eASIC Slashes Power with Low Voltage Devices

New Devices Reduce Power Consumption up to 40%

Santa Clara, CA – January 22, 2010 – eASIC Corporation, today announced the immediate availability of two new lower power device options for its eASIC Nextreme Family. The NX750LP and NX750 Nextreme devices are now available with operating voltage down to 1.0V thereby enabling designers to achieve up to 40% lower power consumption. The new 1.0V device options are optimized for applications that require low cost and low power such as smart meters, portable projectors, toys, and handheld medical devices.

eASIC’s Nextreme family is an excellent alternative to standard cell ASIC designs as it provides significantly lower up-front development cost and risk. In addition, eASIC Nextreme provides a lower cost and lower power solution to costly and power hungry FPGAs. The addition of 1.0V device options now enhance the designer’s ability to meet ever shrinking power budgets, achieve longer battery life of their equipment by reducing both static and dynamic power consumption.

“The design wins we are having with these 1.0V devices are giving our customers a market advantage through benefiting from both low cost and low power,” said Jasbinder Bhoot, Vice President of Worldwide Marketing at eASIC Corporation. “We are particularly seeing increased adoption in high volume, hand-held, battery operated applications where we have traditionally not focused,” added Bhoot.

The NX750LP and NX750 low core voltage device options are ideal for designs that require up to 55K Logic Cells (approximately 750K Gates). These devices are available as part of the low cost ASIC-in-a-Box design kits that enable designs to be implemented in as little as 4 weeks.

Pricing and Availability

The 1.0V Nextreme Devices are available now from eASIC. Pricing starts at $3.95 in high volume. Learn more at www.easic.com.

About eASIC

eASIC is a fabless semiconductor company offering breakthrough NEW ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Advanced Equities Incorporated and Evergreen Partners. For more information on eASIC please visit www.eASIC.com