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Dolphin Integration announces the availability of the HD-LP Panoply at 130 nm for reducing SoC area up to 20%Meylan, France – July 23, 2010. The release of this High Density and Low Power optimized Panoply of Silicon IPs is a windfall for Designers to improve the area of their SoCs up to 20% for the whole of logic with:
To increase or just maintain their strength on the market, manufacturers of high density consumer and nomad devices must regularly offer more features to their end-users while offering competitive pricing. Because of this trend, finding the best compromise between low power and cost reduction is a significant challenge for Designers. The HD-LP Panoply maximizes the RoI of any density and power optimized design:
Check up by yourself the performances of the HD-LP Panoply on your design:
Contact us to take advantage of our suggested Application Schematics, Prescriptions and Consistency of Products for a power and density-optimized architecture: ragtime@dolphin.fr About Dolphin Integration Dolphin Integration is up to their charter as the most adaptive and lasting creator in the Microelectronics Design Industry to "enable mixed signal Systems-on-Chip". It stars a quality management stimulating reactivity for innovation as well as independence and partnerships with Foundries. Their current mission is to supply worldwide customers with fault-free, high-yield and reliable sets of CMOS Virtual Components. The strategy is to follow product launches with evolutions addressing future needs, emphasizing resilience to noise and drastic reductions of power-consumption at SoC level, thanks to their own missing EDA solutions enabling Integration Hardware Modeling (IHM) and Application Hardware Modeling (AHM) as well as early Power and Noise assessment, plus engineering assistance for Risk Control. For more information about Dolphin, visit: www.dolphin.fr/sesame
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