|
||||||||||
UMC Delivers Leading-edge 65nm FPGAs to XilinxWorld's largest FPGA features 11 metal layers and industry's highest gate count HSINCHU, Taiwan, November 8, 2006 -UMC (NYSE: UMC; TSE: 2303), a leading global semiconductor foundry, announced that it has delivered the world's largest 65nm FPGAs to Xilinx. This new devices deliver a 65 percent logic capacity increase over previous generation FPGAs to enable the industry's highest gate count, with approximately 1.1 billion transistors. The chips, which feature triple gate oxide technology and 11 copper metal layers, have demonstrated excellent initial yields and are expected to be ready for full production in several months. Wim Roelandts, chairman, president and CEO of Xilinx, said, "Xilinx is currently ramping 65nm wafer starts at UMC. We are quite pleased with our progress-in fact, UMC's yields have exceeded our expectations for our most advanced products. We'll continue to leverage UMC's advanced 65nm technology for our upcoming product lines to strengthen our leading position in the FPGA industry." UMC is the foundry leader in 65nm process technology, which delivered the foundry industry's first 65nm customer products in June of 2005. UMC is currently in volume production for multiple customers using the leading-edge process, and has engaged with nine customers so far, for a variety of market applications. Yield improvement for 65nm has been even faster than for the 90nm process generation. Though performance gains vary across applications, compared with the 90nm generation, 65nm products exhibit an average of 30 percent higher performance, and a 35 percent reduction in dynamic power consumption. About UMC
|
Home | Feedback | Register | Site Map |
All material on this site Copyright © 2017 Design And Reuse S.A. All rights reserved. |