TSMC Launches Unified Interconnect Modeling Format for Advanced Process Technologies

New iRCX Format Ensure Data Accuracy and Enables Extensive EDA Support of Interconnect Modeling Related Applications in TSMC 65nm and 40nm

HSINCHU, Taiwan -- May 27, 2009 -- Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330, NYSE: TSM) today unveiled iRCX, an interoperable electronic design automation (EDA) data format, for TSMC 65 nanometer (nm) and 40nm technologies.

iRCX format unifies interconnect modeling data delivery, ensures data integrity and interpretation. EDA tools which support iRCX format will be able to receive accurate interconnect modeling data from the iRCX files developed and supported by TSMC. Interconnect related EDA applications, including place & route, RC extraction, electromigration analysis, power integrity analysis, and electromagnetic simulation are to benefit from iRCX. iRCX is the first of several interoperable EDA interface formats co-developed between TSMC and its design tool partners as part of the TSMC Open Innovation Platform(TM) (OIP).

Interconnect modeling data is getting more important as chip designs in advanced technologies require detailed views of the parasitic effects for accurate evaluation of chip performance and power consumption. TSMC collaborates extensively with EDA ecosystem partners in the iRCX initiative, defines the unified format based on TSMC process requirements, works with EDA partners to implement the new format support in the tools, and closes the loop by qualifying tool accuracy against actual silicon measurements, eliminating data inconsistency, reducing customer tool evaluation time and improving design accuracy. The qualification result is to be found in TSMC EDA qualification program on TSMC-Online, the company's customer portal. Multiple EDA companies are participating in the qualification program.

"TSMC is the first foundry to collaborate with multiple EDA vendors to create and qualify an interoperable interconnect modeling format that optimizes data delivery and interpretation between interconnect extraction, modeling and analysis tools and advanced process technologies," said Shauh-Teh Juang, senior director, Design Infrastructure Marketing at TSMC. "iRCX is part of the TSMC Open Innovation Platform that includes the Active Accuracy Assurance Initiative. This new unified EDA data format provides designers the ability to select qualified EDA tools to match their design needs, improve compliance with TSMC processes, and ensure design accuracy for first time silicon success."

About TSMC Active Accuracy Assurance Initiative (AAA)

TSMC's AAA initiative is a broad-based program that encompasses all design ecosystem components. It provides accurate standards for all TSMC partners, EDA vendors, IP providers, library developers, and Design Center Alliance (DCA) members. The standards apply to tools, building blocks, and technologies, including TSMC Reference Flow 9.0, design for manufacturing (DFM) tools, process design kits (PDK), design support and backend services.

About TSMC Open Innovation Platform

The TSMC Open Innovation Platform promotes timeliness-driven innovation amongst the semiconductor design community, its ecosystem partners and TSMC's IP, design implementation and DFM capabilities, process technology and backend services. The Open Innovation Platform(TM) includes a set of ecosystem interfaces and collaborative components initiated and supported by TSMC that efficiently empowers innovation throughout the supply chain and enables the creation and sharing of newly created revenue and profitability. TSMC's AAA initiative is a critical part of the Open Innovation Platform(TM), providing the accuracy and quality required by ecosystem interfaces and collaborative components.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry's largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company's total managed capacity in 2008 exceeded 9 million 8-inch equivalent wafers, including capacity from two advanced 12-inch - GigaFabs(TM), four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.