Fujitsu Announces Mobile WiMAX SoC Performance and Delivery Schedule

New chip will provide substantial advances for media-rich mobile PC applications; SoC to be first mobile WiMAX chip certified for Wave 2 conformance

SUNNYVALE, California, LANGEN, Germany, SHANGHAI, China, and SINGAPORE -- May 21, 2007  -- Fujitsu Microelectronics America, Inc. (FMA), Fujitsu Microelectronics Europe (FME), Fujitsu Microelectronics (Shanghai) Co., Ltd. (FMC), and Fujitsu Microelectronics Asia Pte Ltd. (FMAL) announced today the specifications and delivery schedule for the company's mobile baseband System-on-Chip (SoC), its next wave of innovation in WiMAX silicon solutions. The Fujitsu MB86K21 802.16e will provide substantial speed and performance improvements over comparable market alternatives, at low power consumption in a very compact form factor. The SoC is targeted to be the first in its class to participate in WiMAX Forum Wave 2 certification. Samples will be available in August 2007.

The highly integrated, one-chip mobile baseband SoC, which uses 90nm low- leakage process technology, is well-suited for PC cards and other media-rich mobile applications. The mixed-signal SoC has achieved an 18.6Mbps transfer rate in sample installations and lab demonstrations.

"We are confident we will be able to achieve the lowest power consumption for this class of device," said Makoto Awaga, general manager of the Mobile Solution Division, Fujitsu Limited Electronic Devices Group. "Our first test chip delivered 240mW at 18.6Mbps. We expect the power draw will be far less than 500mW, even at the theoretical highest throughput of 45Mbps DL. In addition, with clock-gating techniques and our proprietary low-leakage process technology, we have achieved 10mW in sleep mode. This SoC will be uniquely equipped to support demanding media-rich mobile applications in PCs and handheld devices."

"Having the major silicon vendors ready to deliver is very positive for the mobile WiMAX marketplace," stated Peter Jarich, research director for Current Analysis. "Critical mass is really building. The most important thing for the market is to have major vendors building an interoperable ecosystem. A viable long-term roadmap like Fujitsu showed today is a key for vendor success."

The Fujitsu mobile WiMAX SoC was developed by the same team that developed the baseband for 2G and 3G mobile handsets. The MAC and PHY for mobile WiMAX SoC are optimized for use in mobile stations and terminals, PC cards and other media-rich handheld devices, and are assured of meeting carrier-class requirements.

The new mobile WiMAX SoC will include:

• All features required for WiMAX Forum Wave 2 mobile device certification
• Highly integrated 512/1024 FFT OFDMA PHY with integrated MAC processors
• Support for 5MHz and 10MHz channel bandwidths
• Adaptive modulation schemes (64QAM, 16QAM and QPSK)
• Security implementation based on AES-CCM
• Support for 2x2 STC/MIMO
• Support for antenna diversity
• USB 2.0 and card bus/PCI host interface support
• Small footprint FBGA package

"When selecting the Fujitsu mobile WiMAX baseband SoC, our customers can rely on Fujitsu's proven strengths in integrating advanced technologies into complex electronic devices, as well as our extensive experience in mobile device design and development," said Keith Horn, chief operating officer of Fujitsu Microelectronics America. "We look forward to delivering this powerful chip with full System Design Kit hardware and the PC Card Reference Platform Delivery Kit." "Fujitsu's technology roadmap for mobile WiMAX indicates an aggressive move into the emerging mobile WiMAX market," says Flint Pulskamp, wireless semiconductor analyst at IDC. "Its plans for baseband SoC development to support VoIP, multimedia, multimode and multi-band requirements with low power solutions at increasingly smaller process technologies suggest that Fujitsu is serious about being a key semiconductor provider in this market."

"The Fujitsu high-performance mobile WiMAX SoC will ensure that emerging media-rich mobile devices can meet the demanding expectations of end-users," added Dirk Weinsziehr, senior marketing director of Fujitsu Microelectronics Europe. "We're seeing increasing interest in the capabilities that this chip can deliver in mobile PCs and handheld device applications. We want to ensure that users are delighted with the battery life, application responsiveness and image resolution when they use mobile WiMAX-enabled services. We are committed to exceeding their expectations."

"Fujitsu is one of the few major WiMAX suppliers that can provide multimedia solutions and advanced process technology optimized for low-power devices," said Michael Shih, Chairman and CEO of Fujitsu Microelectronics (Shanghai) Co., Ltd. "We are excited to see the WiMAX industry is growing in Asia. Many countries -- such as Japan, Taiwan, Malaysia and Vietnam -- are going to release specific spectrums for WiMAX. As a result, major carriers consider WiMAX the next-generation network technology. As part of the Fujitsu worldwide effort, we are ready to support customers locally in Asia. We look forward to collaborating with Asian companies in building advanced solutions using our state-of-the-art WiMAX technology."

The System Design Kit (SDK) and the PC Card Reference Platform Delivery Kit (RDK) are designed to help equipment customers get to mass production quickly. Both the SDK and RDK come with full reference software and hardware packages. The SDK has USB, PC card and Secure Digital Input/Output (SDIO) interfaces so that customers can easily connect to their own platforms. In addition, customers will be able to change RF boards to meet various frequency requirements. Fujitsu will provide a software analysis tool to help customers perform real-time monitoring of MAC and PHY levels. Fujitsu will provide MS Windows XP drivers as well as the schematic diagram and parts list, including MIMO RF designs.

Fujitsu participated in the third plugfest conducted by ETSI and AT4 wireless on May 13, 2007, in Sophia Antipolis, France, and plans to be part of the fourth Mobile WiMAX plugfest scheduled this fall.

About Fujitsu Microelectronics America, Inc.

Fujitsu Microelectronics America, Inc. (FMA) leads the industry in innovation. Fujitsu provides high-quality, reliable semiconductor products and services for the networking, communications, automotive, security and other markets throughout North and South America. As a founding member and current board member of the WiMAX Forum(TM), Fujitsu supports the standards development and compliance programs that are essential to successful Broadband Wireless deployment. Fujitsu provides performance-driven WiMAX solutions by leveraging the company's experience and expertise in the networking and communications markets. Fujitsu offers flexible WiMAX SoC and reference designs for WiMAX-certifiable systems to equipment vendors. For more product information, please visit the company's web site at http://us.fujitsu.com/micro/wimax or address e-mail to inquiry.bwa@fma.fujitsu.com

About Fujitsu Microelectronics Europe

Fujitsu Microelectronics Europe (FME) is a major supplier of semiconductor products. The company provides advanced systems solutions to the automotive, digital TV, mobile telephony, networking and industrial markets. Engineers from design centres dedicated to microcontrollers, mixed-signal, wireless, multi-media ICs and ASIC products work closely with FME's marketing and sales teams throughout Europe to help satisfy customers' system development requirements. This solutions approach is supported by a broad range of advanced semiconductor devices, IP and building blocks... For more information visit Fujitsu Microelectronics Europe's website at http://emea.fujitsu.com/microelectronics

About Fujitsu Electronic Devices Asia

Fujitsu Electronic Devices Group Asia (EDGA), a collaboration of Fujitsu Microelectronics (Shanghai) Co. Ltd., Fujitsu Microelectronics Asia Pte Ltd. and Fujitsu Microelectronics Pacific Asia Ltd., provides a "one-stop center" for semiconductor products for all customers in the Asia Pacific region. EDGA offers its local and regional customers flexible business and system solutions for the digital AV, automotive, consumer electronics, and mobile and wireless markets. With technology resource centers and ASIC design support centers strategically located in Shanghai, Hong Kong and Singapore, EDGA can speedily and competitively meet customers' stringent design-in requirements on ASSP, MCU and ASIC products. Heavy investments in design, engineering and application support resources, complemented by a regional network of design partners, suppliers and distributors, help assure that EDGA can readily deliver a range of innovative, value-added solutions to its target markets in the Asia Pacific region.