Company
design-reuse.com
D&R China
Blogs
Industry Articles
D&R Events
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC Days 2021
IP-SoC Days 2020
IP-SoC Days 2019
Videos
Subscribe to D&R SoC News Alert
English
Mandarin
Login
Catalog of SIP Cores
System on Chip design resources
Catalog of SIP Cores
System on Chip design resources
Menu
Home
Search IP Core
News
Blogs
Articles
D&R Events
Videos
Subscribe to D&R SoC News Alert
Login
News
Center
Foundation IP
Analog IP
Interface IP
Interconnect IP
Memory Controller & PHY
Peripheral Controller
Wireless IP
Wireline IP
Processor IP
RISC-V
AI Core
Automotive IP
Security IP
IoT
Media IP
Avionics / Space IP
Verification IP
Verification Platform
Design Platform
Asic & IP Design Center
IP-SoC Days
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC Days 2021
IP-SoC Days 2020
IP-SoC Days 2019
Partner Highlight
New Products
PCIe 6.0/5.0 PHY in 8nm, 5nm, 4nm (8LPU, SF5A, SF4X)
200G MACsec HPC Security Module
EAGLE Cognit Edge AI Accelerator IP Low Power Low Latency TinyML Neuromorphic
JPEG XL series
GAIA Edge AI/ML Accelerator IP Series
Blogs
Q&A: What Real-World Projects Reveal About Multi-Die Design
Greg Sorber
Synopsys, Inc.
When the Partner Doesn’t Fit: What Really Goes Wrong in VLSI Design Engagements
SignOff Semiconductors
How to Use AI Agents to Streamline Code Reviews
Rodolphe Gabriel and Julia Baucher
Arteris
Inside the Silicon: Analog Bits N2P2 Test Chip
Analog Bits Inc.
Why Is Manufacturing Data Not Ready to Deliver Manufacturing AI Insights?
Darshil Shah
MosChip Technologies, USA
Multiply Less: Rethinking the Dot Product for Low-Bit Edge AI
Jonathan Tapson
BrainChip
Q&A: Bringing Co-Packaged Optics to AI Infrastructure
Greg Sorber
Synopsys, Inc.
Secure Boot for embedded Linux on Efinix Ti375C529: Getting started with KiviBoot-Linux
KiviCore
Democratizing Chip Design: Empowering the Next Generation of Engineers with RISC-V Expertise
Maven Silicon
Strategies for FPGA to ASIC Migration for Product Teams
Jigar Mori
MosChip Technologies, USA
Are We Ready to Tape Out?” Notes From the Meeting Every ASIC Team Has
SignOff Semiconductors
From Hardware to Application: Understanding the Role of HAL in Embedded Platforms
Pradeep Kumar Chinthala
MosChip Technologies, USA
Articles
Microarchitectural integrity Sign-Off: Finding Hard-to-Detect Bugs at their Source
Lisa Piper, Sr. Director
Real Intent
Breaking the Memory Bottleneck in AI and HPC SoCs
Rahul Thukral, Niranjan Behera
Synopsys, Inc.
Directory-Based Coherency at Scale: From 8 Cores to 256 Agents
Signature IP Corporation
Clock Domain Crossing Sign-Off with Microarchitecture Analysis: 20X Better Precision
Vikas Sachdeva, Sr. Director
Real Intent
Coherent vs Non-Coherent Fabrics: Choosing the Right NoC for Your SoC
Signature IP Corporation
Multiple neuromorphic chips, one grid, no new middleware
Nikunj Kotecha
BrainChip
Harnessing the power of AMBA CHI: The Protocol Powering Modern CPU Clusters
Signature IP Corporation
Why Open-Source Software Is Essential in the Software-Defined Vehicle Era
Hisao Munakata
Renesas
Detect, Diagnose, and Debug using Sensors and Functional Monitoring
Siemens EDA and Movellus
Siemens EDA
Practical AI Silicon on Mainstream Node using LPDDR
OPENEDGES Technology, Inc.
From Specification to Silicon: Using PUFrt to Address Caliptra Root of Trust Integration Challenges
eMemory Technology Inc.
Cache Coherency 101: Why It Matters in Multi-Core SoCs
Signature IP Corporation
Search IP
16,000 IP Cores
from 450 Vendors
Private IP Search
Provider List
Top SIP ?
Asic Technology
Select your target foundry and technology
TSMC
Samsung
Rapidus
GlobalFoundries
SMIC
CSMC
DBHiTek
HHGrace
Intel
LFoundry
Silterra
SkyWater
STMicroelectronics
Tower
UMC
VIS
X-FAB
XMC
Search Hardened IP
FPGA and eFPGA Corner
Select your target vendor and device
All
Xilinx AMD
Menta
Altera
Rapid Flex
Rapid Silicon
Microchip
Actel
Efinix
Lattice
Quicklogic
Achronix
Search IP
Today on Design And Reuse
Infineon’s RISC-V AURIX platform is a major win for MIPS and GlobalFoundries
- November 9, 2026
FD-SOI, challenging 7nm, what makes it possible?
- November 9, 2026
Samsung Foundry Taps Taiwan Partner Faraday to Land 2nm Cloud AI Chip Deal
- November 9, 2026
What Is the Intel 14A PDK 0.9, and Why Does It Matter to Foundry Customers?
- November 9, 2026
Nuclei Releases the NI1000 Series General-Purpose Compute Core with Support for the VME Matrix Extension
- November 9, 2026
Fraunhofer IPMS advances chiplet integration and low-power memory
- November 9, 2026
D&R Events
IP-SoC EU 26
- December 8
th
-9
th
, 2026
Registration Open >>
IP-SoC South Korea 26
- September 15
th
, 2026
Now Open !!! >>
IP-SoC China 26
- September 10
th
, 2026
Now Open !!! >>
IP-SoC Silicon Valley 26
- April 23
rd
, 2026
Still Open ! Watch Now >>
All News >>
RISC-V
Infineon’s RISC-V AURIX platform is a major win for MIPS and GlobalFoundries
- November 9, 2026
Nuclei Releases the NI1000 Series General-Purpose Compute Core with Support for the VME Matrix Extension
- November 9, 2026
MIPS Unveils Actus Platform for Precise, Secure Robotic Motion Control
- November 9, 2026
All News >>
Foundry
FD-SOI, challenging 7nm, what makes it possible?
- November 9, 2026
Samsung Foundry Taps Taiwan Partner Faraday to Land 2nm Cloud AI Chip Deal
- November 9, 2026
What Is the Intel 14A PDK 0.9, and Why Does It Matter to Foundry Customers?
- November 9, 2026
All News >>
Chiplet / Multi-Die
Fraunhofer IPMS advances chiplet integration and low-power memory
- November 9, 2026
Russia Registers New Tensor Chiplet as Moscow Pushes for Semiconductor Independence
- November 9, 2026
Tenstorrent Releases Open Source Beta of the Open Chiplet Atlas® (OCA) Harness
- October 26, 2026
All News >>
Security
Siemens and the Charter of Trust bring government and industry leaders together to advance collective cyber defense
- November 9, 2026
Kudelski Labs and u-blox Expand Strategic Collaboration to Deliver Next-Generation Secure Semiconductor Platforms
- November 5, 2026
ICTK Gears Up Security Chips for PQC Transition, Teams Up with Pukyong National University to Develop Engine Supporting Korea’s KpqC
- November 5, 2026
All News >>
Business
proteanTecs Appoints Head of Cadence Japan Toshifumi Kaneko to Advisory Board
- November 9, 2026
Silvaco Reports Third Quarter 2026 Financial Results
- November 9, 2026
Arteris Announces Financial Results for the Third Quarter and Estimated Fourth Quarter and Updated Full Year 2026 Guidance
- November 9, 2026
All News >>
Artificial Intelligence
First Vietnam–South Korea AI and Semiconductor conference set to open
- November 8, 2026
Weebit Nano takes aim at costly AI challenges of more speed and less power
- November 5, 2026
INTERA Unveils In-Memory Analog Computing for Next-Generation AI Accelerator
- November 3, 2026
All News >>
Design Platform and Service
Synopsys Expands Access to Advanced Chip Design Capabilities Through European Chips Design Platform
- November 5, 2026
Cadence Introduces Maestro, a Domain-Specialized AI Model Portfolio to Revolutionize Agentic Chip and System Design
- October 28, 2026
Rambus and ChipAgents Collaborate to Accelerate Chip Design with Agentic AI
- October 26, 2026
All News >>
Networking
Faraday Accelerates AI-Driven Manufacturing and Humanoid Robotics with EtherCAT-Compliant Ethernet PHY IP
- November 5, 2026
Ceva and Mobilint Advance Physical AI with REGULUS Edge AI SoC
- November 2, 2026
Taming the AI Training Beast: Why Ethernet Will Write the Next Chapter of AI
- October 22, 2026
All News >>
Design IP
VeriSilicon Launches GCNanoOptimaV, a Next-Generation 2.5D GPU IP for Wearables
- November 5, 2026
Silicon-Proven 112G SerDes IP Core with WhiteBox Licensing for China's AI and Networking Market
- October 26, 2026
All News >>
Internet of Things
Linkpower Brings Bluetooth LE Connectivity to Industrial MCUs with Ceva-Waves IP
- November 5, 2026
NSING Technologies Surpasses 250 Million Bluetooth Chips Shipped Powered by Ceva Technology
- November 5, 2026
Nordic brings edge AI to battery-powered Wi-Fi devices, achieving twenty times lower standby power with new nRF71 Series
- November 5, 2026
All News >>
Audio / Video
VeriSilicon Introduces GLTiny™ 3D GPU Programming Model for Ultra-Low-Power, Memory-Efficient Wearable Devices
- November 2, 2026
Alliance for Open Media Sees Rapid AV2 Adoption Across the Video Ecosystem Just Four Months After Release
- October 26, 2026
intoPIX to Demonstrate JPEG XS, IPMX and SMPTE ST 2110 Solutions at NAB Show New York 2026
- October 15, 2026
All News >>
Automotive
DAMO Academy's XuanTie E908A Is an Automotive RISC-V CPU IP Aimed at ASIL-B and ASIL-D Designs
- October 22, 2026
All News >>
Processor
Intel Refers to its 3D V-Cache Analog as "BFC"
- October 15, 2026
All News >>
eFPGA / FPGA
QuickLogic Secures Six-Figure eFPGA IP Contract for Automotive Industrial SoC
- October 13, 2026
D&R Events
IP-SoC EU 26
- December 8
th
-9
th
, 2026
Registration Open >>
IP-SoC South Korea 26
- September 15
th
, 2026
Now Open !!! >>
IP-SoC China 26
- September 10
th
, 2026
Now Open !!! >>
IP-SoC Silicon Valley 26
- April 23
rd
, 2026
Still Open ! Watch Now >>
Partner Highlight
❮
❯
Latest News Alerts