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Today on Design And Reuse
Chip Foundry TSMC Says Its Sales Rose 22% In February
- March 16, 2026
Soitec and NSIG to agree extension of licensing framework
- March 16, 2026
Reshaping the technology landscape in Europe
- March 16, 2026
SEMIFIVE Signs Turnkey Design Contract Worth KRW 18,000 Million With AI Semiconductor Fabless Company
- March 16, 2026
GlobalFoundries Announces Pricing of Public Secondary Offering and Concurrent Share Repurchase
- March 16, 2026
Silvaco Reports Fourth Quarter and Full-Year 2025 Financial Results
- March 16, 2026
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- December 2
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, 2025
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- September 16
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- September 11
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, 2025
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Business
Chip Foundry TSMC Says Its Sales Rose 22% In February
- March 16, 2026
Reshaping the technology landscape in Europe
- March 16, 2026
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- March 16, 2026
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Networking
Keysight Introduces New 224G Test Solutions to Enable 1.6T Optical Network Validation
- March 16, 2026
CAST Debuts TSN-EP-10G IP for High-Performance, Time-Sensitive Networking Ethernet Designs
- March 12, 2026
Ceva Launches Next-Generation UWB IP with Extended Range and Higher Throughput
- March 10, 2026
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Artificial Intelligence
Ceva’s NeuPro-Nano NPU Wins Artificial Intelligence Award at embedded world 2026
- March 16, 2026
BrainChip Enables the Next Generation of Always-On Wearables with the AkidaTag© Reference Platform
- March 16, 2026
Klepsydra Technologies and BrainChip Announce Strategic Partnership to Deliver Heterogeneous AI Runtime for Akida™ Neuromorphic Processors
- March 16, 2026
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Chiplet / Multi-Die
Faster and more energy-efficient electronics with 3D chip design
- March 16, 2026
GUC Announces Tape-out of UCIe 64G IP on TSMC N3P Technology
- February 26, 2026
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- February 23, 2026
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Design Platform and Service
AI Chip Design From Heilbronn
- March 16, 2026
TES Unveils High-Performance 8/40MHz Oscillator and Clock Buffer IPs for Reliable On-Chip Timing Solutions for X-FAB XT018 - 0.18µm BCD-on-SOI technology.
- March 12, 2026
Movellus Partners with Synopsys to Deliver Power Efficiency for Next Generation IC’s
- March 12, 2026
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Foundry
IBM, Lam Research Focus High-NA EUV on Sub-1-nm Nodes
- March 16, 2026
Samsung Applies 2nm Process to HBM Memory
- March 12, 2026
Global 2nm Supply Crunch: TSMC Leads as Intel 18A, Samsung, and Rapidus
- March 9, 2026
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RISC-V
RISC-V TDS350N IP Core: A55-Class Performance, AI Acceleration processor for AI and ML Scenarios
- March 13, 2026
Samsung to Make Ubitium’s Universal RISC-V Processor
- March 12, 2026
The path to RISC-V growth: Why software consistency is becoming crucial
- March 9, 2026
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Design IP
Movellus Advanced Clocking IP Selected for QuickLogic’s Strategic Radiation Hardened FPGA Program
- March 12, 2026
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- March 5, 2026
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- March 3, 2026
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Automotive
GlobalFoundries Announces Availability of AutoPro150 eMRAM Technology on Enhanced FDX Platform for Advanced Automotive Applications
- March 12, 2026
Infineon expands DRIVECORE portfolio with three new software bundles, accelerating customer transition toward future RISC‑V automotive microcontrollers
- March 5, 2026
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Audio / Video
Hexagon Semi’s HX77 AR Display Processor Achieves Ultra-Low Power Consumption with VeriSilicon’s Nano IP Portfolio
- March 12, 2026
Allegro DVT Launches DWP300 DeWarp Semiconductor IP
- March 12, 2026
Silvaco Announces Immediate Availability of Production Ready Mixel MIPI PHY IP, Strengthening its Comprehensive Silicon IP Offering
- March 12, 2026
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Security
A CHERI on Top: A Better Way to Build Embedded Secure SoCs
- March 12, 2026
Microservice Store Launches the IoT Transparency Portal: Transparent view of SBOM, and live vulnerability status.
- March 10, 2026
Kudelski Labs Addresses Device Lifecycle Security, Edge AI, Post Quantum Cryptography and Regulatory Compliance at Embedded World 2026
- March 5, 2026
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Internet of Things
Is Your IoT Strategy Ready for the New Landscape?
- March 9, 2026
Nordic Semiconductor Expands Cellular IoT Portfolio
- March 9, 2026
Microservice Store Launches Security Support Partnership Program
- March 2, 2026
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Processor
STMicroelectronics’ new STM32 series redefines entry-level microcontroller performance and value for smart devices everywhere
- March 9, 2026
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- March 2, 2026
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Green Electronics
Infineon and UMC partner in driving decarbonization across the supply chain
- March 5, 2026
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- April 23
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- December 2
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- September 16
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- September 11
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