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Today on Design And Reuse
Analog Bits to Participate in a Customer Test Chip Tapeout on TSMC A14 and Present Papers with Cerebras, Arm and Socionext on Real-Time On-Chip Power Sensing and Delivery at 2026 TSMC Global OIP Ecosystem Events
- September 21, 2026
Altera and Rutronik partner to broaden FPGA availability across Europe
- September 21, 2026
TDK-Micronas adopts Aniah’s AI-powered OneCheck® platform to advance automotive semiconductor development
- September 21, 2026
India Hardens Its Cyber Defenses
- September 21, 2026
ICTK Partners with Jiran Security to Drive Post-Quantum Cryptography (PQC) Migration
- September 21, 2026
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- September 21, 2026
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Design IP
Analog Bits to Participate in a Customer Test Chip Tapeout on TSMC A14 and Present Papers with Cerebras, Arm and Socionext on Real-Time On-Chip Power Sensing and Delivery at 2026 TSMC Global OIP Ecosystem Events
- September 21, 2026
Significant Performance Gains Reinforce Imagination’s GPU-First Strategy
- September 21, 2026
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- September 21, 2026
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Business
Altera and Rutronik partner to broaden FPGA availability across Europe
- September 21, 2026
M31 Expands Rambus Collaboration, Strengthening Its One-Stop MIPI Subsystem Solution
- September 18, 2026
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- September 16, 2026
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Design Platform and Service
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- September 21, 2026
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- September 21, 2026
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Security
India Hardens Its Cyber Defenses
- September 21, 2026
ICTK Partners with Jiran Security to Drive Post-Quantum Cryptography (PQC) Migration
- September 21, 2026
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Artificial Intelligence
Programmable, ultra-low-power photonic circuits for artificial intelligence
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- September 21, 2026
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RISC-V
S2C Named Andes Technology’s 2026 Partner of the Year
- September 21, 2026
Andes Technology Honors Quintauris as 2026 Partner of the Year
- September 16, 2026
SiFive and AMD Collaborate to Optimize AMD ROCm on RISC-V Datacenter Servers
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Foundry
GlobalFoundries and Marvell expand collaboration for next-generation optical connectivity
- September 21, 2026
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- September 21, 2026
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Processor
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Audio / Video
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- September 16, 2026
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Chiplet / Multi-Die
Arteris Accelerates Industry Transition to Multi-Die Chiplet-Based Architecture
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- September 14, 2026
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- September 3, 2026
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Automotive
Keysight Collaborates with the Centre for Assuring Autonomy at the University of York to Advance AI Safety Assurance for Software-Defined Vehicles
- September 7, 2026
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Internet of Things
Why semiconductors are critical to the future of IoT
- September 7, 2026
LG Electronics Taps Samsung Foundry for AI Home Chips
- September 3, 2026
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eFPGA / FPGA
QuickLogic Unveils Next-Generation eFPGA Hard IP for GlobalFoundries 12LP
- September 2, 2026
D&R Events
IP-SoC EU 26
- December 8
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IP-SoC South Korea 26
- September 15
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- September 10
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, 2026
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, 2026
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