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Mick Posner
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Engineering FPGA Products: Moving Beyond RTL
MosChip Technologies, USA
Mastering Semiconductor Chip Design: Tools, Techniques, and Best Practices
Anupam Bakshi
Agnisys, Inc.
Trusted AI Agents Must Be Anchored in Silicon
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Two AI Brains Are Better Than One
Nikunj Kotecha
BrainChip
Can Smart Factory Solutions Solve the Visibility Challenges Created by Legacy Systems?
Sombabu Gunithi
MosChip Technologies, USA
Why perfect crypto inventory stalls quantum readiness
PQShield
Scaling Sandboxed Agentic AI on Xeon CPUs
Nithya Rao
BEVFormer-Tiny on Chimera: Bird's-Eye-View Perception in One GPNPU Kernel
Quadric
Heterogeneous Computing in Space
Dr. Jonathan Tapson
BrainChip
SerDes, Ethernet and the silicon that connects them: Why SerDes for high-bandwidth sensors?
Yuichi Motohashi
GlobalFoundries
Tape-Out Readiness Checklist: Engineering Decisions That Prevent Costly Respins
Raghuveer Reddy
MosChip Technologies, USA
Articles
Breaking the Memory Bottleneck in AI and HPC SoCs
Rahul Thukral, Niranjan Behera
Synopsys, Inc.
Directory-Based Coherency at Scale: From 8 Cores to 256 Agents
Signature IP Corporation
Clock Domain Crossing Sign-Off with Microarchitecture Analysis: 20X Better Precision
Vikas Sachdeva, Sr. Director
Real Intent
Coherent vs Non-Coherent Fabrics: Choosing the Right NoC for Your SoC
Signature IP Corporation
Multiple neuromorphic chips, one grid, no new middleware
Nikunj Kotecha
BrainChip
Harnessing the power of AMBA CHI: The Protocol Powering Modern CPU Clusters
Signature IP Corporation
Why Open-Source Software Is Essential in the Software-Defined Vehicle Era
Hisao Munakata
Renesas
Detect, Diagnose, and Debug using Sensors and Functional Monitoring
Siemens EDA and Movellus
Siemens EDA
Practical AI Silicon on Mainstream Node using LPDDR
OPENEDGES Technology, Inc.
From Specification to Silicon: Using PUFrt to Address Caliptra Root of Trust Integration Challenges
eMemory Technology Inc.
Cache Coherency 101: Why It Matters in Multi-Core SoCs
Signature IP Corporation
Why SoC Interconnects Have Outgrown the Bus
SignatureIP Engineering Team
Signature IP Corporation
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Today on Design And Reuse
Tenstorrent Announces a $1.5B Series E at a $6.2B valuation
- October 19, 2026
T2M Showcasing WhiteBox Semiconductor IP Cores Portfolio at ICCAD 2026 – Visit Booth L074
- October 19, 2026
IBM and Siemens team up to advance 3D nanostack chip technology
- October 19, 2026
TSMC to Double 2nm Production Capacity by 2027, Widening Gap with Samsung Foundry to 66.6 Percentage Points
- October 19, 2026
Samsung May Acquire a Silicon Photonics Company to Challenge TSMC
- October 19, 2026
How Chiplets Could Transform Server Design – And Data Centers
- October 19, 2026
D&R Events
IP-SoC EU 26
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- September 15
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IP-SoC China 26
- September 10
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, 2026
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IP-SoC Silicon Valley 26
- April 23
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, 2026
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Business
Tenstorrent Announces a $1.5B Series E at a $6.2B valuation
- October 19, 2026
intoPIX to Demonstrate JPEG XS, IPMX and SMPTE ST 2110 Solutions at NAB Show New York 2026
- October 19, 2026
Q1 FY27 Report: Second customer begins silicon validation as Weebit advances commercialization
- October 19, 2026
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Foundry
IBM and Siemens team up to advance 3D nanostack chip technology
- October 19, 2026
TSMC to Double 2nm Production Capacity by 2027, Widening Gap with Samsung Foundry to 66.6 Percentage Points
- October 19, 2026
Samsung May Acquire a Silicon Photonics Company to Challenge TSMC
- October 19, 2026
All News >>
Chiplet / Multi-Die
How Chiplets Could Transform Server Design – And Data Centers
- October 19, 2026
ForwardEdge ASIC Announces UCIe 3.0 IP Solution to Accelerate Next-Generation Chiplet-Based ASIC Innovation
- October 15, 2026
Chiplets at the Edge: How Modular SoCs Redefine Performance Per Watt
- October 12, 2026
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RISC-V
Tenstorrent at The Open Frontier: RISC-V Everywhere
- October 19, 2026
Quintauris and Microchip Technology join forces to grow RISC-V® adoption
- October 15, 2026
Fraunhofer RISC-V Secure Element Accelerates Secure Chip Development After Successful Silicon Validation
- October 1, 2026
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Artificial Intelligence
As AI transforms organizations, more clear processes become even more important
- October 19, 2026
INTERA to Showcase Edge AI Accelerator IPs at SEMICON 2026 – Booth C2119
- October 15, 2026
INTERA Launches EAGLE Cognit, Bringing Ultra-Low-Power Near-Memory AI Acceleration to Next-Generation Edge Devices
- October 15, 2026
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Design Platform and Service
Siemens extends next-generation data acquisition portfolio for modern physical testing with Simcenter SCADAS ES
- October 15, 2026
Siemens’ Tessent ecosystem enables direct test pattern execution via PCIe and USB
- October 15, 2026
Siemens’ Tessent ecosystem enables direct test pattern execution via PCIe and USB
- October 14, 2026
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Processor
Intel Refers to its 3D V-Cache Analog as "BFC"
- October 15, 2026
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Security
Marvell, Microsoft and Oracle Establish OCP Working Group to Standardize Data Center Hardware Security
- October 15, 2026
PUFsecurity Puts Silicon Root of Trust at the Center of AI Agent Security
- October 15, 2026
Lattice Semiconductor partners with Arm on AI server security
- October 12, 2026
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Audio / Video
intoPIX to Demonstrate JPEG XS, IPMX and SMPTE ST 2110 Solutions at NAB Show New York 2026
- October 15, 2026
Faraday Powers Intelligent Sensing with New 14nm MIPI C/D Combo PHY IP
- October 13, 2026
Chips&Media Expands Beyond Traditional Video Codecs to Become a Multimedia IP Leader… Unveiling the ‘Data Compression (Feature Map Compression) IP’ to Resolve NPU Bottlenecks
- October 6, 2026
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eFPGA / FPGA
QuickLogic Secures Six-Figure eFPGA IP Contract for Automotive Industrial SoC
- October 13, 2026
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Automotive
ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools
- October 8, 2026
T2M Expands Automotive Semiconductor IP Cores Portfolio for Next-Generation Connected Vehicles
- September 22, 2026
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Networking
Silicon-Proven Bluetooth® 6.3 RF IP Cores for Next-Generation Advanced Wireless SoCs - T2M
- October 5, 2026
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Design IP
TES Electronic Solutions Introduces a Low-Power 32 kHz Pierce Oscillator IP for Battery-Powered ASICs and SoCs
- October 1, 2026
eMemory Recognized with TSMC Open Innovation Platform® (OIP) Partner of the Year Award for IP Solutions
- September 29, 2026
Cadence PCIe 6.0 Clears First-Pass Compliance Testing
- September 28, 2026
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Green Electronics
EU proposes common rating scheme to drive data centre sustainability
- September 28, 2026
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Internet of Things
Siemens recognized as a Leader in Gartner Magic Quadrant for Global Industrial AIoT Platforms
- September 24, 2026
D&R Events
IP-SoC EU 26
- December 8
th
-9
th
, 2026
Registration Open >>
IP-SoC South Korea 26
- September 15
th
, 2026
Now Open !!! >>
IP-SoC China 26
- September 10
th
, 2026
Now Open !!! >>
IP-SoC Silicon Valley 26
- April 23
rd
, 2026
Still Open ! Watch Now >>
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