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Sonics and CoWare Expand Strategic Partnership to Accelerate Industry-wide SystemC Platform SoC Transformation
CoWare to Distribute Sonics Inc.® SMART Interconnects™ Solutions to ESL Designers
MOUNTAIN VIEW, Calif., and SAN JOSE, Calif.--April 7, 2006--Sonics Inc., the premier supplier of system-on-chip (SoC) SMART Interconnects solutions, and CoWare® Inc., the leading supplier of platform-driven electronic system-level (ESL) design software and services, announced a broad agreement by which CoWare will distribute SystemC language versions of Sonics SMART Interconnects solutions that operate seamlessly in CoWare's platform-driven ESL design environment. Platform-driven ESL design refers to the development and practical reuse of a SystemC transaction-level model (TLM) of a system-on-chip (SoC) platform throughout the system design process for architectural exploration, early software development, and system verification. The collaboration between Sonics and CoWare addresses this growing trend by adding the Sonics models to the CoWare Model Library for use in CoWare Platform Architect for TLM platform capture and analysis. The joint solution will also provide direct links from CoWare Platform Architect to the SMART Interconnects solutions available at the register-transfer level from Sonics. The combination provides geographically dispersed engineering teams with a powerful design and implementation solution that bridges multiple abstraction levels, speeds system verification, and enables software development to begin sooner in the development cycle. “The fusion of advanced SystemC-based architectural modeling and software development with flexible interconnect technology is a major advancement that will accelerate the transformation to platform SoC architectures,” said Phil Casini, vice president marketing, Sonics Inc. “CoWare and Sonics, the pioneers in these areas, are perfect partners to drive this transformation.” The Joint Solution For ESL platform design, CoWare will sell and distribute IEEE 1666 SystemC-based versions of the Sonics SMART Interconnects solutions that are compatible with its Platform Architect environment. CoWare will also sell and distribute a new ESL design version of SonicsStudioTM, a tool used to configure the SystemC models of Sonics SMART Interconnects solutions. This provides customers with one-stop shopping through CoWare for all SystemC development needs. A fully-featured version of SonicsStudio, available from Sonics, can then use the same SystemC model configuration data developed in the Platform Architect environment to create a Verilog HDL version complete with synthesis scripts and an advanced verification test bench, guaranteeing a rapid transition from architectural exploration into logical and physical design. “Adding the Sonics models to the CoWare Model Library enhances our ability to provide the industry with the best ESL environment available. We are excited to partner with Sonics,” said Tim Smith, vice president world-wide sales, CoWare, Inc. Availability Sonics SMART Interconnects models will be available from CoWare as a part of the CoWare Model Library in July 2006. For more information, contact the CoWare sales office nearest you. About Sonics Sonics, Inc.® is the premier supplier of SMART Interconnects solutions that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics' SMART Interconnects solutions in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately-held company funded by Cadence Design Systems, Toshiba Corporation, Samsung Ventures, and venture capital firms Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com. About CoWare CoWare is the leading supplier of system-level electronic design automation (EDA) software tools and services. CoWare offers a comprehensive set of electronic system-level (ESL) tools that enable SoC developers to "differentiate by design" through the creation of system-IP including embedded processors, on-chip buses, and DSP algorithms; the architecture of optimized SoC platforms; and hardware/software co-design. The company's solutions are based on open industry standards including SystemC. CoWare's customers are major systems, semiconductor, and IP companies in the market where consumer electronics, computing, and communications converge. CoWare's corporate investors include ARM Ltd. [(LSE:ARM);(Nasdaq: ARMHY)], Cadence Design Systems (NYSE:CDN), STMicroelectronics (NYSE:STM), and Sony Corporation (NYSE:SNE). CoWare is headquartered in San Jose, Calif., and has offices around the world. For more information about CoWare and its products and services, visit http://www.coware.com.
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