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Today on Design And Reuse
TSMC Invests $1 Billion in OpenAI, Anthropic
- November 12, 2026
"Competition Is Already Fierce": Japan’s Rapidus Faces Concerns Over Delayed 2nm Mass Production, With Returns on Massive Government Investment Uncertain
- November 12, 2026
Andes Technology Names Parasoft as Partner of the Year for Advancing RISC-V Automotive Functional Safety and Software Quality
- November 12, 2026
Synopsys Advances Virtual Development of Next-Generation Automotive and Physical AI Applications with Infineon AURIX™ RC1 Microcontroller Family
- November 12, 2026
Tenstorrent is lobbying Ottawa for data-centre funding and sovereign AI contracts
- November 12, 2026
Intel and Altera simplify sensor integration for edge and physical AI
- November 12, 2026
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- September 15
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- September 10
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- April 23
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Foundry
TSMC Invests $1 Billion in OpenAI, Anthropic
- November 12, 2026
"Competition Is Already Fierce": Japan’s Rapidus Faces Concerns Over Delayed 2nm Mass Production, With Returns on Massive Government Investment Uncertain
- November 12, 2026
FD-SOI, challenging 7nm, what makes it possible?
- November 9, 2026
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RISC-V
Andes Technology Names Parasoft as Partner of the Year for Advancing RISC-V Automotive Functional Safety and Software Quality
- November 12, 2026
Andes Technology Introduces Next-Generation Andes Automated Custom Extension to Simplify Domain-Specific RISC-V Processor Innovation
- November 10, 2026
Infineon’s RISC-V AURIX platform is a major win for MIPS and GlobalFoundries
- November 9, 2026
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Automotive
Synopsys Advances Virtual Development of Next-Generation Automotive and Physical AI Applications with Infineon AURIX™ RC1 Microcontroller Family
- November 12, 2026
DAMO Academy's XuanTie E908A Is an Automotive RISC-V CPU IP Aimed at ASIL-B and ASIL-D Designs
- October 22, 2026
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Artificial Intelligence
Tenstorrent is lobbying Ottawa for data-centre funding and sovereign AI contracts
- November 12, 2026
Intel and Altera simplify sensor integration for edge and physical AI
- November 12, 2026
Arm expands Arm Flexible Access and Arm Total Access portfolios with new Arm Cortex-M42 to accelerate edge AI innovation
- November 12, 2026
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Business
Ceva Retains Leadership in Wireless Connectivity IP Market
- November 12, 2026
QuickLogic Reports Fiscal Third Quarter 2026 Financial Results
- November 12, 2026
Sunplus Monthly Consolidated Sales Report - October 2026
- November 12, 2026
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Design IP
Qualitas Semiconductor and Mobilint Collaborate on Integrated IP Solutions for NPU-Based AI SoCs
- November 11, 2026
T2M Introduces Wi-Fi 7 and Bluetooth Combo RF IP Cores to Accelerate Development of Connected AI and XR SoCs
- November 10, 2026
VeriSilicon Launches GCNanoOptimaV, a Next-Generation 2.5D GPU IP for Wearables
- November 5, 2026
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Design Platform and Service
Cadence OrCAD Xplore Design Platform Unifies Design, Component Intelligence and Procurement to Accelerate Electronics System Development
- November 10, 2026
Synopsys Expands Access to Advanced Chip Design Capabilities Through European Chips Design Platform
- November 5, 2026
Cadence Introduces Maestro, a Domain-Specialized AI Model Portfolio to Revolutionize Agentic Chip and System Design
- October 28, 2026
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Chiplet / Multi-Die
Fraunhofer IPMS advances chiplet integration and low-power memory
- November 9, 2026
Russia Registers New Tensor Chiplet as Moscow Pushes for Semiconductor Independence
- November 9, 2026
Tenstorrent Releases Open Source Beta of the Open Chiplet Atlas® (OCA) Harness
- October 26, 2026
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Security
Siemens and the Charter of Trust bring government and industry leaders together to advance collective cyber defense
- November 9, 2026
Kudelski Labs and u-blox Expand Strategic Collaboration to Deliver Next-Generation Secure Semiconductor Platforms
- November 5, 2026
ICTK Gears Up Security Chips for PQC Transition, Teams Up with Pukyong National University to Develop Engine Supporting Korea’s KpqC
- November 5, 2026
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Networking
Faraday Accelerates AI-Driven Manufacturing and Humanoid Robotics with EtherCAT-Compliant Ethernet PHY IP
- November 5, 2026
Ceva and Mobilint Advance Physical AI with REGULUS Edge AI SoC
- November 2, 2026
Taming the AI Training Beast: Why Ethernet Will Write the Next Chapter of AI
- October 22, 2026
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Internet of Things
Linkpower Brings Bluetooth LE Connectivity to Industrial MCUs with Ceva-Waves IP
- November 5, 2026
NSING Technologies Surpasses 250 Million Bluetooth Chips Shipped Powered by Ceva Technology
- November 5, 2026
Nordic brings edge AI to battery-powered Wi-Fi devices, achieving twenty times lower standby power with new nRF71 Series
- November 5, 2026
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Audio / Video
VeriSilicon Introduces GLTiny™ 3D GPU Programming Model for Ultra-Low-Power, Memory-Efficient Wearable Devices
- November 2, 2026
Alliance for Open Media Sees Rapid AV2 Adoption Across the Video Ecosystem Just Four Months After Release
- October 26, 2026
D&R Events
IP-SoC EU 26
- December 8
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, 2026
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- September 15
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, 2026
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- September 10
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, 2026
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IP-SoC Silicon Valley 26
- April 23
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, 2026
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