrent and Smallest.ai Partner to Bring Production-Grade Voice AI On-Prem
- October 5, 2026
SEMIFIVE Signs Turnkey Contract with Mobilint to Develop Robotics AI Chip Under 'K-On-Device AI Semiconductor' Program
- October 5, 2026
Mistral Opens German Hub in Munich to Advance Industrial AI in Europe’s Largest Economy
- October 5, 2026
All News >>
Security
ICTK to Acquire 56.75% Stake in WithNetworks for Security Solutions
- October 5, 2026
FortifyIQ Announces CAVP‑Validated ML‑DSA Post‑Quantum Digital Signature Verification Library
- September 22, 2026
India Hardens Its Cyber Defenses
- September 21, 2026
All News >>
Business
Silvaco CEO Dr. Walden "Wally" Rhines Inducted into the National Academy of Engineering
- October 5, 2026
Renesas Announces Establishment of New Subsidiary and Changes as Specified Subsidiary
- October 5, 2026
Inside Soitec, the French tech company powering the global semiconductor industry
- October 5, 2026
All News >>
Design IP
TES Electronic Solutions Introduces a Low-Power 32 kHz Pierce Oscillator IP for Battery-Powered ASICs and SoCs
- October 1, 2026
eMemory Recognized with TSMC Open Innovation Platform® (OIP) Partner of the Year Award for IP Solutions
- September 29, 2026
Cadence PCIe 6.0 Clears First-Pass Compliance Testing
- September 28, 2026
All News >>
RISC-V
Fraunhofer RISC-V Secure Element Accelerates Secure Chip Development After Successful Silicon Validation
- October 1, 2026
Efinix introduces 64-Bit RISC-V SoC for FPGA-based embedded systems
- October 1, 2026
T2M Advances RISC-V CPU IP Cores Portfolio for Next-Generation AI and Intelligent Edge SoCs
- September 28, 2026
All News >>
Audio / Video
Arasan to demonstrate the industry's first MIPI SWI3S™ IP at the MIPI Member meet in Taipei
- September 30, 2026
New MIPI Alliance Kinematics Working Group to Standardize Streaming Format for Radar and Lidar Sensor Data
- September 16, 2026
Arasan furthers MIPI I3C® compliance with its participation at the I3C® interop in Taipei
- September 10, 2026
All News >>
Green Electronics
EU proposes common rating scheme to drive data centre sustainability
- September 28, 2026
All News >>
Internet of Things
Siemens recognized as a Leader in Gartner Magic Quadrant for Global Industrial AIoT Platforms
- September 24, 2026
All News >>
Automotive
T2M Expands Automotive Semiconductor IP Cores Portfolio for Next-Generation Connected Vehicles
- September 22, 2026
All News >>
Processor
Cadence Tensilica IP Powers Analog Devices’ Next-Generation DSP Architecture
- September 16, 2026
D&R Events
IP-SoC EU 26
- December 8
th
-9
th
, 2026
Registration Open >>
IP-SoC South Korea 26
- September 15
th
, 2026
Now Open !!! >>
IP-SoC China 26
- September 10
th
, 2026
Now Open !!! >>
IP-SoC Silicon Valley 26
- April 23
rd
, 2026
Still Open ! Watch Now >>
Partner Highlight
❮
❯
Latest News Alerts