Texas Instruments Adopts Sonics SMART Interconnect(TM) Solutions for OMAP(TM) 3430 Application Processor

Popular OMAP3-based Product Anchored by SonicsMX(R) and Sonics3220(TM)

MILPITAS, Calif.-- June 5, 2008 -- Sonics Inc., a premier supplier of system-on-chip (SoC) SMART Interconnect solutions, today announced that Texas Instruments has adopted the SonicsMX and Sonics3220 SMART Interconnect solutions for use in its OMAP3430 application processor. The announcement represents the second generation of OMAP platforms using Sonics SMART Interconnect solutions. Texas Instruments previously adopted Sonics for its OMAP2 platform products, including the OMAP2420 and OMAP2430 processors.

The advanced fabric features and data flow services available in SonicsMX facilitated rapid integration of Texas Instruments’ OCP-based IVA video processing, 2D/3D graphics acceleration, and ISP image processing subsystems. Universal connectivity, an advance fabric feature only found in SonicsMX, also allow Texas Instruments to seamlessly integrate the AMBA® 3 AXI™-based ARM Cortex™-A8 processor and the OCP-based subsystems developed by Texas Instruments onto a single chip with minimal engineering. These upgrades enable the OMAP3430 to increase H.264 decoding from VGA to D1 resolution at 30FPS, introduce H.264 encoding, and increase camera resolution from 4 to 12 mega pixels, when compared to OMAP2420.

SonicsMX allows a diverse set of latency-sensitive application software processing and high-bandwidth graphics and video processing applications to operate optimally on the same chip by offering quality of service guarantees, state-of-the art power minimization techniques, such as fine and coarse grained clock gating, integrated firewalls for advanced security management, and error management services to enhance the overall stability of the SoC.

Sonics3220 consolidates the interaction of dozens of peripherals supported by the OMAP3430 with the SonicsMX system interconnect. This provides higher performance with lower area than employing separate buses and duplicating peripherals to achieve similar performance, a technique commonly used in SoCs today.

“Application processors require a daunting combination of high-performance processing, real-time media accelerators, and a plethora of communications integrated into a single SoC with minimum battery drain and low device cost,” said Drew Wingard, CTO and co-founder, Sonics Inc. “Sonics is proud that Texas Instruments has continued to leverage our SMART Interconnect solutions to manage the data flow concurrency, integration complexity, and rapid market changes that the OMAP3430 must service.”

About Sonics

Sonics Inc. is a premier supplier of SMART Interconnect solutions that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics’ SMART Interconnect solutions in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately-held company funded by Cadence Design Systems, Toshiba Corporation, Samsung Ventures and venture capital firms Investar Capital, TL Ventures, Smart Technology Ventures, and Easton Hunt Capital, among others. For more information, see www.sonicsinc.com.