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Thursday, May 14, 2026

• Korean economy projected to expand 2.5% in 2026 on chips: KDI
• TSMC Board of Directors Meeting Resolutions
• eMemory Technology Inc (ROCO:3529) Q1 2026 Earnings Call Highlights: Record Revenue Growth and Strategic Expansion
• QuickLogic Announces New Seven-Figure FPGA Hard IP Contract
• HighTec EDV-Systeme and SiFive: Together strengthening the RISC-V Ecosystem for Safe and Secure Automotive and Industrial Applications
• SiFive Sets New Bar for High-Performance RISC-V with Third-Generation Performance P550 and P570 IP
• OSYX Technologies and Andes Technology Announce Strategic Collaboration on RISC-V Virtualization
• CEA-Leti Platform Offers Chipmakers Nanometre- Scale Strain Mapping
• Siemens democratizes EDA software access for European electronics industry through the Chips JU European Chips Design Platform (EuroCDP) project
• Siemens unveils AI-powered library characterization to accelerate semiconductor design
• LTSCT Expands Advanced Power Design Capabilities with Synopsys
• Apple-Intel Foundry Deal Could Reshape U.S. Chip Manufacturing
• TES Electronic Solutions GmbH is extending its on-chip sensor IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.

Wednesday, May 13, 2026

• Ceva Advances Full-Stack Wireless Vision with Next Generation Bluetooth High Data Throughput and Integrated RF Design Win

Tuesday, May 12, 2026

• EXTOLL announces Availability of Industry´s first 16G UCIe PHY IP in GlobalFoundries 22FDX/22FDX+ Ready for Customer Integration
• Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency
• Chips&Media Completes Development of Next-Gen 'AV2' HW Decoder IP

Monday, May 11, 2026

• SEMIFIVE and ICY Tech Achieve Successful Tape-out of 8nm eMRAM-Based Edge AI SoC, Targeting First Commercialization in Asia
• LPDDR5/LPDDR4X PHY & Controller IP Core in 12FFC Licensed by Tier-1 U.S. Semiconductor Customer
• Malaysia launches advanced semiconductor packaging push to climb global value chain
• UK Semiconductor Centre appoints first CEO
• Intel plans to expand semiconductor investment in Vietnam
• European electronic components market returns to growth amid uneven recovery
• Neuron IP was awarded the 2026 Startup of the Year at the CHIPS NORTH Executive Summit in Ottawa, held May 4–5, 2026, recognizing their innovation in semiconductor technology.
• After GPUs, CPUs Take Center Stage as Intel Rally Lifts KOSDAQ Stocks
• NVIDIA and Corning partner on AI photonics expansion
• Renesas Completes Acquisition of Irida Labs to Expand Vision AI Software Capabilities and Accelerates System-Level Vision Solutions
• Nvidia Enters the Scene. Behind the $400 Million in Financing, RISC-V Ushered in Spring
• HighTec EDV-Systeme and SiFive: Together strengthening the RISC-V Ecosystem for Safe and Secure Automotive and Industrial Applications
• GlobalFoundries Outlines Long-Term Growth Roadmap and Announces First-Ever Dividend at 2026 Investor Day
• Sony Semiconductor Solutions and TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership

Thursday, May 7, 2026

• Siemens and Xometry partner to bring expanded AI-native supply chain intelligence to Siemens Xcelerator
• Accelerate Your Innovation: Why FPGA System on Modules (SoMs) Are the Strategic Choice
• Semidynamics and SiPearl Announce Strategic Cooperation to Develop EU-Sovereign Rack-Scale AI Compute Platform
• AI demand reshapes semiconductor capacity and intensifies supply chain competition
• Lenovo’s New ThinkPad Headset Uses Ceva Spatial Audio to Make Entertainment Content More Immersive and Drive All-Day Use
• Keysight and CATARC New Energy Vehicle Inspection Center Expand Strategic Collaboration to Advance Charging Test Technologies
• Fraunhofer IIS tests high bandwidths for non terrestrial networks (NTN)
• AI drives photonics innovation
• European scientists turn to light to halt internet energy crisis
• Infineon once again listed as a global leader in sustainability Read more at: https://www.bisinfotech.com/infineon-once-again-listed-as-a-global-leader-in-sustainability/
• QuickLogic to Showcase EOS™ S3 and eFPGA Solutions at Sensors Converge
• Omni Design Technologies Steps Up European Hiring and Advanced Data Center IP Push
• Analysts bullish on SkyeChip ahead of IPO, upside seen at up to 91%
• The Next Phase of Europe’s Semiconductor Strategy
• Global Semiconductor Sales Increase 25% from Q4 2025 to Q1 2026
• European Processor Initiative finishes second stage
• Nvidia Enters the Scene. Behind the $400 Million in Financing, RISC-V Ushered in Spring
• Why Codasip went all‑in on CHERI
• Keysight Expands PCIe® 7.0 Test Portfolio with New Receiver Stress Calibration
• SEMI ESD Alliance 2026 Executive Outlook Explores How Agentic AI Will Change Chip Design and Verification
• GlobalFoundries accelerates adoption of co-packaged optics for advanced AI data centers with SCALE optical module solution
• Apple Considers Samsung and Intel Foundries to Reduce Reliance on TSMC
• TSMC pushes next-gen chip expansion while Samsung grapples with union

Wednesday, May 6, 2026

• Rambus Introduces PCIe® 7.0 Switch IP with Time Division Multiplexing for Scalable AI and Data Center Infrastructure
• Siemens hardware-assisted verification validates Arm AGI CPU for scalable agentic AI

Tuesday, May 5, 2026

• Two Weebit Nano product customers tape-out; one already demonstrating a functional prototype

Monday, May 4, 2026

• Silicon-Proven 112Gbps SerDes IP Core in 12FFC Redefines High-Speed Connectivity with Unmatched Flexibility and Performance
• TES Electronic Solutions GmbH Provides a Configurable Display Controller IP for Flexible Embedded Video Applications
• Arteris (AIP) Is Up 20.7% After Expanded MIPS RISC-V Physical AI Partnership Has The Bull Case Changed?
• Surge in custom chip business propels VeriSilicon's Q1 revenue to double, with new orders skyrocketing to 8.2 billion yuan; increased R&D investment leads to wider net loss | Earnings Insight
• Cadence Reports First Quarter 2026 Financial Results
• QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
• SkyeChip Berhad: Malaysia’s Leading IC Design & Silicon IP Company – Business Overview, Competitive Strengths & Future Plans
• "We Will Build a Korean Broadcom" ... Jaehong Park, CEO of BOS Semiconductors
• Satellite IoT connectivity: extending the IoT into Earth orbit
• AI Transforms the Chip Industry
• The great data center delay: Why your AI chips are stuck in 2026
• GUC Collaborate with Wiwynn to Advance Silicon-to-System Infrastructure for Next-Generation Hyperscale AI
• Arm AGI CPU Goes to Market via Supermicro and Verda at 2026 OCP EMEA Summit
• TSMC SoIC roadmap targets 2029 chip stacking