inSilicon and Cadence Design Systems Unite to Develop Integrated USB 2.0 Analog Transceiver

SAN JOSE, Calif.----June 26, 2000-- inSilicon Corporation (Nasdaq:INSN) -- a leading provider of communications technology for complex systems-on-chip -- today announced an exclusive joint technology development and marketing agreement focused on mixed-signal analog transceivers, with Cadence Design Systems (NYSE:CDN), the leading supplier of electronic design products and services.

Mixed-signal analog transceivers are a complex but critical component of nearly all wired and wireless communications devices. ``We are excited about entering this new market by adding mixed-signal communication technologies to our existing portfolio of digital communications products,'' said Wayne Cantwell, president and chief executive officer of inSilicon. ``Cadence's analog design strength and powerful design services will allow us to significantly extend our value proposition and provide customers with a complete system-on-chip solution for their USB 2.0 products.''

``The requirements for success with USB 2.0 are proven interoperability and a solid track record with USB 1.1,'' stated Tim Henricks, vice president and general manager of analog/mixed signal design services at Cadence®. ``inSilicon is a strong leader in USB intellectual property technology and the logical choice for partnership. We are confident that the combination of Cadence high-performance datacommunications signal processing expertise and inSilicon USB 2.0 technology offers the best total integrated solution for this technology implementation and delivery to the market.''

At rates up to 480 Mbps (40x faster than USB 1.1), the USB 2.0 transceiver is significantly more complex than USB 1.1 and will require the experience of best-in-class companies to achieve success. USB is well on its way to becoming one of the most widely deployed high-speed point-to-point communications technologies, with estimated shipments in excess of 500 million devices to ship in 2003, according to In-Stat. USB provides true ``plug-and-play'' convenience for leading-edge technology products, including printers, scanners, digital cameras, speakers, and mobile communications and computing devices.

About inSilicon

inSilicon Corporation is a leading provider of communications and connectivity technology used by semiconductor and systems companies to design complex systems-on-chip that are critical components of digital devices. inSilicon's technology provides customers faster time-to-market, and reduced risk and development cost. The Company's enabling communications technologies, including Ethernet, USB, PCI, and IEEE-1394 are used in a wide variety of markets encompassing communications, consumer, computing, and office automation. Information about inSilicon products and technologies is available at http://www.in-silicon.com.

About the Cadence Design Services Group

In 1995, Cadence launched its Design Services Group, pioneering the movement toward independent design services organizations. Since then, the group has provided design services for customers that range from small start-ups to large multi-national corporations. Today, Cadence Design Services is the largest organization of its type in the world, with more than 1,000 design engineers and 26 design centers at 16 locations throughout the world. Of the 26 centers, six are devoted to wireless, two to multimedia, three to datacom/telecom, two to information appliances, one to embedded controls, six to digital IC, five to analog/MS IC and one to silicon technology.

About Cadence

Cadence is the largest supplier of software products, methodology services and design services used to accelerate and manage the design of semiconductors, computer systems, networking and telecommunications equipment, consumer electronics and a variety of other electronics-based products. With approximately 5,000 employees and 1999 annual revenue of $1.1 billion, Cadence has sales offices, design centers and research facilities around the world. The Company is headquartered in San Jose, California. Further information may be found on the World Wide Web at http://www.cadence.com.

``Safe Harbor'' Statement under the Private Securities Litigation Reform Act of 1995:

In addition to the historical information contained herein, statements in this press release may contain forward-looking statements within the meaning of the Federal securities laws and are subject to the safe harbors created thereby. The following are among the factors that could cause actual results to differ materially from the forward-looking statements: the risks that products will fail to achieve market acceptance, the timing of customer orders, delays in the design process, the length of inSilicon Corporation's sales cycle, inSilicon Corporation's ability to develop, introduce and market new products and product enhancements, changes in product mix or distribution channels; the demand for semiconductors and end-user products that incorporate semiconductors; technological difficulties and resource constraints encountered in developing and/or introducing new products; natural disasters/acts of God; and other risks both domestic and international. Forward-looking statements contained in this press release regarding expected financial results, industry trends, sales and future product development and business strategies and activities should be considered in light of these factors and those factors discussed from time to time the Company's public reports filed with the Securities and Exchange Commission, such as those discussed under ``Risk Factors'' in the Company's report on form S-1 filed in March 2000.

Note to Editors: inSilicon is a trademark of inSilicon Corporation.

All other trademarks and/or registered trademarks are the property of their respective owners.

Contact:
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     bob_young@insilicon.com
         or
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         or
     Morgan-Walke Associates
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     Susan Hallahan-Glen (investor relations)
     Peter DeLauzon (financial media relations)