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Broadcom to Demonstrate the Industry's First PCI Express(R)-based SAS/SATA RAID-on-Chip (RoC) Solution at IDF
Third Generation RAID Architecture Demonstrates Significant Advancements in RAID Technology Featuring the Industry Smallest Form Factor, the Lowest Power and Thermal Requirements, and Usage Flexibility via Its XelCore(TM) RAID Stack
SAN FRANCISCO, Aug. 22 -- Intel Developer Forum (IDF) 2005 -- Broadcom Corporation, a global leader in wired and wireless broadband communications semiconductors, today announced the demonstration of the industry's first SAS/SATA RAID-on-Chip (RoC) device, with integrated PCI Express® (PCIe) host bus architecture support, at IDF this week. The demonstration highlights Broadcom's third generation RAID technology and features the capability of using either SAS (Serial Attached SCSI) or SATA (Serial Advanced Technology Attachment) drive formats to best match the customer's RAID storage requirements. The PCI Express SAS/SATA RoC solution demonstration at IDF showcases the lowest power PCIe SAS/SATA RAID solution in the industry, as well as the highest usage and system design flexibility, driven by an advanced enterprise-class RAID software stack. Representing an important transition in disk drive interconnect technology, SAS is expected to be widely adopted as a replacement to SCSI in enterprise computing platforms beginning early 2006. SAS represents significant performance, integration, reliability and serviceability advantages over SCSI, and is currently being shipped by leading server OEMs. Since the SAS infrastructure is compatible with lower cost SATA drive technology, the Broadcom® RoC demonstration at IDF illustrates system design flexibility allowing for tiered storage offerings that mix SAS high-performance drives and SATA low-cost drives within the same storage network. The SAS and SATA-based RoC demonstration includes next generation PCI Express technology. PCI Express provides a standards-based, serial high-speed, point-to-point host bus architecture that enables significant performance and system integration advantages over older PCI-X® parallel bus architectures. Broadcom previously addressed the demand for PCI Express network solutions by creating the industry's first line of PCIe Gigabit Ethernet controllers in the Fall of 2003 and continues to ship multiple families of PCIe devices in a variety of wired and wireless controller solutions. For system designers and integrators, the PCI Express SAS/SATA RAID solution demonstration at IDF shows significant space and power/thermal reductions as a direct benefit of the highly integrated RoC architecture. By eliminating multiple devices, Broadcom's single-chip integration, coupled with superior I/O design, enables the design of smaller solutions that lower thermal and power requirements (expected to be less than 50% of existing solutions). The lower heat and corresponding reduced power dissipation allows systems integrators to lower their costs by building less expensive storage equipment without the need for fans or additional external components that can drive up bill-of-materials costs. The trend towards smaller and thinner servers will be further accelerated with this capability. XelCore(TM) (Broadcom's highly portable enterprise-class RAID software stack) enables the highest level of usage flexibility by having the unique ability to run in either "Software RAID" mode (on the system host processor) or "Hardware RAID" mode (in the embedded RoC processor). System designers now have a choice of designing high performance, highly scalable storage systems using the "Software RAID" capability, or opt for the "Hardware RAID" mode to develop server systems with high storage offload and reliability. The XelCore RAID stack provides support for all popular RAID levels and includes such enterprise-class features as online capacity expansion, online RAID level migration and the ability to create storage arrays that span multiple storage controllers without having to take the system offline. "By providing SAS, SATA and PCI Express capabilities all on a single chip, Broadcom is raising the standard requirement for enterprise RAID storage," said Tom Marmen, Vice President & General Manager of Broadcom's Storage Line of Business. "Having all of this functionality supported by a single RAID software stack allows for the greatest design flexibility and performance while consuming far less power than other RAID controller card solutions." Broadcom's PCI Express SAS/SATA RAID-on-Chip demonstration occurs this week at IDF in Broadcom's Booth #819. About Broadcom Broadcom Corporation is a global leader in wired and wireless broadband communications semiconductors. Our products enable the convergence of high-speed data, high definition video, voice and audio at home, in the office and on the go. Broadcom provides manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices with the industry's broadest portfolio of state-of-the-art system-on-a-chip and software solutions. These solutions support our core mission: Connecting everything®. Broadcom is one of the world's largest fabless semiconductor companies, with annual revenue of more than $2 billion. The company is headquartered in Irvine, Calif., with offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at 1-949-450-8700 or at www.broadcom.com. Safe Harbor Statement under the Private Securities Litigation Reform Act of 1995: All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward-looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry and business, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," "ongoing," similar expressions, and variations or negatives of these words. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement. Important factors that may cause such a difference for Broadcom in connection with RAID controller products include, but are not limited to, general economic and political conditions and specific conditions in the markets we address, including the volatility in the technology sector and semiconductor industry, trends in the broadband communications markets in various geographic regions, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; the rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for enterprise and consumer storage and storage networking applications; delays in the adoption and acceptance of industry standards in those markets; our ability to scale our operations in response to changes in demand for our existing products and services or demand for new products requested by our customers; intellectual property disputes and customer indemnification claims and other types of litigation risk; our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a cost-effective and timely manner; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; the gain or loss of a key customer, design win or order; the availability and pricing of third party semiconductor foundry and assembly capacity and raw materials; our ability to timely and accurately predict market requirements and evolving industry standards and to identify opportunities in new markets; the quality of our products and any remediation costs; competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business and product plans; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; the timing of customer-industry qualification and certification of our products and the risks of non-qualification or non-certification; changes in our product or customer mix; the volume of our product sales and pricing concessions on volume sales; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly facilities; the effectiveness of our expense and product cost control and reduction efforts; the risks and uncertainties associated with our international operations, particularly in light of recent events; the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; the level of orders received that can be shipped in a fiscal quarter; and other factors. Our Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q, recent Current Reports on Form 8-K, and other Securities and Exchange Commission filings discuss the foregoing risks as well as other important risk factors that could contribute to such differences or otherwise affect our business, results of operations and financial condition. The forward-looking statements in this release speak only as of this date. We undertake no obligation to revise or update publicly any forward-looking statement for any reason. Broadcom®, the pulse logo, Connecting everything®, the Connecting everything logo and XelCore(TM) are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. PCI Express® and PCI-X® are trademarks of PCI-SIG Corporation. Any other trademarks or trade names mentioned are the property of their respective owners. Source: Broadcom Corporation
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