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SriramK
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Accelerating Multi-Die Innovation: How Synopsys and Samsung are Shaping Chip Design
Amlendu Shekhar Choubey
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IC Manufacturing and Packaging: The Engine Powering the Digital and AI World
P R Sivakumar
Maven Silicon
Working in electronics engineering
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Agile Analog
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BrainChip Inc.
Bridging the Gap to Chiplet Interoperability
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Arteris
Rambus Announces Industry-Leading Ultra Ethernet Security IP Solutions for AI and HPC
Rambus, Inc.
AI is stress-testing processor architectures and RISC-V fits the moment
Marc Evans
Andes Technology Corp.
How Analogix utilized Solido SPICE to overcome verification challenges in creating high-quality PLLs
Lih-Jen Hou
Siemens Digital Industries Software
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Dana Neustadter, Vincent van der Leest
Synopsys, Inc.
Creating a Frequency Plan for a System using a PLL
Julian Jenkins
Perceptia Devices
PUF-PQC Integrated with PUFrt to Solve PPA Challenge for SoCs
eMemory & PUFsecurity
eMemory Technology Inc.
From Silos to Systems, from Data to Insight
Keysight Technologies
Security certification and the crucial role of anti-tamper sensor solutions
Chris Morrison
Agile Analog
Beyond the Core: Tackling system-wide debugging for complex SoCs with Tessent UltraSight
Francisca Tan, Senior Product Manager
Siemens EDA
Three Ethernet Design Challenges in Industrial Automation
Key ASIC
ST silicon photonics and BiCMOS technologies: the winning portfolio for AI optical interconnects
STMicroelectronics
AI in VLSI Physical Design: Opportunities and Challenges
Japesh Kumar, Qualcomm
AI-Driven and Traditional Approaches to Accident Scenario Reconstruction
Nitin Swamy
Vayavya Labs
From Theory to the Field: Why Side-Channel Protection Defines Post-Quantum Security
PQSecure Technologies
PCIe 5.0: The universal high-speed interconnect for High Bandwidth and Low Latency Applications Design Challenges & Solutions
Innosilicon Technology Ltd
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Today on Design And Reuse
CAST Demonstrates IP Cores for Leading-Edge Technologies at Embedded World 2026
- March 9, 2026
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- March 9, 2026
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- March 9, 2026
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- September 11
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Business
CAST Demonstrates IP Cores for Leading-Edge Technologies at Embedded World 2026
- March 9, 2026
QuickLogic Reports Fiscal Fourth Quarter and Full Year 2025 Financial Results
- March 5, 2026
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Artificial Intelligence
Nvidia Advances AI-Native Strategy at MWC
- March 9, 2026
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- March 5, 2026
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- March 2, 2026
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Internet of Things
Is Your IoT Strategy Ready for the New Landscape?
- March 9, 2026
Nordic Semiconductor Expands Cellular IoT Portfolio
- March 9, 2026
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- March 2, 2026
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Processor
STMicroelectronics’ new STM32 series redefines entry-level microcontroller performance and value for smart devices everywhere
- March 9, 2026
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- March 2, 2026
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RISC-V
The path to RISC-V growth: Why software consistency is becoming crucial
- March 9, 2026
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- March 5, 2026
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Design Platform and Service
Linaro, Arm Launch CoreCollective Open Consortium
- March 9, 2026
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- March 4, 2026
Siemens accelerates integrated circuit design and verification with agentic AI in Questa One
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Foundry
Global 2nm Supply Crunch: TSMC Leads as Intel 18A, Samsung, and Rapidus
- March 9, 2026
Rapidus to Make Chips for Canon, Synopsys on Trial
- March 9, 2026
Intel CEO embraces its 18A node for external customers as 18A-P gets 'inbound interest' — company cites increasing yields
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Green Electronics
Infineon and UMC partner in driving decarbonization across the supply chain
- March 5, 2026
EU approves €3B German State aid for cleantech manufacturing
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Automotive
Infineon expands DRIVECORE portfolio with three new software bundles, accelerating customer transition toward future RISC‑V automotive microcontrollers
- March 5, 2026
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- March 5, 2026
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Security
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- March 5, 2026
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Design IP
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- March 3, 2026
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Networking
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Chiplet / Multi-Die
GUC Announces Tape-out of UCIe 64G IP on TSMC N3P Technology
- February 26, 2026
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- February 23, 2026
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- February 19, 2026
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