Toshiba Licenses Rambus XDR Memory and PCI Express Interface Solutions

XDR™ memory controller and PCI Express® interface PHY now available in Toshiba 65nm process technology

Los Altos, California, United States  -- October 11, 2006 --  Rambus Inc. (Nasdaq:RMBS), one of the world's premier technology licensing companies specializing in high-speed chip interfaces, today announced that Toshiba has signed a license agreement for the Rambus XDR™ memory controller interface cell, dubbed XIO, and the Rambus PCI Express® Gen 1 PHY cell. The Rambus interface solutions will be implemented in Toshiba’s 65nm process technology for integration into the latest consumer, computing, and communications applications.

“Rambus’ renowned expertise in high-speed interfaces made their solutions an ideal choice for our state-of-art large scale integration (LSI) devices with high processing power for various applications,” said Tomotaka Saito, General Manager of the Broadband System LSI Division at Toshiba's Semiconductor Company. “The addition of Rambus’ XIO and PCI Express interface cells adds to the world-class portfolio of solutions we provide our customers.”

The Rambus XIO memory controller is the high-performance, low-latency interface to Rambus’ XDR DRAM, today’s fastest high-speed memory. Ideal for graphics-intensive applications in consumer electronics and computing, a single, 2-byte wide, 3.2 GHz XDR DRAM component provides 6.4 GB/sec of peak bandwidth.

The advanced XDR memory architecture features four key enabling technologies built on patented Rambus innovations:

• Differential Rambus Signaling Level (DRSL) A low-voltage, low-power, differential signaling standard that enables scalable multi-GHz, bi-directional, and point-to-point data busses that connect an XDR memory controller (XIO) to XDR DRAM devices.

• Octal Data Rate (ODR) A technology that transfers eight bits of data on each clock cycle, four times as many as today's state-of-the-art memory technologies that use DDR (Double Data Rate) clocking.

• FlexPhase™ A circuit technology that enables flexible phase relationships between signals, allowing precise on-chip alignment of data with clock.

• Dynamic-Point-to-Point (DPP) An innovation that maintains the signal integrity benefits of point-to-point signaling on the data bus, while providing the flexibility of capacity expansions with module upgrades. DPP was recognized with a “2005 Innovation of the Year” award by industry publication EDN Magazine.

“Toshiba is on the forefront of delivering breakthrough solutions for next-generation systems.” said Laura Stark, senior vice president of Platform Solutions at Rambus. “This agreement continues the long and successful collaboration between our companies to provide state-of-the-art technology for today’s most demanding computing and consumer electronics products.”

The Rambus PCI Express PHY is one of the most widely compliance and interoperability tested PCI Express solution available today. Rambus’ silicon-proven PCI Express PHY cells are complete serial communication cells optimized for implementing the physical layer of the PCI Express standard. Rambus’ PCI Express PHY cells are in production in high-volume applications and have been incorporated in numerous products listed on the PCI-SIG® Integrators List, having passed PCI-SIG compliance and interoperability testing by Rambus PHY cell customers and digital controller partners. The complete, interoperable Rambus PCI Express interface solution consists of PHY cells and digital controllers.

For more information on the XDR memory architecture consisting of the XDR DRAM device, the XCG (XDR Clock Generator), the XIO controller interface cell, and the XDR memory controller (XMC), as well as the next generation of XDR, the 8GHz XDR2 DRAM with micro-threading, please visit www.rambus.com/xdr. For more information on the complete integrated PCI Express solution please visit www.rambus.com/pciexpress.

About Rambus Inc.

Rambus is one of the world's premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company's patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus' technology and products solve customers' most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan and Taiwan. Additional information is available at www.rambus.com.