|
||||||||||
A Novel Methodology to Design and Verify companion SoCs in a single package
Aashish Sharma, Nitin Goel, Amitav Halder
Freescale Semiconductor India Pvt. Ltd. Introduction With growing complexity of System-on-Chips (SoCs), functional debug of the additional hardware becomes a greater challenge. There may be multiple SoCs with common interface present in the same package. With evolution of these complex architecture, need arises not only for design innovation but also for verification strategy which can help verify such design quickly and effectively. This paper discuss about the need to have such design and its efficient verification methodology. In these designs we are trying to enhance the debug capabilities of one SoC (says SoC-1) by using the debug support of another SoC (say SoC-2). The two SoCs are connected to each other via copper pillars and are bonded together in the same chip package. These SoCs are interacting with each other using Debug and Calibration Interfaces (DCI) provided on both the SoCs.
Figure 1 Design Architecture Design Aspect The impetus towards this methodology is to achieve silicon die saving which will not only reduce the cost of the chip but also its size. Production Device, SoC-1(SoC whose debug capabilities are getting enhanced), will go for final production. Its companion device SoC-2 has larger overlay memory (for storing trace/debug data) and a high speed debug interface for application debugging purpose. Since advanced debug capabilities are required by customer during initial phase of application development, this can be catered by combining the capabilities of both SoC-1 and SoC-2 together and in the final phase, only SoC1 can be sufficient. In this way additional silicon required for debug features in SoC-1 is reduced and at the same time a high speed interface with larger overlay memory is present for application development. SoC-1 can also be called as the P-Device/PD and SoC-2 as the C-Device/CD. The combination of the two is referred to as Emulation Device or E-Device/ED. Design Requirements High speed interface: Large overlay memory: Top-On-Topology: Complete isolation: Reset phase synchronization: Testing requirement: Debug/Trace Message Routing (TMR):
Figure 2: Trace Message Routing Verification Aspect The methodology explained, is to verify multiple SoCs in a single verification environment. This is very useful especially in Power-Train segment SoCs which usually demands greater debugging and calibration needs. Now this is achieved using an additional SoC (CD) to enhance the debug capabilities and calibration support to the main SoC (PD). Both PD and CD can be verified independently in separate verification environments but since customer is going to use both as one package(ED) so ED’s verification aspect includes:
Verification Approach Both these SoCs (PD and CD) are instantiated in a top level device called the E-Device(ED) in the verification testbench. The ED is a topmost level module created to instantiate the SoCs and connects all the SoC-1(/2) to SoC-2(/1) signals. These signals are further connected in the SoC-1(PD) and SoC-2(CD) top modules for further connectivity within the SoCs The main objective was to develop a modular approach for testbench so that PD (SoC-1) stimulus could be reused in ED testbench environment. The ED testbench is nothing but an augmented version of the PD testbench incorporating the CD testbench as well. Need for testbench to cater multiple SoCs Following things were taken into consideration while bringing up the ED testbench
Testbench Development Flow The development of the testbench started by removing the VIPs connected with the copper pillars and including the same instances as used in the CD testbench into ED testbench. The modifications included the hierarchy changes as another top level (ED) has been created, updating the testbench classes, drivers, etc. and inclusion of the new ED specific VIPs. The figures 3, 4 and 5 explain the concepts.
Figure 3 Testbench Architecture of P-Device
Figure 4 Testbench Architecture of C-Device Both CD and PD have separate monitors, drivers, and checkers along with their reset driver. But in ED, a single reset driver was created. In ED, each monitor and driver has to be enabled or disabled based upon which device is ON. And if both are working together (in debug and calibration cases) every driver and monitor becomes active. This was again controlled with the help of PRU unit.
Figure 5 Testbench Architecture of E-Device Challenges and Solutions: 1. Huge runtime:
2. Stimulus reuse:
3. VIP reuse:
4. Power connectivity and isolation check:
Benefits: 1. Reusability: This is one of the major advantages of this approach. The main reason for developing a single testbench is reusability. In ED complete testbench of the PD and CD can be reused. Stimulus from the CD and the PD SoC verification could be used to verify PD-CD interconnections with minimum updates. Presently both the SoCs are verified individually in their separate testbench. Both the testbench use the same VIP versions and the effort to integrate the entire CD testbench was low and easier to execute without causing any modifications in the CD SoC verification. 2. Silicon / Cost saving: During production phase, only PD will be manufactured as most of customer application debug has happened through ED. So, this will not only reduce the cost of silicon but also other associated cost like Production Engineering, packaging cost which would have been higher if we had provided all the CD functionality in the PD itself. 3. Debug and Calibration enhancement: Customer can use ED for calibrating and debugging its application because it has faster debug interface in addition to large overlay memories to store trace and calibration data. Once application has become stable fewer debug capabilities are sufficient and hence PD alone can be used. Authors: Nitin Goel: Done B.E. in Electronics and Communication from Netaji Subhash Institute of Technology in 2006, 6+ year of industry Experience in SoC IP and Core Verification, right now working as Senior Design Engineer with Freescale Semiconductor Amitav Halder: Done B.Tech. in Electronics and Communication from MITS Gwalior in 2004 , 9+ year of Industry Experience in SoC , IP Verification , Right now working as Lead Verification Engineer with Freescale Semiconductor Aashish Sharma: Done B.E. in Electronics and Communication from Delhi College of Engineering in 2012, 1+ year of experience in SoC verification, right now working as Design Engineer with Freescale Semiconductor
|
Home | Feedback | Register | Site Map |
All material on this site Copyright © 2017 Design And Reuse S.A. All rights reserved. |