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Hardware security verification must go beyond functional testing
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Today on Design And Reuse
A scalable, shader-programmable vector graphics GPU core for low-power MCUs
- August 27, 2026
Synopsys Posts Financial Results for Third Quarter Fiscal Year 2026
- August 27, 2026
Integrated Photonics for Wireless Applications: Enabling Free-Space Optics, 6G, and Beyond
- August 27, 2026
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- August 27, 2026
Korea's AI ambition faces power crunch
- August 27, 2026
Baya Systems Expands to Japan to Support Next-Generation AI Semiconductor Design
- August 27, 2026
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- September 10
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- September 15
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- April 23
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- December 2
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Audio / Video
A scalable, shader-programmable vector graphics GPU core for low-power MCUs
- August 27, 2026
High-Performance Standalone MJPEG IP ‘WAVE-J’ by Chips&Media Widely Adopted Across Diverse Applications
- August 20, 2026
Ceva and Actions Show Off Strengths of Bluetooth HDT in New Audio Chips
- August 20, 2026
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Business
Synopsys Posts Financial Results for Third Quarter Fiscal Year 2026
- August 27, 2026
SK Hynix Next-Gen HBM Memory to Use Intel EMIB-T Packaging
- August 26, 2026
SEMICON India 2026 targets full chip value chain
- August 24, 2026
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Networking
Achronix Announces Availability of High-Performance JESD204C IP Core for Speedster7t FPGAs
- August 27, 2026
LTE Cat 1bis IP Cores for Next-Generation Cellular IoT SoC Development
- August 26, 2026
EnSilica joins European consortium developing 5G satellite user terminals for IRIS network
- August 6, 2026
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Artificial Intelligence
Korea's AI ambition faces power crunch
- August 27, 2026
Baya Systems Expands to Japan to Support Next-Generation AI Semiconductor Design
- August 27, 2026
BrainBoard1500 brings neuromorphic AI to embedded developers
- August 27, 2026
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RISC-V
RISC-V extensions for high performance embedded computing
- August 27, 2026
SiFive Paves the Path to Accelerated Adoption of RISC-V in the Datacenter with the BigSky Development Server
- August 27, 2026
Alibaba’s RISC-V Chip Runs 27B AI Model Without a GPU
- August 24, 2026
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Foundry
UMC Shares Climb 6% on AI Foundry Investment Defying Market’s Semiconductor Downturn
- August 27, 2026
TSMC’s HBM-Packaging Yield Issues Help Intel, Analysts Say
- August 27, 2026
Rapidus Targets 8-Reticle Interposers on 600 mm Advanced Packaging Panels by 2030
- August 24, 2026
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Design IP
Perceptia Releases Design Kit for pPLL03 on Samsung Foundry 14LPU Platform
- August 24, 2026
Synopsys Rolls Out First Complete CXL 4.0 IP for AI Memory Connectivity
- August 24, 2026
Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications
- August 20, 2026
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Automotive
TIER IV and Renesas target AI-native SDV platform
- August 24, 2026
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- August 20, 2026
Next-gen components power safer, smarter vehicles
- August 13, 2026
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Chiplet / Multi-Die
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- August 24, 2026
Credo to Contribute OmniConnect Scale-In Interconnect Solution to the Open Compute Project to Address AI Inference Memory Wall
- August 17, 2026
Silicon-Proven D2D Interconnect IP Cores for High-Speed, Scalable Chiplet Connectivity
- August 10, 2026
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Design Platform and Service
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- August 20, 2026
Samsung accelerates SoC design in South Korea with Claude, narrowing Qualcomm gap
- August 17, 2026
Racyics and Cloudberry VC give European Fabless Startups a complete Path from Design to Silicon
- August 17, 2026
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Security
PUFsecurity, subsidiary of eMemory, Advances Hardware-anchored Trust for AI Infrastructure at OCP APAC 2026
- August 13, 2026
Xiphera Achieves ISO/IEC 27001:2022 Certification
- August 10, 2026
BTQ Technologies and ICTK Complete Design of Next-Generation QCIM Security Chip Integrating PUF Technology
- August 6, 2026
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Internet of Things
Accelerating AI-Powered Wearable Device Development with a Reusable Blueprint
- August 6, 2026
Ceva and Actions Technology Collaborate to Bring Bluetooth HDT Audio Chips to Market
- August 6, 2026
Engineering Matter-ready Home Automation Solutions with Reusable Blueprints
- August 3, 2026
D&R Events
IP-SoC China 26
- September 10
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, 2026
Registration Open >>
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IP-SoC South Korea 26
- September 15
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, 2026
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- April 23
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, 2026
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IP-SoC EU 25
- December 2
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-3
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, 2025
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