TransDimension Licenses High-Speed USB Intellectual Property and Software Solution to Chipidea

IRVINE, Calif. & PORTO, Portugal--(BUSINESS WIRE) -- July 13, 2005 --TransDimension (TDI), the leader in USB connectivity solutions for embedded applications and Chipidea, the leading analog and mixed-signal semiconductor solutions provider, today announced a strategic partnership to provide the industry's only complete high-speed USB intellectual property (IP) solution. Combining the strengths and expertise of both companies, the result of the partnership is a complete SoC solution that encompasses Chipidea's Physical Layer (PHY) IP core and TDI's High-Speed USB IP core and industry leading software.

As USB becomes a "need to have" feature in most SoCs, system architects and chip designers are faced with a major obstacle: how to get around incompatible IP blocks to design USB into an SoC in a matter of weeks. The partnership between Chipidea and TDI addresses this challenge by offering a single source solution for the three critical components of a successful USB implementation -- the PHY, USB controller IP and software.

According to Milton Sousa, Chipidea business development manager, "We are granting our customers a complete solution encompassing the PHY, controller and software that will strongly reduce time to market and minimize risk. Our experience demonstrates that this complete solution can save months of design time and eliminate a great deal of frustration when compared to integrating IP from different sources. Our solution with TDI provides the most complete, integrated solution available in the market."

All components of this joint solution were developed by Chipidea and TDI, and building on a long product relationship the companies have now extended their relationship to commercially offer a solution that is demonstrated in silicon and has been fully tested for interoperability. "Our complete solution is in use by major OEMs worldwide and has been proven successful in high-volume applications," said Pete Todd, TDI vice president of sales. "USB implementations are the primary focus for our company -- it's what we do. Other solutions lack the software that is proven to be interoperable with the hardware elements. Through our single source solution we offer the three critical components of a USB implementation that have proven interoperability as well as provide a single support team and a single point of contact through the world-class team at Chipidea."

The announcement of this partnership comes on the heels of a joint webinar offered by Chipidea and TDI titled, "Simplifying the Integration of High-Speed USB Into Your SoC." Broadcasted on Wednesday, June 22, the webcast featured experts from Chipidea and TDI and shared insights on the challenges associated with using separate vendors, typical problems faced by SoC manufacturers and the benefits of a single source solution. The companies highlighted a comparison study that explored an IP implementation and demonstrated the benefits realized with a complete, single source solution. To view an archived version of the webcast, please visit http://seminar2.techonline.com/s/transdimensiongr1_jun2205.

For more information, please contact products@chipidea.com.

About Chipidea

Chipidea is the world's number one analog/mixed-signal merchant technology supplier targeting fast-growing market segments like wireless communications, digital media and consumer electronics. Chipidea supports blue-chip customers across the globe, has an impeccable reputation for delivering high-quality products and is known for its reliable execution. Chipidea licenses its technology to leading companies in these and other key markets, delivering everything from precision single-function blocks to full analog sub-systems. Chipidea employs 180 people in its research and development, and sales and marketing offices across Europe, Asia and North America. More information about Chipidea can be found at http://www.chipidea.com.

About TransDimension

Headquartered in Irvine, California, TransDimension is a privately held company founded in 1997 to develop and market connectivity solutions. TransDimension's product lines include the integrated circuits, IP cores and USB software stacks that enable wired and wireless connectivity between a wide range of PC peripheral, consumer electronic and mobile device applications. TransDimension's SoftConnex USB solutions provide the broadest operating system and CPU platform support and the largest library of peripheral class drivers available. More information about TransDimension can be found at http://www.transdimension.com.

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