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TTPCom Selects LSI Logic's Platform ASIC Technology to Validate its Openly Licensable 3G Baseband ModemMILPITAS, Calif. -- Sept 12, 2005 -- LSI Logic Corporation (NYSE: LSI) today announced that UK-based TTPCom has selected the LSI Logic RapidChip Integrator2(TM) Platform ASIC for its next generation 3G cellular modem technology -- the Cellular Baseband Macro 3G. The CBEmacro 3G will be the world's first complete IP and software platform for multimode 3G baseband designs which will be delivered to customers in an easily integrated 'black box' format. The first test chips are expected in Q1 2006. With up to 5 million available gates and 8.3 Mbits of RAM, LSI Logic's largest RapidChip Integrator2 slice, the RC11Si390, will address TTPCom's need for fast time-to-market, very high integration and high-speed performance. TTPCom will be embedding the high-performance ARM1156T2-S processor and will use the ARM1156T2-S processor Reference Design to further accelerate the production process. "Reducing turnaround time was a crucial consideration for us in making the decision to use LSI Logic's Rapidchip Platform ASIC solution," said Julian Hildersley, managing director of TTPCom's Silicon Business Unit. "A silicon implementation is key to our philosophy of validating our modem designs and LSI Logic's RapidChip solution offers us a unique time-to-market advantage for our CBEmacro technology." Mike Casey, director of strategic marketing, LSI Logic Europe said, "The technology involved in a multimode modem is highly complex. Consequently TTPCom's CBEmacro 3G presented a great opportunity to demonstrate the capabilities of the RapidChip Integrator2 slice architecture, such as flexible, diffused memory configurations with MatrixRAM memory. The CBEmacro 3G technology takes full advantage of the comprehensive resources offered by the RapidChip Integrator2 family." "The integration of ARM(R) processor IP and TTPCom's cellular modem IP, and its proof on the LSI Logic RapidChip Platform ASIC will provide 3G cellular handset manufacturers with a true competitive advantage," said Warren East, CEO, ARM. "Manufacturers need to focus on adding new and highly differentiated functionality in the shortest possible timescales, and this collaboration will help them do just that." About LSI Logic Corporation LSI Logic Corporation focuses on the design and production of high-performance semiconductors for Consumer, Communications and Storage applications that access, interconnect and store data, voice and video. LSI Logic engineers incorporate reusable, industry-standard intellectual property building blocks that serve as the heart of leading-edge systems. LSI Logic serves its global OEM, channel and distribution customers with standard-cell ASICs, Platform ASICs, standard products, host bus adapters, RAID controllers and software. In addition, the company supplies storage network solutions for the enterprise. LSI Logic is headquartered at 1621 Barber Lane, Milpitas, CA 95035. http://www.lsilogic.com About TTP Communications plc Based in Cambridge, UK, TTP Communications plc (LSE: TTC) through its subsidiary TTPCom Limited, develops intellectual property used in the design and manufacture of wireless communication terminals. TTPCom licenses its technology to leading semiconductor and terminal manufacturers worldwide, including Analog Devices, Intel, LG, Renesas, Sharp, Siemens and Toshiba. TTPCom has established an industry standard with its GPRS platform, offers EDGE, 3G, Wireless LAN and Wireless PAN solutions and, for those manufacturers for whom a fast time to market is critical, TTPCom also offers complete handset and module designs. Over 30 million devices using TTPCom technology were shipped during 2004. More information can be found on TTPCom's website at: http://www.ttpcom.com . About ARM ARM designs the technology that lies at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARM's comprehensive product offering includes 16/32-bit RISC microprocessors, data engines, 3D processors, digital libraries, embedded memories, peripherals, software and development tools, as well as analog functions and high-speed connectivity products. Combined with the company's broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies. More information on ARM is available at http://www.arm.com/ .
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