Intel confirms 450-mm fab plans

Mark LaPedus, EETimes
12/8/2010 3:13 PM EST

SAN FRANCISCO - Amid a flurry of speculation, Intel Corp. confirmed that its new fab in the United States is being constructed for the 450-mm wafer era.  As reported, Intel will build a new R&D wafer fab in Hillsboro, Ore., and upgrade other existing U.S. facilities for 22-nm production at a total investment of between $6 billion and $8 billion.

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