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Root Cause Analysis (RCA) of Soft Digital IP to improve IP Quality & ReusabilityBy Vivek Singh, Ankur Krishna , Amardeep Punhani Digital-IP Group, Freescale Semiconductor India Pvt. Ltd Noida-India Abstract Silicon Defects are extremely expensive! The cost of quality is very high in an ASIC company. Finding and correcting defects is one of the most expensive part of an ASIC development process. This cost increases exponentially, if these errors are discovered at the later stages of the life cycle. A mature “in process” quality assurance returns substantial cost savings by preventing or at the least detecting and correcting defects at early stages. Any mature process has to be a control circuit which is constantly fed back with process defect misses. Root Cause Analysis (RCA) is a commonly used to tool identify process loopholes. Corrective steps only be defined when ”Why the failure occurred?” is answered. The objective remains to learn from the defects detected in past projects and eliminate these pitfalls by process improvements and new methodologies establishments. This paper shares our learning’s while defining a repeatable RCA methodology for soft digital IP. This paper will focus on the following areas of the process:
The specified RCA methodology in this paper helps designers in identifying root causes of any issue and in recommending steps for correction. Any RCA resulting in vague recommendations like “Improve adherence to general design guidelines,” is a failure. The RCA recommendations should target the specific issues in a design process and should also preferably define the recommended steps. The proposed RCA methodology will allow development of systematic design process improvements and assessment of the impact of corrective steps based on recommendations. Keywords Defect, Defect Analysis, Defect Prevention, Root Cause Analysis Introduction Consistent quality of soft IP with increasing complexity while implementing a lean and effective design process , is an expectation from any mature design group. To meet above goals it’s almost mandatory to prevent recurring defect. The cost of quality increases significantly when the defect is missed at the early stages of the design. It is therefore advisable to put in measures that prevent the defect from being introduced in the product. The process where defects are analyzed at IP or technology domain or Soc level yield good practices and immediate gap fixes. While these methods are recommended in sharing good practices but to find an overall process improvements Root Cause Analysis (RCA) is recommended. Any good process should be based on the pattern observed rather than the single incident observed. These preventive measures, after consent and commitments from team members, are embedded into the organization as a baseline for future projects. The methodology is aimed at providing the organization a long-term solution and the maturity to avoid repetitive defects. In this study, we share our learning in defining and implementing our RCA methodology while maintaining the goal of lean and effective design process. The paper provides a comprehensive view of the challenges we faced and the results we achieved. The paper has been divided into different heading each defining vital steps for the RCA. Collecting samples Any quality process is as good as the data it’s based on. The more apt the data the more relevant and accurate is the analysis. Though the sampling logic will be based on what you are analyzing, the data selection should be based on the following three simple conditions:
From our study we found that having the following data is helpful in the analysis:
All the above data in one way mandates that there is an already defined bug tracking system which captures all this data online. Relying on memory of people involved for collecting data at time of analysis, may lead to the wrong analysis. Due to variation in the kind of soft IP are done in our organization we also collected following information from each Analyst.
Classifying the defects “Comparing two defects is like comparing apples to oranges”. Wrong!! Each defect may have different complex steps to reproduce, but the underlying issue will be very similar. Each defect is the result of miss at some stages of the design process. The objective of our analysis is to find the first gate where it could have been caught. If an IP is defined mature after post-si validation, then all defects ended up at customer site can be accounted to failure of post-si process. This may be a stop-gap measure for strengthening the post-si validation process to catch “only similar” type of issues. The long term solution would be to find the first process check in the existing gate where this defect should have been caught. Classifying the defects will vary from one process to another. Though the works like Orthogonal Defect Classification – IBM* is a classic example of a generalized classification. In our analysis we wanted the classification which is easily understandable to user and directly maps to actionable items. In our analysis of defects we went through all defects once to understand each issue and classified the areas where we thought each defect lie. The principle we used:
Any good process is people independent. It doesn’t rely on heroism of people but at the process checks and guidelines. The processes should be well equipped to guide any person with the minimum skill set needed for the job to produce the expected quality work product. Defect analysis generally seeks to classify defects into categories and identify possible causes in order to direct process improvement efforts. The multi-layered classification approach helps to map the defects to pre-defined quality gates in design process and to identify the actionable steps to improve IP-design process/ Quality. In this paper, we are proposing a three layered approach to identify the gaps in IP-design process and help to identify the required actions. Level: 01 defect classification First level defect classification segregates the defects on functional domain level and helps to map these defects to corresponding IPdesign process gates. We can also define this classification as “Source of Defect” based on functional domain level. Level: 02 defect classification: The goal of RCA is to identify the root cause of defects and to initiate actions so that the source of defects is eliminated. The defect categories based on IP-design process events/gates define the 2nd-level defect classification and propagate the defects from “source of defect” classification (functional domain) to IP-design process event level. Level:03 defect classification: The 3rd level defect classification covers the sub-functional gaps at specific IP-design process gates and will help to prevent recurrence of harmful defects by suggesting preventive actions. The root causes to 3rd level events helps to identify the specific corrective actions in design process. Defect mapping from Level01 to Level03 Translation shortfalls: Defects in IP design requirements and design documents are more frequent due to translation shortfalls than errors in the source code itself. Defects introduced during the requirements and design phase are not only more probable but also are more severe and more difficult to remove. Table shows the defects introduced due to Translation shortfalls during IP design life cycle.
Review /Testing shortfalls: Team-review is one of the most effective activity in uncovering the defects which may later be discovered by a verification/validation teams or by a customer. Often, a team-review of the IP architecture, RTL code and Verification environment helps reduce the defects related to algorithm implementations, incorrect logic or certain missing conditions. The review of IP architecture, RTL, traceability of requirements till the fag end of design process may bring out the gaps in the design process.
Documentation Shortfalls: This classification broadly covers documentation updates /clarity and description related defects. The source of defects in this category confines within the IP-design team and isolate from translation issues propagated due to cross-functional dependencies.
IP Tools and Methodology Shortfalls: This defect classification covers the IP Tools and methodology related aspects. This RCA classification helps to map the functional defects to Methodology specific gaps in IP-design process.
Identification of RCA stake holders It’s a team work! RCA can be successful only if you have committed team. Each team member should bring in an area of expertise to the table. The stake holders are not only the ones who are directly affected by it but also who may be indirectly involved. The group together should be able to answer the following:
Identification of corrective actions (Process Improvements)
Conclusion: This paper provides a comprehensive view of the challenges we faced and the results we achieved. The specified RCA methodology in this paper helps designers in identifying root causes of issues and in recommending steps for correction. The multi-layered classification approach helps to map the defects to predefined quality gates in design process and to identify the actionable steps to improve IPdesign process/ Quality. In this paper, we have proposed a three layered approach to identify the gaps in IP design process and help to identify the required actions. The RCA recommendations target the specific issues in a design process. The proposed RCA methodology allows development of systematic design process improvements and assessment of the impact of corrective steps based on recommendations. Implementation of proposed RCA methodology and corrective actions enhance the product quality by preventing errors based on past mistakes. This RCA methodology improve design process and cycle time , which helps to reduce product cost with highest customer satisfaction. References [1] Chillarege, R., Bhandari, I.S., Chaar, J.K., Halliday, M.J., Moebus, D.S., Ray, B.K., and Wong, M.-Y., "Orthogonal Defect Classification - A Concept for In-Process Measurements," IEEE Transactions on Software Engineering, vol. 18, no. 11, November 1992, pp.943-956 [2] Sakthi Kumaresh & R Baskaran October 2010, “Defect Analysis and Prevention for Software Process Quality Improvement” International Journal of Computer Applications (0975 – 8887) Volume 8– No.7,
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