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Today on Design And Reuse
Perceptia Releases Design Kit for pPLL03 on Samsung Foundry 14LPU Platform
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- August 24, 2026
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Business
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Automotive
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Artificial Intelligence
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RISC-V
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- August 24, 2026
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- August 20, 2026
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Chiplet / Multi-Die
proteanTecs Unveils Advanced Packaging Solutions to Improve Yield, Performance, and Reliability of Multi-Die Systems
- August 24, 2026
Credo to Contribute OmniConnect Scale-In Interconnect Solution to the Open Compute Project to Address AI Inference Memory Wall
- August 17, 2026
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Foundry
Rapidus Targets 8-Reticle Interposers on 600 mm Advanced Packaging Panels by 2030
- August 24, 2026
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- August 24, 2026
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- August 20, 2026
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Design Platform and Service
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- August 20, 2026
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Processor
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